THE ANODIC PROCESS IN THE ELECTROLYTIC POLISHING OF COPPER IN A SOLUTION OF ORTHOPHOSPHORIC ACID

• Document Type: CREST
• Collection: General CIA Records
• Document Number (FOIA) /ESDN (CREST): CIA-RDP80-00809A000600330631-4
• Release Decision: RIPPUB
• Original Classification: C
• Document Page Count: 2
• Document Creation Date: December 22, 2016
• Document Release Date: August 30, 2011
• Sequence Number: 631
• Publication Date: August 8, 1950
• Content Type: REPORT

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Zhurnal Prikladnoy Khimii , Vol XXIII, No 3, 1950.
THE ANODIC PROCESS IN THE ELECTROLYTIC POLISHING
OF COPPER IN A SOLUTION OF ORTHOPHOSPHORIC ACID
K. P. Batashev; Ye< N. Nikitin
Leningrad Polytech Inat imeni Kalinin
In spite of the wide application of electrolytic polishing, it is not yet
quite clear what causes a smoothing of the surface. Existing theories are
unable to explsin satisfactorily all phenomena observed in electrolytic polish-
ing. In addition, chemical transformations occurring in the region around the
anode have not been studied. Clarification o.Z the latter point is the purpose
of the investigation.
The analytical method has been used for investigating the products of
anodic dissolving at various stages of the polishing process. The electrolytic
polishing of copper was performed in a solution of orthophosphoric acid (spe-
cific gravity 1.55), An anode 3 x 3 centimeters in size was placed betweett two
cathodes, Hydrogen was accumulated on the cathode together with ddposttB~:df~
spongy copper. The polishing process was .regulated according to anode potential.
The initial current density was selected '~ main+l ', the anode potential
in the range of 1.25 - 1.50 volts at the end o_ poll. ~, after 10 minutes.
Anode and cathode potentials were measured in relation to the calomel elec-
trode. Measuring potentials by the compensation method is difficul~, since
they change fast in the polishing process. In this case, a suitable calibrated
galvanometer was used, A Kaminskiy resistance of ?7,000 ohms was connected in
series with the galvanometer. The accuracy of galvanometer readings was 0.005
volts which is sufficient for r?i.otting the potential curves.
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The anode and, unavoidable, the part of the electrolyte adjacent to
the anode were removed from the bath and dipped into acetone. It was possi-
ble to separate the electrolyte (phosphoric acid) from the products of anodic
dissolving (copper phosphates), utilizing the ability of acetone to dissolve
acids and water and to precipitate mineral salts from mixtures. Analysis of
the anodic dissolving products, separated at various stages of polishing, dem-
onstrated that the secondary phosphate ie formed in the initial stage and the
teritiary phosphate in the terminal stage of the polishing process.
The shape of potential curves offers and explanation for the mechan-
ism of electrolytic polishing. The surface smoothing is attributed to the
exhaustion of electrolyte chemical activity in depressed parts of the anode.
On account of the retarded diffusion, the saturation of the near-anode region
is attained much more quickly in depressions of the anode than over its pro-
tuberances which, principally, are being dissolved. Thermodynamic calculation
of static potentials of copper in solutions of its phosphates has been per-
formed. Calculated potentials are in good agreement with those obtained experi-
mentally.
cor~I~rrriAi.
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