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JPRS L/9905
1 1 August 1 ~81
Ja an Re ort
p p
(FOUO 47/81)
FBIS FOREIGN BROADCAST INFORMATION SERVIGE
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NOTE
_ JPRS publications contain information primarily from foreign
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transmissions and broadcasts. Materials from foreign-language
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are transcribed or reprinted, with the original phrasing and
other characteristics retained.
Headlines, editorial reports, and material enclosed in brackets
are supplied by JPRS. Processing indicators such as [Text]
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mation was summarized or extracted.
Unfamiliar names rendered phonetically or transliterated are
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MATERIALS REPRODL'CED HEREIN REQUIRE THAT DISSEMINATION
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- JPRS L/9905
11 August 1981
- JAPAN REPORT
(FOUO 47/$1)
CONTENTS
SCIENCE AND TEQiNOLOGY
Pinbaard Type Sequencer Described
{Yosuke i~iikase; TE QiNOCRAT, May 81) 1
Stage Type Sequencers Aid Equipment Design
(Hiroki Daigo; TECI~IOCRAT, May 81) 8
Examples of Automation by Sequencers Given
(Tatauo Takahisa; TE QiNOCRAT, May 81) 16
- Trend of Optical-Fiber Co~uunication Studied
(Sadakuni Shimada; TE~10 CRAT, May 81) 23
Production of Peptides by Nucleic Acid Synthesis, Gene Engineer:Cr.g
(Yoshifumi Jigami, et al.; TECfIl~10CRAT, May 81) 43
Sintered Zinc Oxide Sy~nthesis Examined
(TECEINOCRAT, May 81) 59
Present Candition of Large-Scale Minicomputer Examined
(TE(~INOCRAT, May 81) 62
Funds Provided ~or Popularizing Solar Systems
(TECEINOCRAT, May 81) 67
Development of Irradiation Chamber fo r Fusion Reactor
(TECEINOCRAT, May 81) 70
Slab Core Refloed Test Facility Produced
(TE(~INOCRAT, May 81) 71
Application of Electronic Technology in Machine Tools
(TE(HNOCRAT, May 81) 73
- a - [III - ASIA - 111 FOUO]
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Arc Welding Robot Developed
(TEC1iNOCRAT, May 81) ...................o....................... 75
Land, Sea Transport System for Developing Coimtries
(TE(~iNOCRAT, May 81) 76
Electronic Fuel In~ecti~m for Passenger Cars Developed
(TE CdNOCRAT, May 81) 77
Australia Orders Coal Handling System
(TE(~INOCRAT, May 81) 78
_ Evaluation of DC Feeder System With Thyristor Circuit Breaker
Comp le te d
(TE QiNOCRAT, May 81) 79
Pielstick Engine Productien Re achea 5 Million BHP Mark
(TEC~iNOCRAT, May 81) 80
Inte ractive, C~D for Printed Circuit Board Design
(TE(~OCRAT, May 81) 81
Electron Beam Drawing Unit Developed
(TE(~iNOCRAT, May 81) 82
Establishment of 7.Fao New Semiconductor Techniques Reported
(TE(~iNOCRAT, May 81) 8'~
- Semiconductor X-ray Detecting Device Developed
(TE(iiNOCRAT, May 81) 84
New Production Method of Ga11iu~Phosphorus Monocrystal
(TEt~iNOCRAT, May 81) 85
Dry Development of Photo Resist Process
(TE(~IldOCRAT, May 81) 86
Pilot Plant for ISAN Planned for Installation
- (TE(HNOCRAT, May 81) 87
Telex Teletype Switching System Developed
(TEQ3NOCRAT, May 81) 88
Tria 1 Small Radio Unit for Land Mobile Telephone System
(TE(HNOCRAT, May 81) 89
Test of Telephone Exchanges in Stricken Areas, Ground Telephone
Network
(TEC~INOCRAT, May 81) 91
Computerized Photo-Composing Character Plate for Arabic
(TE QiNOCRAT, May 81) 92
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New Large Capacity Magnetic Bc~bble Storage Unit Developed
(TE(~iNOCRAT, May 81) 93
