(Sanitized)TECHNICAL REPORT 1204-1002 PRE-LIFE TEST SEQUENCE FOR FLPA 200 UNITS

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Document Number (FOIA) /ESDN (CREST): 
CIA-RDP78B04747A001600010093-2
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RIPPUB
Original Classification: 
K
Document Page Count: 
28
Document Creation Date: 
December 28, 2016
Document Release Date: 
March 1, 2000
Sequence Number: 
93
Case Number: 
Publication Date: 
April 16, 1965
Content Type: 
REPORT
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PDF icon CIA-RDP78B04747A001600010093-2.pdf1.21 MB
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Approved For Relde 2001/08/21: CIA-RDP78B04747AO0'1001009~ T 7 W.O. 1204 16 April 1965 Pre Life Test Sequence For FLPA-200 Units Technical Report 1204-1002 L J Approved For Release 2001/08/21 : CIA-RDP78B04747A001600010093-2 Approved For ReleW 2001/08/21 : CIA-RDP78BO4747A00 0010093-2 T'2C?-7.NICAL REPORT 1201--1002 16 April 1965 Compiled by:_ This technical report indicates the procedure for processing the FLPA 200 (FSDS Dwg. No. RDP-10. 032) on arrival from the manufacturer through all steps necessary for completion of the desired test series as indicated on Figure 1. 1.0 RECEIPT OF UNIT Upon receipt of the FLPA-200 from 1. Remove from box - saving screws, padding, box, etc. 2. Perform a visual checkout and report unit faults to engineer. 3. Give enclosed test spectroscopic plate to the engineer. WARNING: AT ALL TIMES WHEN THE FLPA-200 UNIT IS NOT RECORDING ON FILM, IT MUST BE'MOUNTED WITHIN THE PLASTIC PROTECTIVE CASE. Approved For Release 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 Approved For Rele 2001/08/21 : CIA-RDP78BO4747A00 0010093-2 1.1 PREC.AUSTIONS APPLICABLE TO THE FLPA-200 Drawing RDP-10. 032A) 1) MOUNTING SCREWS TO USE NO MORE THAN 0. 125" PROTRUSION INTO BASE. (BASE IS COPPER TELLURIUM). 2) USE ONLY VERTICAL LOADING ON MYLAR. WINDOW - I. E. COME STRAIGHT DOWN ON WINDOW. 3) 3 MIL THICK MYLAR WINDOW IS CEMENTED TO FRAME BY HEAT AND FORCE. - AVOID USE OF SOLVENTS OF CEMENT TO CLEAN WINDOW - AVOID USE OF HOT TEMPERATURE SUCH AS HEAT GUN. 4) LIMITS ON THE ALLOWABLE EXPOSURE LEVEL ARE ILLUSTRATED IN ATTACHED FIGURE 10. 2.0 CONNECTOR POTTING Using the available breadboard mold, remove the black plastic connector assembly case and pot the back of the connector assembly. 1. Cover up the electrical contacts of the connector with masking tape to prevent potting ca-arLpour fouling contacts. 2. Carefully tape plastic pieces to connector base forming potting boot. 3. Insert plastic tubing to allow continued access to the hold down screw slot from the back of the assembly. Approved For Release 2001/08/21 2EIA-RDP78B04747A001600010b93-2 Approved For Rele 2001/08/21 : CIA-RDP78B04747A0G 0010693-2 ''. Mount on plywood board as illustrated in Figure 2. 5. Fill with potting mixture. Use Hysol silicone RTV as potting com- pound and Hysol RTV G192C as catalyst. The compod cure re- quires 8 hours at room temperature. It is desirable that this be performed at the end of the day, overnight, so that it will be ready to operate the next working day. 6. Remove and save plastic pieces. Trim corners with razor blade. 3. 0 HEAD SHIMMING 3.1 HEAD SHIMMING BY OPTICAL MEASUREMENTS (This proved to be too inaccurate to use and this step was deleted for the majoritjr of heads). General: Using a Bausch and Lomb Optical Focusing Microscope, focus first on the FLPA-200 record surfaces above each of the 4 corners of the silicon chip. Then note the differential reading to adjust the focus to the surface of the silicon chip. This represents the optical path length within the record head.