(Sanitized)TECHNICAL REPORT 1204-1002 PRE-LIFE TEST SEQUENCE FOR FLPA 200 UNITS

• Document Type: CREST
• Collection: NGA Records (Formerly NIMA)
• Document Number (FOIA) /ESDN (CREST): CIA-RDP78B04747A001600010093-2
• Release Decision: RIPPUB
• Original Classification: K
• Document Page Count: 28
• Document Creation Date: December 28, 2016
• Document Release Date: March 1, 2000
• Sequence Number: 93
• Publication Date: April 16, 1965
• Content Type: REPORT

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T 7
W.O. 1204 16 April 1965
Pre Life Test Sequence For FLPA-200 Units
Technical Report 1204-1002
L
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T'2C?-7.NICAL REPORT 1201--1002
16 April 1965
Compiled by:_
This technical report indicates the procedure for processing the FLPA
200 (FSDS Dwg. No. RDP-10. 032) on arrival from the manufacturer through
all steps necessary for completion of the desired test series as indicated on
Figure 1.
1.0 RECEIPT OF UNIT
Upon receipt of the FLPA-200 from
1. Remove from box - saving screws, padding, box, etc.
2. Perform a visual checkout and report unit faults to engineer.
3. Give enclosed test spectroscopic plate to the engineer.
WARNING: AT ALL TIMES WHEN THE FLPA-200 UNIT IS NOT
RECORDING ON FILM, IT MUST BE'MOUNTED WITHIN THE
PLASTIC PROTECTIVE CASE.
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1.1 PREC.AUSTIONS APPLICABLE TO THE FLPA-200
Drawing RDP-10. 032A)
1) MOUNTING SCREWS TO USE NO MORE THAN 0. 125" PROTRUSION
INTO BASE. (BASE IS COPPER TELLURIUM).
2) USE ONLY VERTICAL LOADING ON MYLAR. WINDOW - I. E.
COME STRAIGHT DOWN ON WINDOW.
3) 3 MIL THICK MYLAR WINDOW IS CEMENTED TO FRAME BY HEAT
AND FORCE.
- AVOID USE OF SOLVENTS OF CEMENT TO CLEAN WINDOW
- AVOID USE OF HOT TEMPERATURE SUCH AS HEAT GUN.
4) LIMITS ON THE ALLOWABLE EXPOSURE LEVEL ARE ILLUSTRATED
IN ATTACHED FIGURE 10.
2.0 CONNECTOR POTTING
Using the available breadboard mold, remove the black plastic connector
assembly case and pot the back of the connector assembly.
1. Cover up the electrical contacts of the connector with masking tape
to prevent potting ca-arLpour fouling contacts.
2. Carefully tape plastic pieces to connector base forming potting boot.
3. Insert plastic tubing to allow continued access to the hold down screw
slot from the back of the assembly.
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''. Mount on plywood board as illustrated in Figure 2.
5. Fill with potting mixture. Use Hysol silicone RTV as potting com-
pound and Hysol RTV G192C as catalyst. The compod cure re-
quires 8 hours at room temperature. It is desirable that this be
performed at the end of the day, overnight, so that it will be ready
to operate the next working day.
6. Remove and save plastic pieces. Trim corners with razor blade.
3. 0 HEAD SHIMMING
3.1 HEAD SHIMMING BY OPTICAL MEASUREMENTS (This proved to be
too inaccurate to use and this step was deleted for the majoritjr of heads).
General:
Using a Bausch and Lomb Optical Focusing Microscope, focus first
on the FLPA-200 record surfaces above each of the 4 corners of the
silicon chip. Then note the differential reading to adjust the focus to
the surface of the silicon chip. This represents the optical path length
within the record head.-
Detail: The measurement procedure will be given in more detail.
a. Remove head (from plastic box and save box and screws etc.
b. Mount: head on Film Handling Fixture (1089F14). Remove
knurled knob and the angled mounting block from table. Attach
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head to mounting block with 2 screws. These screws must not
intrude into the head more than 1/1611 otherwise serious damage
may result. (See Figures 3, 4, and 5).
