TEST PLAN(Sanitized) PROCESSOR

• Document Type: CREST
• Collection: NGA Records (Formerly NIMA)
• Document Number (FOIA) /ESDN (CREST): CIA-RDP78B04747A002400050036-2
• Release Decision: RIPPUB
• Original Classification: S
• Document Page Count: 4
• Document Creation Date: December 28, 2016
• Document Release Date: May 7, 2003
• Sequence Number: 36
• Publication Date: December 10, 1968
• Content Type: SUMMARY

SECRET
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10 December 1968
REFERENCE: Contract
IPROCESSOR
(dated 30 June 1965
1.1. The development of thel Air Bearing Wide Film Processor
was initiated by contract in June 1965.
After completion of the design-study-breadboard phase which established the
working parameters for a prototype model, phase II prototype manufacture
commenced in late 1966. After an in-plant checkout of the rocessor by NPIC
personnel in June 1967, it was delivered 1 -1 for a thorough
test and evaluation prior to installation 777 INFIC. The processor subsequently
failed to pass acceptance testing and was shipped back to the contractor in
November 1967. The contractor onths was reluctant to correct
the deficiencies foun however, in July 1968 the con-
tractor agreed to re-work the equipment.
1.2. This test plan describes in general terms a test and evaluation
program which TSSG/ESD/TEB proposes to accomplish. This program will be
accomplished in four phases unless it is terminated because the results of
any test and evaluation phase indicate a total rejection of the equipment.
It is expected that the processor will be ready for pre-acceptance (phase I)
in early February 1969 with delivery of the unit to NPIC in late February
1969.
2. PRE-ACCEPTANCE TEST (PHASE I)
2.1. Pre-acceptance tests will be performed by the contractor at his
plant and witnessed by the TSSG/DED contract monitor, a representative of
PSG/RD/PSB, and the test engineer from TSSG/ESD/TEB. Additional tests might
be suggested by the ESD/TEB test engineer who will assist the DED contract
monitor in making the technical evaluation of all test results.
Declass Review by
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2.2. It will be determined in this phase if the equipment is operative
and if any glaring contract discrepancies exist. Equipment will be checked
for compliance with section 2 of the contractor's technical proposal number
I Ian integral part of the reference contract. Particular emphasis
Will ced upon corrections made for discrepancies outlined to the
contractor when the equipment was rejected and returned for re-work. It is
estimated that three to five days at the contractor's plant will be required
to perform pre-acceptance tests.
2.3. The ESD/TEB test engineer will make recommendations as to pre-
acceptance, however, primary responsibility for preliminary acceptance and
agreement for shipping the processor belongs to the DED contract monitor.
3. ACCEPTANCE TESTS (PHASE II)
3.1. Upon arrival at NPIC, the Processor will be installed
in the photo lab area of PSG/RD/PSB where p Ease II, III and IV tests will
be conducted. Acceptance tests will be conducted by the ESD/TEB test
engineer.
3.2. The purpose of this phase is to provide minute inspection and
detailed testing of the equipment to determine if the manufacturer has
mpt minimum contract specifications (contractor's technical proposal number
I I
3.3. It is estimated that this phase will require from one to two
months t Information on any contract specification discrepancies found
will be forwarded to the DED contract monitor at the earliest time possible.
Sufficient data to justify a waiver to contract specification discrepancies
or to establish why a waiver should not be granted will be provided the
contract monitor if requested.
3.4. The results of this acceptance test phase will be made available
to TSSG/DED in a timely written interim report. It is intended that this
report will provide guidance for deciding ap ropriate final contractual ?
action.
4.
ENGINEERING TEST (PHASE III)
4.1. The
Processor will remain in the same location as for
determine
t
d
phase II testing.
It
o
ure
will be subjected to a testing proce
its maximum performance capability. This test phase is for:
1. Providing data for possible follow-on development of the prototype
equipment. This will inclu e data on poor design areas along with suggested
improvements.
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2. Establishing a confidence level for the reliability and product
quality which the equipment can produce.
3. Establishing if equipment will meet the operational requirements
of PSG/RD/PSB (Note: If requirements are not given to test engineer it
will be assumed that they are the same as those inferred by the contractor'
technical proposal.)
L.2. It is estimated that this phase will require from two to three
months time, but will start at the same time as phase II and will run con-
currently with that phase.
5. OPERATIONAL SUITABILITY TESTS (PHASE IV)
5.1. Phase IV will be conducted only if phase III test results indicate
that the equipment is engineered to an acceptable level'for operational use.
This phase will be conducted jointly between the user (PSG/RD/PSB) and the
test engineer of TSSG/ESD/TEB. The processor will remain in the same
location as for test phases II and III.
5.2. The purpose of this phase is to determine the operational
capabilities and limitations of the equipment in terms of operational tactics,
techniques and standards. The duration of this testing phase will be determined
jointly at that time.
6. TEST AND EVALUATION REPORT
Upon completion of the testing program described herein, an overall test
and evaluation report will be produced. This final report will contain details
of all testing performed and will contain conclusions and recommendations.
It is planned to distribute this report to all operating components within
NPIC, to EXRAND committee members and to other qualified components upon request.
If the program is terminated because of a final rejection of equipment in
phase II or III, a report as described will still be produced.
7. ASSISTANCE REQUIRED
7.1. Assistance will be required from the TSSG/DED contract monitor for
providing:
1) An insight to the contractor's engineering problems in designing the
prototype equipment.
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2) Data as to requirements for the equipment.
3) Any liaison required between the contractor and the test engineer
on specific problems requiring contractor's assistance.
7.2. Assistance will be required from PSG/RD/PSB to:
1) Provide a film -processing darkroom in the photo lab area for
25X1 installation of thel Processor for all test phases conducted at
25X1 NPIC. Minimum size room required is 18 by 10 feet. This room should be
one where room lights can be turned on at any time without hindering other
work progress. Doors to this room must be wide enough to accept the
hichis approximately 42 inches wide. Electric power, chemical
drain and pipe line connections to chemical tank farm will be required.
2) Various film materials and widths will be required for use in test-
25X1 ing the rocessor. It is expected that small quantities of this
material will be supplied from normal PSG/RD/PSB inventory. Assistance
may be requested in procuring additional quantities where supply is limited
and/or types of films are not normally stocked:
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3) Chemical tank farm support. If proprietary chemistry or additional
chemicals for mixing standard processing formulas are required, assistance
may be requested for procuring these chemicals.
4) Provide printing services to supply ample test roll exposures for
25X1 processing in thel Processor. (Note: An egtAmate of film materials
and chemicals required will be made and forwarded to
7.3. Assistance will be required from TSSG/SSD for preparing the equip-
ment site and for initial installation of the equipment.
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