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Microtechnology

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(A) ETCHED INTERCONNECT PATTERN ON EPOXY LAMINATE BASE BOARD

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(B) MICRODISCRETE ACTIVE AND PASSIVE COMPONENTS ASSEMBLED ON BASE BOARD
(C) GOLD-PLATED BRASS HOUSING
(D) FULLY ASSEMBLED AMPLIFIER WITH INPUT B OUTPUT CONNECTION PINS

Figure 8. Three-stage wide-band micropower IF amplifier (150 MHz).

During the first year the efforts of the program were devoted to designing and fabricating two representative circuits, a radio-frequency amplifier and a digital logic function. In the amplifier a reduction in power drain of two orders of magnitude as compared to the best available commercial circuit was achieved, and size was also reduced by a factor of 100. The curve in Figure 7 shows its gain of 11 decibels, almost flat over 16 megahertz (thousand kilocycles per second), with a power input of 100 microwatts.
An equally impressive improvement was made in the digital circuit, whose power drain was reduced by a factor of 1000. Thus after a year's effort the power reduction achieved was at least 100-fold while other parameters of both circuits were maintained at the original level or improved. These accomplishments rested on careful and clever circuit design and utilization of the new micropower transistor family. The prospect of further advances along these lines continued to be extremely good when the first year's program was assessed at its conclusion.
The next logical step was to push on to more complicated circuits and subsystems, and the results were again highly favorable. The goals were accordingly expanded to include all the basic building blocks of radio receivers and transmitters. Figure 8 shows the fabrication details of a micropower intermediate-frequency amplifier, the
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Posted: May 08, 2007 08:19 AM
Last Updated: Aug 05, 2011 01:01 PM