Due to the slop in the two screwholes in the mounting angle, some way
must be devised to be sure that the head is exactly parallel to table.
In one plane there is limited control, but in the other plane, there is
complete control. it is important that this control be used to get
nearly perfect parallellism. Mount the head assembly on tape omitting
the horseshoe spacer so that the two mounting screws are accessible.
Work the head up by turning the knurled knob until the edge at the I'D
head is almost as high as the edge at the table. Sight along the two
edges and adjust by loosening screws and retightening until the edges
are parallel. This is a hit or miss method, but a high degree of
accuracy can be obtained by careful adjustment. Insert one of the
spacers and turn knurled knob tip tight.
c. Make ink marks on mylar surface. Focus an ink mark on mounting
side and record the reading. Move over to the other ink mark and
repeat process. Next focus on rco,'g surface at mounting side and
at far side, record the readings. (See Figure 6 and 7).
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d. If it is found that the myla% surface is not parallel to the recording
surface by . 001 or more, the difference must be made up with an
appropriate shim. See Fig. -S.
3.2 HEAD SHIMMING BY FILM EXPOSURE (Run 1 through 3 on Figure 1)
The detail procedure to expose film with the FLPA-200 using the Film
Handling Fixture and the Test Set is given in_ Technical Reports
1204-1003 and 1204-1004.
Adjust the SLP test set controls to yield an exposure of 60 milliamperes
for 0. 75 milliseconds, and turn off the lights.
Use the Static Master Brush (Nuclear Products Inc.`, 10173 East Rush
Street, P. O. Box 649, El Monte, California) to remove dust from
vacuum platen. Apply live Plus X (ASA 8.0) film toihe vacuum platen
with the emulsion side facing out. Brush the dust off the film emulsion,
Apply the FLPA 200 to the film and make 3 separate exposures on tr:
i
film. For each exposure, press the SLP test set -~et" button. Repeat
II
the process two times with an 1 mil shim on first ore end and then the
other end of the F LPA-200 record surface.
Apply the step wedge to the emulsion side of the film using the EG and
G Mark VI Sensitometer using 1.83 neutral density filter in the trans-
mission path. Process the film using D-19 developer whose tempera-
ture is 68 :L 1 *F for developin time of 5 minutes.
-5-
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3. 3 Slide Preparation
Prepare the recorded Code Matrix Blocks for microdensitometer
measurements by mounting as shown in Figure 9. Don't use taping
between the glass plates.
3.4 Microdensitometery (Runs 1 through 3 per Figure 1)
Use the Ansco Model 4A Microdensitometer to scan columns one and
six, each of 32 dots. Use the 25 micron aperature and a recording
scale factor of 2 inch equal to 1 millimeter scan head travel.
Use Macbeth Ansco Densitometer (1232-87) or equivalent to measure
the density of the steps of the step wedge.
3. 5 Data evaluation
Note the shim arrangement that yielded equal dot peak density along
the column length. It indicates the nonalignment present in each
record head and in future runs one can obtain coplanarity between
film etnulsioii c : and plane of light emitting sources.
Dot diameter and peak density are a measure of the optical transmission
path length from the Record Head emitting surface to the film '.'and
can be used to insure that optical measurements were correct.
~? . 0 Data Runs (Runs 5 through 59 per Figure 1)
After the necessary shimming for t .-.e individual Record Head is known,
the test sequence ( .. osuo e 5 through 59) outlined in Figure 1 is performed.
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Tri X Aerecon type 8403 (ASA200).
Three types of film are to be used: High
EK 4404 (ASA 1.6), Plus X Aerecon Type
All physically possible optical transmission paths
Definition Aerial Film
5401 (ASA510), and
of 6, 7, 9 and
11 mils from record surface to film emulsion will be used for each
Record Head as indicated in the particular exposure.