- Detail: The measurement procedure will be given in more detail. a. Remove head (from plastic box and save box and screws etc. b. Mount: head on Film Handling Fixture (1089F14). Remove knurled knob and the angled mounting block from table. Attach -- Approved For Release 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 Approved For Rele 2001/08/21 : CIA-RDP78BO4747A0 0010093-2 head to mounting block with 2 screws. These screws must not intrude into the head more than 1/1611 otherwise serious damage may result. (See Figures 3, 4, and 5). Due to the slop in the two screwholes in the mounting angle, some way must be devised to be sure that the head is exactly parallel to table. In one plane there is limited control, but in the other plane, there is complete control. it is important that this control be used to get nearly perfect parallellism. Mount the head assembly on tape omitting the horseshoe spacer so that the two mounting screws are accessible. Work the head up by turning the knurled knob until the edge at the I'D head is almost as high as the edge at the table. Sight along the two edges and adjust by loosening screws and retightening until the edges are parallel. This is a hit or miss method, but a high degree of accuracy can be obtained by careful adjustment. Insert one of the spacers and turn knurled knob tip tight. c. Make ink marks on mylar surface. Focus an ink mark on mounting side and record the reading. Move over to the other ink mark and repeat process. Next focus on rco,'g surface at mounting side and at far side, record the readings. (See Figure 6 and 7). Approved For Release 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 Approved For Rele a 2001/08/21 : CIA-RDP78B04747A004AO0010093-2 d. If it is found that the myla% surface is not parallel to the recording surface by . 001 or more, the difference must be made up with an appropriate shim. See Fig. -S. 3.2 HEAD SHIMMING BY FILM EXPOSURE (Run 1 through 3 on Figure 1) The detail procedure to expose film with the FLPA-200 using the Film Handling Fixture and the Test Set is given in_ Technical Reports 1204-1003 and 1204-1004. Adjust the SLP test set controls to yield an exposure of 60 milliamperes for 0. 75 milliseconds, and turn off the lights. Use the Static Master Brush (Nuclear Products Inc.`, 10173 East Rush Street, P. O. Box 649, El Monte, California) to remove dust from vacuum platen. Apply live Plus X (ASA 8.0) film toihe vacuum platen with the emulsion side facing out. Brush the dust off the film emulsion, Apply the FLPA 200 to the film and make 3 separate exposures on tr: i film. For each exposure, press the SLP test set -~et" button. Repeat II the process two times with an 1 mil shim on first ore end and then the other end of the F LPA-200 record surface. Apply the step wedge to the emulsion side of the film using the EG and G Mark VI Sensitometer using 1.83 neutral density filter in the trans- mission path. Process the film using D-19 developer whose tempera- ture is 68 :L 1 *F for developin time of 5 minutes. -5- Approved For Release 2001/08/21 : CIA-RDP78B04747A001600010093-2 Approved For ReleftO 2001/08/21 : CIA-RDP78BO4747A00 0010 93-2 3. 3 Slide Preparation Prepare the recorded Code Matrix Blocks for microdensitometer measurements by mounting as shown in Figure 9. Don't use taping between the glass plates. 3.4 Microdensitometery (Runs 1 through 3 per Figure 1) Use the Ansco Model 4A Microdensitometer to scan columns one and six, each of 32 dots. Use the 25 micron aperature and a recording scale factor of 2 inch equal to 1 millimeter scan head travel. Use Macbeth Ansco Densitometer (1232-87) or equivalent to measure the density of the steps of the step wedge. 3. 5 Data evaluation Note the shim arrangement that yielded equal dot peak density along the column length. It indicates the nonalignment present in each record head and in future runs one can obtain coplanarity between film etnulsioii c : and plane of light emitting sources. Dot diameter and peak density are a measure of the optical transmission path length from the Record Head emitting surface to the film '.'and can be used to insure that optical measurements were correct. ~? . 0 Data Runs (Runs 5 through 59 per Figure 1) After the necessary shimming for t .