Distance Measurement Project Between Japan, United States
(TE(HDIOCRAT, May 81) 94
Development of d-Type Silicon Nitride
(TECfn~10CRAT, May 81) . . . . . . ~ 95
Practical Use of New Manufacturing Method of Caustic Soda
_ (TE QiNOCRAT, May 81) 96
Carbon Tetrafluoride of High Purity Manufactured
(TECfiNOCRAT, May 81) 97
Production, Marketing of New Water-Soluble Polymer in Good Shape
(TECHNOCRAT, May 81) 98
Development of New Materials in '~e Next-Generation Pro~ect~
(TECEINOCRAT, May 81) l0U
Production of Malic Acid Described
- (TECEIIdOCRAT, May 81) 101
Prospect of Practical Wave Force Electricity Generation
(TEL~IldOCRAT, May 81) 1Q2
Recovery of Sea Water Uranium by Microorganist~s.:;
(TE(~NINOCRAT, May 81) 143
Development of Automatic Analyzing System for Submarine Strata
(TE(HNOCRAT, May 81) 104
Production, Salea of Industrial Robots Discussed
(NIKKEI SANGYO SHII~UN, various datea) lU5
Shinmeiwa Industry
Hitachi Ltd
Kubota Ltd
Osaka Transformer
Kawas aki He avy Indus t ri es
Fujitsu Fanuc
Daihatsu Kogyo
Yasukawa Electric Manufacturing
Ishikawa~ima-Harima Heavy Industries
Sales Tactics of 64 K RAM Manufacturers Des cribed
(NIKKET SANGYO SHII~ UN, various dates) 115
Oki Electric
I~itachi
Mitsubishi Electric
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Auto Makers Adopting Front-Wheel Drive Syatem
(NIKKEI SANGYO SHII~UN, 19 Jun 81) 119
Briefs 122
Factory Ene rgy Saving System 122
Establishing COM-Dealing Company 122
Coal Gasification Power Plant 123
Heat Pipes to Caal Undergm und Cables 123
High Purity Plasma Attained ~~4
Laser Oscillation by Hydrogen Plasma 124
Reactor Vessel Cover Improvement 124
� Giant Electron Lineac 124
Radiation-Resis tant XMA 125
Heavy Gas Oil Hot Transfer System 125
Robots on Bicycle Production Lines 125
Liquid-Hydrogen Pump 128
COD~C ISI 126
Computer Network 126
Practical Use Optical Fiber 126
Artificial 'Eye' Development 12~
Information Retrieval ~27
R&D Processor 12~
Very Large Compu~ter Sales ~28
Fujitsu M Seriee With 64K ~g
Schema Designing-I?rafting System 12$
Highly Efficient Electron Microscope 129
Distortion Measuremen t Inversion Gauge . 129
Infrared Interferometer 129
Microwave Radiation Meter l~
Practical Voltage Standard t3nit 130
Intelligent Spectrum Analyzer 1~
Vacuum Residue Cracking production 130
Compounding Carbon Fiber 131
Vinyl Ghloride Process Help 131
Semiconductor Package Materials 131
Large-Scale Interferon Production
- d -
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SCIENCE AND TECHNOLOGY
PINBOARD TYPE SEQUENCER DESCRIBED
~ . Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 pp 11-14
[Article by Yosuke Mikase, Third Designing Section, Izumi Co., Ltd.]
[Text] Recently there has been signi~cant development of ser~uence
control in industry. Thes~ devices come in vazious tfpes snd
kinds, namely drum, cam, pinboard, and stored or memory
type sequencers, and the mosz applicable kind of sequencer
for a particular use is determined by the application and
the object of control for which it is to be used.
This report describes an easy-to-operate pinboard type
sequencer that has been most popular in recent years and
is the easiest to adopt.
1. Position of Pinboard Type $equencer in Sequence
Control
Fig.l shows the relationship between the pinboazd type
sequencer's control capacities and its ease of control. As can
be seen from the figure, the pinboard sequencer can be used
in a wide range of applications, from those in which the cam-
and drum-type sequencers can be used to where the stored
or memory type sequencers are applicable.
