REPACKAGING OF DIGITAL DISPLAY UNIT, DR-1
Document Type:
Collection:
Document Number (FOIA) /ESDN (CREST):
CIA-RDP78-03330A004100010001-0
Release Decision:
RIPPUB
Original Classification:
C
Document Page Count:
10
Document Creation Date:
December 22, 2016
Document Release Date:
February 8, 2012
Sequence Number:
1
Case Number:
Publication Date:
March 1, 1962
Content Type:
MISC
File:
Attachment | Size |
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Body:
25X1
Declassified in Part -Sanitized Copy Approved for Release 2012/02/08 :CIA-RDP78-03330A004100010001-0
Declassified in Part -Sanitized Copy Approved for Release 2012/02/08 :CIA-RDP78-03330A004100010001-0
Declassified in Part -Sanitized Copy Approved for Release 2012/02/08 :CIA-RDP78-03330A004100010001-0
Repackaging o
Digital Display Unit, DR-1
Published March 1962
Copy No.
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Declassified in Part -Sanitized Copy Approved for Release 2012/02/08 :CIA-RDP78-03330A004100010001-0
Declassified in Part -Sanitized Copy Approved for Release 2012/02/08 :CIA-RDP78-03330A004100010001-0
Discussion
This portion of the Digital Display Unit, DR-1~ proposal contains technical discussion on
research and development for repackaging of internal portions of the DR-1 Unit.
Very little extra effort will be required to modify the internal arrangement of the modules
and to completely layout a printed circuit "master board" in order to provide for a more
convenient means to service this unit. 25X1
has built many systems using the high density packaging techniques
suggested in this proposal . Some of the modules which show even higher component
densities than those required for the Digital Display Unit are illustrated in Figure 1.
The facts which follow?pertain to the re-layout required on the Digital Readout Unit
in order to make it more serviceable.
will modify the internal structure of the DR-1 by 25X1
utilizing a master printed circuit board on which each of the small modules,
altered by providing pin-connectors and encapulating, will be mounted.
2. The master printed circuit board will have in the order of 100 positions for in-
sertion of all 16 modules.
3. Tentatively, each module will be an encapulated "throw-away" type.
4. Since there are only in the order of ten connections required from the master
printed circuit board to the readout lights battery and ON-OFF control in the
front, this can be a miniature connector which has wel I known, proven, pro-
perties like either the Methode or the Elco Models.
5. The smaller modules will have no more than 9 pins to mate to master printed
circuit board.
Declassified in Part -Sanitized Copy Approved for Release 2012/02/08 :CIA-RDP78-03330A004100010001-0
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Figure 1 . Examples of High Density Modules
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6. The larger modules will have no more than 15 pins to mate to master printed
circuit board.
7a A jig to test each of the smaller modules and each of the larger modules will be
fabricated early in the first phase of this program in order to quickly check
modules on the production line.
Whetheror not the modules used in the Digi tal Display Unitwi I I be encapulated wi I I depend upon
whether or not each of the 16 modules will be classified as "throw-away" modules in the
field. With the new layout suggested below, these modules can be removed and tested
just like testing a vacuum tube in a tester. The symptoms which show a malfunction in
the field will suggest which module is at fault. The process of substituting a new module
for the bad one can be used and will take in the order of one minute. The encapulated
"throw-away" modules may be carried as spares. It should be noted that fihe modules
cannot be encapulated if they are to be repaired in the field. Of course, if encapulation
is not allowed, this will limit the ruggedness of the entire readout unit.
Since the modules in production quantities of 1000 will cost only about twenty-five dollars
when encapulated, it is believed by that the encapulated modules
will definitely be the most reliable, convenient construction. Needless to say, it would
cost very close to the modular unit cost to service the unit. This service cost will be
relatively high for two reasons:
1. The service depots where technicians or engineers can replace bad components
in the various modules may not be so convenient, consequently, there will
likely be costly shipping and handling costs.
2. The average life time of these units will be long; consequently, the modules
which become non-functional will be very few within a period of one year
(less than 1 per cent are expected to cause trouble within any one-year period
when used continuously).
Very little re-layout of components inside the module is expected, since, the existing
units can be used,but with minor modifications to adapt to the pin connection suggested
below.
The cost represented in this proposal includes the labor for new layout designs along with
the proper drafting documentation and a revised technical manual.