-.e individual Record Head is known, the test sequence ( .. osuo e 5 through 59) outlined in Figure 1 is performed. Approved For Release 2001/08/21 : CIA-RDP78B04747A0016000100,93-2 Approved For Release 2001/08/21 : CIA-RDP78B04747A001,600014093-2 Tri X Aerecon type 8403 (ASA200). Three types of film are to be used: High EK 4404 (ASA 1.6), Plus X Aerecon Type All physically possible optical transmission paths Definition Aerial Film 5401 (ASA510), and of 6, 7, 9 and 11 mils from record surface to film emulsion will be used for each Record Head as indicated in the particular exposure. On each an-notated piece of film a step wedge must be recorded using the Edgerton Germeshausen and Grier Mark VI Sensitometer using 10_3 second Exposure and the appropriate neutral density filter in the transmission path. ASA 1. 6 .79 neutral density filter ASA 80 . 79 n. d. + 1.04 n. d. filter ASA 200 . 79 n. d. +1.04 n. d. filter The vacuum platen and vacuum system will be used to hold the film flat. Use the Static Master Brush on the platen and film to eliminate dust from each new strip of film. . 1 Detailed Procedure (Suggested Optimum Test Sequence) 4. 1. 1 To Expose ASA 1.6 Film a. Adjust the SLP Test Set (1089F23) exposure control switches to the following: - Technical Report 1204-1006) Approved For Release 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 Approved For Rse 2001/08/21 : CIA-RDP78B04747AQ4600010093-2 Pulse Width Control Position Milliseconds Position l 12 1. Current Level Control ;a6 4 80 b. Use the Test Set _ Technical Report 1204-1003) and the Film Handling Fixture M Technical Report 1204-1004) to aid in exposing the film. The supply of ASA 1. 6 was 35mm film. c. Expose step wedge to the emulsion side. Use only 0. 79 Neutral Density filter. d. Make the following sequence of exposures-on the emulsion side. FRAME TIME CURRENT PULSE WIDTH CURRENT LEVEL NO. MS MA Switch Posit ion Switch Position 26 48 20 3 2 27 48 40 (3X) 3 3 36 12 40 (2X) 1 3 37 24 40 39 96 20 (2X) 48 12 80 51 96 10 4? Approved For Release 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 Approved For Re a 2001/08/21 : CIA-RDP78BO4747AO 00010093-2 Note 1: Try to remember all the switch positions so the entire test can be without turning on lights. If it is necessary to use lights first notch the i film at the place where you stopped - can the film '- lights on - lights off and resume test after the notch. Be sure to proceed in the proper direction and don't re-expose what is already done. C. Process the film using D19 developer which is at 68? farenheit. The developing time should be 5 minutes. 4.1.2 To Expose ASA 80 Plus X Film a. Reset the SLP Test Set for the following: M Technical Report 1204-1006) PULSE WIDTH Switch P i i CURRENT LEVEL os t on Milliseconds Switch Position Milliamperes-,- I 0. 375 1 5 2 0.7.5, 2 10 3 1.5 3 20 3.0 4., . 0 5 o 80 b. See Step 4. 1. lb. The guppy of Plus X ASA 80 film is 5 inch perforated film. c. Place the 0. 79 and 1.04 Neutral Density Filter in the EG and G Mari. V1 Sensitometer and expose the step wedge on ApprovedVI46s@'*O148124 X33l*,RDP78B04747A001600010093-2 Approved For Rel 'e 2001/08/21 : CIA-RDP78BO4747A0W00010093-2 d. Make the following exposures on the emulsion side of the film. RA ME TIME. CURRENT PULSE WIDTH CURRENT LEVEL No. MS MA Switch Position Switch Position 28 3 10 4 29 ~.0 3 30 ' 3 4 0 A 3 80 . 4 5 A.0 0.375 40 - 1 4 4.1 0.75 4-0 2 A 42 1.5 ~!0 52 0.375 40 Use the techniques suggested in Note 1 for notching the film if the lights must be turned on. e. Process the film as in Step 4. 1. le 4.1.3 To expose ASA 200 film a. Repeat 4. 1. 2. a b. Repeat 4. 1. 1. b using Tri X film ASA 200;the supply is 70mm perforated film. c. Repeat 4. 1. 2c d. Make the following exposures on the emulsion side of the film. Approved For Release 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 Approved For ReI 2001/08/21 : CIA-RDP78BO4747AO 0010093-2 Ia RAME. NO TIME MS CURRENT 1V:% PULSE WIDTH Switch Position CURRENT LEVEL Switch Position . 32 1.5 10 3 2 33 1.5 20 34 1.5 40 35 1.5 80 3 6 44 0.375 40 1 4 0.75 40 2 4 47 3.0 40 . 4 4 4.9 3.0 4. 1 C. Repeat 4. 1. 1. e 4.1.4 Exposing Film By Changing Distance of Record Head to Film 4. 1. 4. 1 For the remaining exposures use the appropriate switches in the SLP Test Set (1089F23) to turn off the following columns and rows: Colums:. 1, 3, 5, 8, 10 and 12. Rows: 2, 4, 6, 8, 10, 12, and 14. 4. 1. 4-. 2 Shim the head so that the optical distance from the silicon chip to the film emulsion is 0. 