Depending on the object of control, an appropriate model
0
�
~ Storsd typ~
0
� tsquenesr
0
� ' ~%i~%.,
~
o } Pinboard ; "
o I typ~ ~squencsi~~.~
m . . :
m Cam,
~ drum typ~ fsqusncer
O
- - Cont~~ol eapacity
Fig. 1. Occupation Range of a Pinboard Type Sequencer
1
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- can be selected from among the various kinds of pinboard
type sequencers mentioned below.
2. Definition of the Pinboard Type Sequencer
A pinboard type sequenCer is a sequencer thaf. permits
designing of a sequence, in quite a different way from previous
methods using combinations of relay circuits, from an operation
time chart, yet requiring no special language for instructions
and that easily affords incorporation of sequence time elements
and confirmation input elements.
In this article, the setting of a sequence from an operation
time chart for a pin�board type sequencer is described, using
control of a small machine as an example. The movements
ef the small machine (sketch) are shawn in Fig. 2.
2-1. Operation Time Chart
~An explanation is given under the assumption that the
operations of the small machine shown in Fig.2, follow the
Drfll 2
Limit twitch 1
/
CYlind~r 1
~ ~ Drill 1
Cylfndar 2 \ Llmit rwitch 2
Fig.2. Sketch
movements shown in the operation time chart in Fig.3. In
the operation time chart in Fig.3, cylinder 1 goes into operation
in the lst process, and as the time T1 advances, the procedure
pr~gresses inta the 2nd process. Upon shifting to the 2nd
process, drill 1 and cylinder 2 start operation and cylinder
2 travels as far as the limit switch (LS1) attached at the
machine end. At this time, LS, switches "on", starting the
3rd process. In the 3rd process, cylinder 2 maintains its
operating state continuous from the 2nd process and drill
2 starts operation. The drill, equipped with a limit switch
~ (LS2 ) at its end, advances to the limit, whereupon LSz switches
"on", starting yet another process. In this way, a sequence
has been completed.
2.
_ ~
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i. . l :
Output
1
Drill 2 ~
CyO~d~r 2
Drlll 1 ~
Cylind~r 1
; 1~t procw 2nd procsa 3rd proe~u }
, T~ }
Limit ~witch 1 on Limit ~witeh 2 on
ProcKs
Fig. 3. Operating Time Chart
2-2. Setting a Pinboard ,
From the operation time chart in Fig.3, a pinboazd sequence
as shown in Fig.4 can be established. In Fig.4, the + mark
shows insertion of a diode pin, and it is equivalent to + in
terms of a circuit. In this way, the axis of ordinate (output
line, time line, etc.) has been connected with the axis ~ of
~ abscissa (process line) by a diode.
The setting of a pinboard as shown in Fig.4 can be explained
as follows: Since output 1 is "on" at process 1 from the
operating time chart in Fig.3, a setting pin is inserted at
where the line for the lst process crosses the line for output 1.
And furthermore, a setting pin is inserted at where process
1 line crosses timer T line since process 1 is time controlled.
In process 2, a pin is set at each of the crosses where
process 'L line intersects the lines for output 2 and output 3,
since output 2 and output 3 are in a state of "on". Since the
progression from process 2 to process 3 is governed by the
confirmed input of limit switch 1, IS, signals are connected
to the conf'umed input mechanism of process 2.
Output Tim~r
1 2 3! 5 RE'T T~
~ M
1 c� E LS i
~ 3. E q LS= o
t ~
~ 4 Y
~ o E Confirmsd input
p 5 V 1lnput wirinp)
a
Diode pin
Pinbosrd matrix.
Fig. 4. Setting of a Pinboard
3
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_ b~------- bf
Output r~lay Timsr
m~chsni~m m~chaniun
i
cE "
~
uq 12~~5...... T,T~TiT, a
C
1 '~-p
~ V = � :
oE ' E:
S w L
~ �Y
Pi~board V E
o=_
c~
0
Fig. 5. Block D~agram
In process 3, outputs 3 and ~ are in a state of "on", so
a pin is set at each of the spots where process 3 line crosses
the lines for outputs 3 and 4. Since the progression from
process 3 to process 4 is governed by the confirmed input
of limit switch 2, LSz signals are connected to the confi_rmecl
input mechanism of process 3. ~
All these settings complete the operation time chart.