Declassified in Part -Sanitized Copy Approved for Release 2012/02/08 :CIA-RDP78-03330A004100010001-0
Declassified in Part -Sanitized Copy Approved for Release 2012/02/08 :CIA-RDP78-03330A004100010001-0
The picture story of the assembling of major portions of the Digital Display Unit is sketched
in Figures 2 through 5.
Note that a representative master board layout has already been designed. This can be
modified as required and checked out for the final printed circuit boards within a week's
time.
believes that the best method of solving the servicability problem 25X1
is that of using a printed circuit master board. This master board consists of two layers
of 1/16 in. (double-clad) epoxy in order to provide for three layers of printed circuitry
which from calculations. is required to interconnect the 16 modules and to connect to .the
external portion of the Digital Display Unit for the visual read out.
As illustrated in Figure 6, this master board overlay of printed circuits will take all of the
pins of all 16 modules. The printed circuits will be in three parts. The first layout will
be called the top printed circuit; the second, the middle printed circuit; and the third
will be the bottom printed circuit. Each pin on the various modules will make good
electrical contact to all three layers of printed circuits. The small pins, as noted on the
modules in Figures 2 and 3, will be making electrical contact with plated through holes
in this master board. As noted in Figure 4, the modules will be inserted onto the master
board consecutively. Modules are identified as follows:
Module 1 -Limiter
Module 2 -FilterAmplifier No. 1
Module 3 -Bridges
Module 4 -FilterAmplifier No. 2
Module 5 -Detector Schmitt No. 1
Module 6 -Detector Schmitt No. 2
Module 7 - 64 Bistable
Module 8 - B3 Bistable
Module 9 - B2 Bistable
Module 10 - B1 Bistable
Module 11 -Readout Bistable
Module 12 -Reset Monostable
Module 13 -Lamp Control
Module 14 -Lamps No. 1, No. 2, and No. 3 Gate
Declassified in Part -Sanitized Copy Approved for Release 2012/02/08 :CIA-RDP78-03330A004100010001-0
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0 0 0
_ UP TO NINE PINS
+
ApP'?"~.t
o o ~
ON CASE SIZE 1
~
FIGURE 2. SMALL MODULE CONSTRUCTION
0 0 0 0 0
0 0 0 0 0
0 0 0 0 0
~- UP TO FIFTEEN PINS
? ON CASE SIZE 2
FIGURE 3. LARGE MODULE CONSTRUCTION
FIGURE 4. MODULES ON MASTER BOARD
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BOTTOM PRINTED CIRCUIT
FIGURE 5. DETAILS OF MASTER BOARD
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~~
FI
`?""`
CON
pENTDQ
CONFlDEN7U11
Figure 6. Printed Circuits
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Module 15 -Lamps No. 4, No. 5, and No. b Gate
Module 16 -Lamps No. 7, No. 8, No. 9, and No. 10 Gate
As noted from the figures indicated above, the modified digital readout unit is quite
servicable. Any module can be disengaged and a substitute module inserted within a few
seconds.
Conclusion
A few concluding remarks will clarify some additional stipulations of this proposal:
1. The master board layouts presented incorporates facts that were available from
information as disclosed in the request to bid. There existed several minor
points which were not explained or clarified. These are minor though and can
be resolved immediately afte is able to scrutinize the25X1
prototype Digital Display Unit more closely.
2. The material for the 100 Digital Display Units, DR-1, will be ordered the first
week after award of contract. In other words, the ordering of materials will
not be done piecemeal (the material for five units required in Phase I and for
the 95 units required in Phase II will be ordered immediately after award of
contract).
3. It is assumed that at least two Digital Display Unit prototypes will be supplied
GFE for the duration of the contract (six months).
4. It is assumed that at least one Transmission Adapter Unit will be supplied GFE
in order to test the Digital Display Units for functional acceptance.
5. The first five Digital Display Units will be fabricated under engineering sur-
veilance in our Digital Systems Department and released for acceptance to .the
Government within the~first three months period after award of contract. After
acceptance, the remaining 95 units will be fabricated, tested, and delivered
within the next three months. Consequently,
posing a six month program to manufacture 100 Digital Display Units.
Declassified in Part -Sanitized Copy Approved for Release 2012/02/08 :CIA-RDP78-03330A004100010001-0