007 inches total. Usually, (depending-on the measurements in Section 3. 0) this means applying 2 mil shims to both ends of the recording surface of the head in a manner that will elevate the.head by 0. 002 inches when it is placed on the film while BEING SURE NO TG COVER UP ANY OF THE RECORDING LIGHT Appr ed F r elease 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 Approved For Relate 2001/08/21 : CIA-RDP78B04747A0Q0010093-2 Suitable shirr stock is manufactured by Artus Corporation, Englewood, N.. N.J. !.4. 3 Cut a 3 inch piece of ASA 1. 6 film. Tape, notch, or mark the film so that the start end can always be found. Expose step wedge on the emulsion side of the film. Carefullyapply the -:'EPA record head on the emulsion side of film being careful not to dislodge the shims. Expose film - see table below and then'mark the film with a notch where you stop and put the film in light tight can. 4. 1. 4. 4 Next, cut a piece of ASA 80 film about 20 long and proceed the same way as before. Can the film. 1.4. 5 Next, repeat process with ASA 200 film. Can the film. 4. 1. 4. 6 Turn on lights and add 2 more strips of 2 mil shim on top of the 2 existing shims making a total of 9 mils optical transmission path. Turn off the lights. 4. 1.4. 7 Pick from the can the ASA 1. 6 film and expose as before according to table below, Start past the notch. 4.1.4.8 Repeat with ASA 80 and ASA 200 film and place all 3 films in-the light tight can. 4--. 1. 4. 9 Turn on lights and add 2 more strips of 2 mil shim, now making a total of 11 shims. Expose film as before. 12 Approved For Release. 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 Approved For RelWi a 2001/08/21 : CIA-RDP78B04747AOW0010093-2 FRAME OPTICAL FILM DEPRESS PULSE WIDTH CURRENT LEVEL NO. SPACING TYP E SET BUTTON Switch Position Switch Position inches 8 0.007 ASA 1.6 ZX 5 (48ms) 3(20MA) 14 0. 007 ASA,80 2X 3 (1. 5MS) 4(40MA) 20 0.007 ASA200 2X 2 (0.75MS) 4(40MA) 9 0.009 ASAI..6 2X 5 (-118MS) 4(40MA; 15 0.009 ASA80 2X 3(1.5M8) 5(60MA) 21 0.009 ASA200 2X 2(0. 75MS) 5(60MA) 10 0.011 ASA 1.6 3X 5(48MS) 3 (20MA) 16 0.011 ASA 80 ZX 3(1. 5MS) 6(80MA) 22 0.011 ASA200 2X 2(0.75MS) 6(80MA) 4.1.4.10 Process the films using D-19 developer whose temperature is 68?F and use developing time of 5 minutes. 4. 2 Slide Preparation Prepare the recorded Code Matrix Blocks for microdensitometer measurements by mounting as shown in Figure 9. Don't use tape between the glass plates. 4.3 Microdensitometry In all cases use 25 micron aperature and a recording scale factor of 2 inch equal to 1 millimeter scan head trace. For Exposures 5 through 22 - se the Amoco Model 4A Microden- sitometer to scan Row 10 of Fe;;-u v.atrix Block through ,ApproveglFa 0,PAt)i~( CIA?RDfP78 04747A001600010093-2 Approved For Rele a 2001/08/21 : CIA-RDP78BO4747A00, 0010093-2 For Exposures 24 through 59, use the rnicrodensitometer to scan Row 10 of the Code Matrix.Block through Column positions 7, 3, 9, 10, 11, and 12. For Exposure 25 use the micro- densitometer to scan each column (one through eighteen) through each of the 32 row positions. Use the Macbeth Ansco Densitometer to measure the density of the steps on the step wedge. Approved For Release 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 Approved For Release 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 BEST COPY Available Approved For Release 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 ILLEGIB Approved For Release 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 Next 1 Page(s) In Document Exempt Approved For Release 2001/08/21 : CIA-RDP78BO4747AO01600010093-2 Approved For Rele#42001/08/21: CIA-RDP78BO4747A00 F GuRr 2. SETUP FOR PO o I C JJ*- N C:TO RECORDING SURFACE PR?T CTtt4E MYLAR SURFACE FIGURE 0 t~ ~' _ANGLE -Approved For Release 2001/08/21 CIA-RDP78BO4747AO01600010093-2 Approved For Release 2001/08/21 CIA-RDP78B0474.7A001600010093-2 Approved For Release 2001/08/21: CIA-RDP78BO4747AO01600010093-2 Approved For Rele 2001/08/21 : CIA-RDP78BO4747A00 0010093-2 l RP 1, 7ml Myt- A R SURFACE L'i\coRDiN6 Sct~:,~=d~C~ PAT LEAG7/-1 A EASU,' ME kri Y v O o "s,- i v, FIGURE J NEEb Fb? 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