- Consequently, the 4th process is a return process. When a
pin is set at where process 4 line crasses the .RET line (return
line), as soon as progression advances from the 3rd to 4th
process the sequence retums to the lst process, thus completing
a sequence.
The writer believes that the reader can easily understand
the method of setting a pinboard from an operation time
chart.
2-3. Composition and Interior Structure of a Pinboard Type
Sequenoer
As shown in the block diagram in Fig.S, a pinboard seque:~cer
is composed broadly of a pinboard matrix, grocess counter,
control circuit, output relay, timer, and confirmed input
mechanisms. The function of each of these mechanisms is
as follows:
(1) Pinboard matrix mechanism
This is a setting mechanism where the relationship between
the process, output, and timer are set by a diode pin from
an operation time chart.
(2) Process counter mechanism
This is a counter that changes processes in sequence.
(3) Control circuit mechanism
This is the brain of a pinboard sequencer, and which sends
out progression signals, or resets signals to the process coun-
ter, or controls output, timer, etc. by start signals.
4
; ~
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(4) Output relay mechanism
This is an output relay contact that drives the actual load
(electromagnetic valve, etc.) by output set by the pinboard
matrix.
" (5) Timer mechanism
The timer comes in two types, a CR type and a digital
type. In the digital type, the timer time can be set by the
pinboard matrix, and the process progresses by time signals.
(6) Confirmed inpui mechanism
This is a mechanism in which by eonnecting the confirmed
input with the process signal of a pinboard sequencer, proceed
sgnals are generated by ~onfirmed input signals.
3. Features of a Pinboard Type Sequencer
(1) It can be easily set from an ~peration time chart.
(2) By changing the positions where a diode pin is inserted,
output settings and timer settings can be altered with ease.
(3) Interlocking of a confirmed input signal with a process
signal is easily provided.
(4) When using a digital timer, precise time settings can
be made, and time settings can be made for each process_
(5) Relays are eliminated in the sequenc~.
(6) With changed settings, a pinboard can be used for other
machines, which raises its utility value still further. .
(7) No specific language for instructions is required.
' 4. Kinds of Pinboud Ty~+e Sequencers
4-1. Setting Methosl
There are three setting methods.
(1) Push-in diode pin setting method
- This type of sequencer features insertion of a diode pin
in a pinboard matrix (see Photo 1). With this type, the setting
pin is inserted or removed with ease, but the pinboard matrix
is expensive. This type is especially suited for use in machines
that demand frequent changes in sequence.
(2) Screw�in diode capsule method
In this type of sequencer, a diode capsule with a diode
sealed into it, is fastened by a screw to a printed-circuit
substrate of matrix wiring (see Photo 2). This type of sequencer
is cheaper because it uses a printed-circuit substrate in its
matrix, but more time is required to attach to or detach a
sequencer from a machine. It is especially suited for use in
small machines.
(3) Direct attachment of diode type
In this type of sequen~rer, a diode is soldered directly
onto a printed-circuit substrate of matrix wiring. This type
of sequencer is the least expensive because it uses a printed-
circuit substrate and, moreover, uses diodes directly, but it
has a drawback in that to change a setting requires a great
amount of trouble since the attachment or detachment of
5
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Diod~ pln
Photo 1. Setting Method of Diode Pin
(Izumi PRS 1515, 15 processes, 15 outputs)
.r, . . , , . -
Diod~ c~p~ul�
-
\
, Print~d-clrcuit rubstnt~
F~tt~nfnp nut
Photo 2. Screw-in Diode Capsule System
(Izumi PRE 121Q, 12 processes, 10 outputs) '
a diode involves soldering. It is especially suited for use in
exclusive small machines that do not require sequence.changes.
4-2. Control Systems
Pinboard type sequencers can be broadly classified into
three types from their control systems.
(1) The so�called stepper system that controls process/
progress only.
6
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{2) The lo~c system that is not provided with the process/
progress function but is equipped with the function to s~t
logics for relay by AND and OR.
(3) A hybrid type that can set inputs, AND and OR logics,
that are progress conditions for process/progress function.
5. Standards for Adoption of Pinboard Type
Sequencers
When introducing a pinboard type sequencer, depending
oti what kind of operation a machine is expected to perform,
the following items need to be taken into account for selecting
the right type of sequencer.