On each an-notated piece of film a step wedge must be recorded
using the Edgerton Germeshausen and Grier Mark VI Sensitometer
using 10_3 second Exposure and the appropriate neutral density
filter in the transmission path.
ASA 1. 6 .79 neutral density filter
ASA 80 . 79 n. d. + 1.04 n. d. filter
ASA 200 . 79 n. d. +1.04 n. d. filter
The vacuum platen and vacuum system will be used to hold the
film flat. Use the Static Master Brush on the platen and film
to eliminate dust from each new strip of film.
. 1 Detailed Procedure (Suggested Optimum Test Sequence)
4. 1. 1 To Expose ASA 1.6 Film
a. Adjust the SLP Test Set (1089F23) exposure control switches
to the following: - Technical Report 1204-1006)
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Pulse Width Control
Position Milliseconds Position
l 12 1.
Current Level Control
;a6 4 80
b. Use the Test Set _ Technical Report 1204-1003) and the
Film Handling Fixture M Technical Report 1204-1004) to
aid in exposing the film. The supply of ASA 1. 6 was 35mm film.
c. Expose step wedge to the emulsion side. Use only 0. 79 Neutral
Density filter.
d. Make the following sequence of exposures-on the emulsion side.
FRAME TIME CURRENT
PULSE WIDTH CURRENT LEVEL
NO.
MS
MA
Switch Posit
ion Switch Position
26
48
20
3
2
27
48
40
(3X)
3
3
36
12
40
(2X)
1
3
37
24
40
39
96
20
(2X)
48
12
80
51
96 10 4?
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Note 1: Try to remember all the switch positions so the entire test can be
without turning on lights. If it is necessary to use lights first notch the
i
film at the place where you stopped - can the film '- lights on - lights off
and resume test after the notch. Be sure to proceed in the proper direction
and don't re-expose what is already done.
C. Process the film using D19 developer which is at 68? farenheit.
The developing time should be 5 minutes.
4.1.2 To Expose ASA 80 Plus X Film
a. Reset the SLP Test Set for the following: M Technical
Report 1204-1006)
PULSE WIDTH
Switch P
i
i
CURRENT LEVEL
os
t
on Milliseconds Switch Position
Milliamperes-,-
I
0. 375
1
5
2
0.7.5,
2
10
3
1.5
3
20
3.0
4., . 0
5
o
80
b. See Step 4. 1. lb. The guppy of Plus X ASA 80 film is 5
inch perforated film.
c. Place the 0. 79 and 1.04 Neutral Density Filter in the EG
and G Mari. V1 Sensitometer and expose the step wedge on
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d. Make the following exposures on the emulsion side of the film.
RA ME TIME. CURRENT PULSE WIDTH CURRENT LEVEL
No. MS MA Switch Position Switch Position
28
3
10
4
29
~.0
3
30 '
3
4 0
A
3
80 .
4
5
A.0
0.375
40 -
1
4
4.1
0.75
4-0
2
A
42
1.5
~!0
52
0.375
40
Use the techniques suggested in Note 1 for notching the film if
the lights must be turned on.
e. Process the film as in Step 4. 1. le
4.1.3 To expose ASA 200 film
a. Repeat 4. 1. 2. a
b. Repeat 4. 1. 1. b using Tri X film ASA 200;the supply is 70mm
perforated film.
c. Repeat 4. 1. 2c
d. Make the following exposures on the emulsion side of the film.
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Ia RAME.
NO
TIME
MS
CURRENT
1V:%
PULSE WIDTH
Switch Position
CURRENT LEVEL
Switch Position
.
32
1.5
10
3
2
33
1.5
20
34
1.5
40
35
1.5
80
3
6
44
0.375
40
1
4
0.75
40
2
4
47
3.0
40 .
4
4
4.9
3.0
4.
