PROPOSAL FOR PRELIMINARY DEVELOPMENT AND FABRICATION OF CHIP CUTTER-VIEWER IN ACCORDANCE WITH SPEC. #101 DATED MARCH 26, 1963 AND PROPOSED SPECIFICATION FOR CHIP CUTTER-VIEWER (Sanitized) DATED JUNE 10, 1963

Document Type: 
Document Number (FOIA) /ESDN (CREST): 
CIA-RDP78B04747A000900160024-0
Release Decision: 
RIPPUB
Original Classification: 
K
Document Page Count: 
2
Document Creation Date: 
December 28, 2016
Document Release Date: 
May 6, 2003
Sequence Number: 
24
Case Number: 
Publication Date: 
June 10, 1963
Content Type: 
LETTER
File: 
AttachmentSize
PDF icon CIA-RDP78B04747A000900160024-0.pdf182.75 KB
Body: 
U. S. Government Washington, D. C. June 109 1963 STATINTL ATT: STATINTL SUBJECT: Proposal for preliminary development and fabrication of Chip Cutter-Viewer in accordance with Spec. #101 dated March 26, 1963 and proposed Specification for Chip Cutter-Viewer dato"'STATI NTL June 10, 1963 Gentlemen: We are pleased to submit our proposal to perform preliminary development and fabrication of a Chip Cutter-Viewer unit as described in the referenced sspeoi- fioations. The scope of the proposed work is to be limited to proving the feasibility of the cutter head mechanism the azimuth setting and adjustment; evaluation of die design and materials and some aspects of the film handling problem. It is not the Intent of this proposal to furnish a finished piece of equipment, but rather to provide the basis for a sound design for equipment to be proposed subsequent to successful completion of these studios. The unit proposed would include the male and female- die sections mounted on a suitable tram having 12" minimum depth of throat from the centerline of the die, and having contained the azimuth indexing and looking means. The proposed unit would have manual actuating means for cutting chips from test films and elementary means for illumination of the ship area and removal of the chip from the die. This unit would provide the basis for evaluation of future design proposals and lead to solutions for the primary problems of the final design. We ettimete the cost for this work, performed under the terms and eonditions of Approved For Release 2003/05/15 : CIA-RDP78BO4747A000900160024-0 d In 12 weeks from date of rust the above information is setisfnctory^. If further information I STATINTL equtred, please advise. Declass Review by NIMA/DOD Approved For Release 2003/05/15 : CIA- DP78B04747A000900160024-0 Approved For Release 2003/05/15 : CIA-RDP78BO4747A000900160024-0 1U, 1963 POSED SPECZ! customer pecif >gl design and fabricate the Chip $101, dated March 26, 1963 except as 1. No change 2.6.1 No change 1. No change 2.6.2 No change 1.2 No thong* 2.6.2.1 See 2.6.2.1 below 1. No change 2.6.2.2 See 2.6.2.2 below 2. No change 2.6.2.2 Sea 2.6.2.3 below 2.1 No change 2.2 No 'change 2.3 No change 2.4 No change 2.5 No *bongo 2,6 No *bongo 2.ho2.I pie cw it uminelFie i e 1~ The on above the film plane.: The male section of the 2.6.3. a SUR BO$OO Tito support base shall be of t - rill be actuated by a manually operated bell screw nism. The chip will be pushed upward through the die and can be removed from the die with a vacuum wand eotor. A lamp will be provided in the male die to support the antire tatter-vie r assembly. Its hall be such as to provide a working height framing and azimuth poalti 2.6.3 No change 2.6.3.1 No change 2.6.2.2 No change the target stage to aid in accurate location of the :ion of the die will be located in the upper arm will be located in the. lever arm below the film plane provide suffls.idnt illumination to permit inspection of the chip location prior to cutting if desired.. The primary positioning of the film In the dies will be controlled by the index movement from the target stage to the dies. 2.6.2.4 Soo 2.6.2.2 below 2.6.2.2 !i, a,nt#~!r. A 2X magnifier is to be provided on an arm over bass itable casters with wheel and swivel casters for stabilizing the cutter- Approved F2r ea p 4"J/15 : Cla;FjDFjy'4?R A000 %194031,4h2,s 4. No change 3. No change 3.2 No change 3.4 No change he top surface of the light table. The support lack on at lean. it