(1) Stepper system and hybrid stepper system
a. The number of processes
b. The number of outputs
c. The number of timers and time
d. The number of confirmed outputs
e. Existence or non-existence of jumps in a process
(2) Logic system
a. The number of inputs
b. The number of outputs
c. The number of timers and time
d. Address
6. Future Trends
As the number of appGcations for sequence controllers
has increased, the progress of stored type sequencers incorporat-
ing microcomputers has been outstanding. In small robots
and small plants, the demand for pinboard type sequencers
is great because of their low price and ease of operation.
Automation is expected to advance in medium-and large-size
plants in the future through the adoption of stored type
sequencers. Automation is expected to be further promoted
in simple small robots and small plants, and consequently
the number of applications for sequencers is expected to
expand still further.
COPYRIGHT: 1981 Fuji Marketing Research Co., Ltd.
CSO: 4120/288
,7
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SCIENCE AND TECHNOLOGY
STAGE TYPE SEQUENCERS AID EQUIPMENT ~ESIGN
Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 pp 15-19
[Article by Hiroki Daigo, chief, First Technical Development Division, Koyo
Electronics Industries Co.]
[TextJ With the advent of a stage of slower industrial groewth
and the trend toward automation of machinery, with the
main objectives being labor-saving and energy-saving, in
= industrial processes there is greater sophistication,and processes
have become more complex. ,
Aimed at labor saving in design, manufacture, setting and
' maintenance, and designed with a new look at the original
role of sequencers for contro] of machinery and equipment,
- the stage type sequencer has been developed on a quite
different premise from conventional control devices that re-
quired sequence circuit diagrams to enable them to perform
sequence control of machine operations. The stage type
- sequencer has completely eliminated the need for the know-
ledge of a sequence circuit diagram, and with it, mechanical
engineers, with no knowledgc of sequence circuit designs as
- well as engineers engaged in the designing of sequence
circuits, can design control equipment with ease.
1. Sequencr. Control Equipment
In designing sequence control equipment, the most common
methods until now have been: 1) to design a sequence circuit
diagram and, based on the diagram, to wire a nunnber of
relays, or 2) to program into a stored program sequencer
(PLC) of a ladder type.
Control devices with relays as their component and PLC's
require sequence circuit diagrams, but they are only a means
- of obtaining sequence operations. The primary purpose of
a control device is to control a machine. Consequently if
instructions for a control device are obtained directly from
the operation of a machine, it means the device responds
d'uectly to the machine's operations, thus resulting in great
savings in design, setting and maintenance. The stage type
sequencer is thus aimed at realizing control of a machine
from its operations, and this dream has been realized by the
development of the "KOYO-KOSTAC-SA" (see Photo 1).
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- ReleV msthod PLC Steps tYP~ Mausnc~r
. ~
, ' Machenieet Mschenieel M~ehanica
operetion op~ration op~ratfon
~quence puenee
cireuit disprem circuit diaprem Op~ratinp chsK
,
~ Menufscturinp Propram Propnm
!
WU! . 1 ,
� ^~Jyy'~A
Photo 1. KOSTAC�SA Fig. 1. Procedures of Control Devices
Fig.l shows the procedures for manufacturing various control
devices.
.
2. Structure of KOSTAC-SA
_ An outline of the stage type sequencer KOSTAC-SA is
as follows:
Being a sequencer of a stored program system, KOSTAC-SA
is composed, as shown in Fig.2, of a pcogram counter, program
memory, operation processing, internal memory and input/
output sections.
- The program counter reads from top to bottom program
memories 0000-1023 repeatedly. With the capacity for 1024
words, each word consisting of 12 bits, the program memory
stores programs written by the programmer (see Fig.12).
On receiving instructions to read from the program counter,
it sends the content in turn to the operation processing unit.
The operation processing unit reads the contents forwarded
by the program memory, and executes operations by checking
signals from the internal memory. The internal memory
temporarily stores the results of the operation process, and
the state of input and stage. The input/ouiput unit is a
mechanism that sorts inputs from the limit switch or operation
switch, or sorts input that moves the motor or valves.