1
C. Repeat 4. 1. 1. e
4.1.4 Exposing Film By Changing Distance of Record Head to Film
4. 1. 4. 1 For the remaining exposures use the appropriate switches in the
SLP Test Set (1089F23) to turn off the following columns and rows:
Colums:. 1, 3, 5, 8, 10 and 12.
Rows: 2, 4, 6, 8, 10, 12, and 14.
4. 1. 4-. 2 Shim the head so that the optical distance from the silicon chip to
the film emulsion is 0. 007 inches total. Usually, (depending-on the
measurements in Section 3. 0) this means applying 2 mil shims to
both ends of the recording surface of the head in a manner that will
elevate the.head by 0. 002 inches when it is placed on the film while
BEING SURE NO TG COVER UP ANY OF THE RECORDING LIGHT
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Suitable shirr stock is manufactured by Artus Corporation,
Englewood, N.. N.J.
!.4. 3 Cut a 3 inch piece of ASA 1. 6 film. Tape, notch, or mark the
film so that the start end can always be found. Expose step
wedge on the emulsion side of the film. Carefullyapply the
-:'EPA record head on the emulsion side of film being careful
not to dislodge the shims.
Expose film - see table below and then'mark the film with a
notch where you stop and put the film in light tight can.
4. 1. 4. 4 Next, cut a piece of ASA 80 film about 20 long and proceed the
same way as before. Can the film.
1.4. 5 Next, repeat process with ASA 200 film. Can the film.
4. 1. 4. 6 Turn on lights and add 2 more strips of 2 mil shim on top of
the 2 existing shims making a total of 9 mils optical transmission
path. Turn off the lights.
4. 1.4. 7 Pick from the can the ASA 1. 6 film and expose as before according
to table below, Start past the notch.
4.1.4.8 Repeat with ASA 80 and ASA 200 film and place all 3 films in-the
light tight can.
4--. 1. 4. 9 Turn on lights and add 2 more strips of 2 mil shim, now making
a total of 11 shims. Expose film as before.
12
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FRAME
OPTICAL
FILM
DEPRESS PULSE WIDTH
CURRENT LEVEL
NO. SPACING
TYP E
SET BUTTON Switch Position
Switch Position
inches
8
0.007
ASA 1.6
ZX
5 (48ms)
3(20MA)
14
0. 007
ASA,80
2X
3 (1. 5MS)
4(40MA)
20
0.007
ASA200
2X
2 (0.75MS)
4(40MA)
9
0.009
ASAI..6
2X
5 (-118MS)
4(40MA;
15
0.009
ASA80
2X
3(1.5M8)
5(60MA)
21
0.009
ASA200
2X
2(0. 75MS)
5(60MA)
10
0.011
ASA 1.6
3X
5(48MS)
3 (20MA)
16
0.011
ASA 80
ZX
3(1. 5MS)
6(80MA)
22
0.011
ASA200
2X
2(0.75MS)
6(80MA)
4.1.4.10 Process the films using D-19 developer whose temperature is
68?F and use developing time of 5 minutes.
4. 2 Slide Preparation
Prepare the recorded Code Matrix Blocks for microdensitometer
measurements by mounting as shown in Figure 9. Don't use tape
between the glass plates.
4.3 Microdensitometry
In all cases use 25 micron aperature and a recording scale factor
of 2 inch equal to 1 millimeter scan head trace.
For Exposures 5 through 22 - se the Amoco Model 4A Microden-
sitometer to scan Row 10 of Fe;;-u v.atrix Block through
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For Exposures 24 through 59, use the rnicrodensitometer to
scan Row 10 of the Code Matrix.Block through Column positions
7, 3, 9, 10, 11, and 12. For Exposure 25 use the micro-
densitometer to scan each column (one through eighteen)
through each of the 32 row positions.
Use the Macbeth Ansco Densitometer to measure the density
of the steps on the step wedge.
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F GuRr 2. SETUP FOR PO o I C JJ*- N C:TO
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