3. Expression of Stage
The basic idea of the stage system is explained in the
following:
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M~mory Proprsm m~mory On~ word~l2bib
addr~u
emporary rtorep~ o
_ ~ ~1 int~rnsl m~mory, Inpuboutput L8~
M input/output sipnals unit
~ 1 snd ~tepe siynal�
~ Inquiry for input PB SOLA
q outp tmmend to pQ
1
$ ~ Interpr~tinp and OUT52 IN16
a �x~cution of
instruetions to OUT52... Produes an input st 52 addrea
1023 proe~~f op~retlOns F19, 3. Control Core
wh~n ths output eondition i~ m~t
Command Dets (op~rendl IN 16....... Input s(pnal~ at addr~f~ "16" tnto
tha opsr~tion proesnfnp unit
Fig. 2. Composition of KOSTAC-SA
SO Lq T I
PB
LSt _ ~c~
1 LS3 SOLq T1�SOLq ~ SO~q
STAGE 3_ Start LS6 p?oce~d~~~ proca~d� ~ operstion completed
forward baeKwsrd ~ m~mory ~
SOLB ~ T T~ O~ ~
CL ' CL
LS rCL LS5 T;�SoLg ~SoLA'8
LSq ProcMd T rfarv~vard�O�~~ ~a~k~�efd LS3 conditioneomplead
~s forwerd~ 2 ~ ~
A 4 ~ 5 ~~.J
Condition~ st which SOLAend SOI.g M
SOL~ compl~tsd thsir op~ration ~ 10
~ I SOLq op~retion
compl~t~d
STAG E M~mory
r~Mt M resst LS~
SOL~ protssd forward ~ SOI~ eutoff Retutn to start
- O O
STAGE t m 5
PB ~
STA(3 E
Fig. 4. Time Chart Fig. 5. Operations Expressed in Words
STAG~Composltion of e unit STAGE
,
~ ~ , :Q1 ~ .;Q :--.;Q ~
~
, . .
. ~ r-'_"" .
_o ~;o ,~o ~o ~-.;o ~o ~ oN
~ ~ ~ .
Fig. 6. Flow of STAGE's
10
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FOIt OF'NI('IAI. UtiE ON1.Y
3-1. Control Core
The minimum unit of control begins with producing output
by control start signals and ends with stopping output by
control stop signals. For example, in Fig.3 SOLA starts
operating by PB and stops operating upon detecting LSz.
Instruction signals are signals from sensors and counters,
such as the operation switch, a limit switch or proximity
switch, and outputs are electromdgnetic valves, motors, lamps,
etc. Sequence control is a collection of such control cores,
and it executes these control cores according to a certain
rule of orders. The control core is called STAGE.
- 3-2. Role of Stage
From the operations of the time chart in Fig.4, let us
consider the role of a stage. As shown in the diagram, a time
chart has load signals listed in it, and it is a graphic display
of the control relationships between signals and loads. As
is apparent from the diagram, stages are always controlled
by start signals and stop signals, and a sequence is composed
. of a combination of stages. ~
From another view, a sequence can be bfoken down into
stages. Also, each stage is positioned in relation to a series
of controls and contains conditions determining a sequence.
- Fig.S is a version of the time chart shown in Fig.4 expressed
in. words. It is a method of displaying the flow of operations
in letters. As is apparent from Fig.S, stages start operating
by start and stop signals, with one stage leading to the
next, to compose a sequence.
Fig.6 has the above operations expressed in the flow of
stages.
4. Flow of Stages
~ Upon completion of a transfer from one functioning stage
to the next stage, the stage that has just completed an execution
is reset and stops execution. That is, executions of stages
- proceed according to a program. It has already been mentioned
that the stages themselves are provided with the conditions
detennining the flow of oper~tions in a sequence, and thus
if the flow of stages could be contrived in any conceivable
combinations, sequences of any combinations would become
feasible. The goal has been achieved by the stage type sequencer
that employs three kinds of flow processing, as shown in Fig. 7.
5. Chart of Stages
A chart of a stage has a certain set of rules, and it is drawn
up according to these rules.
11
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No. Nam� F low eh~rt
r'___~
~ Bnnch ~`''~''''~~Q_ p'"~ (3)
proeMSinp ~ (1) (41 (S)
~
~ � ~ � � r �
_ �r�
`0 ~
Bsteh -y' ~ r ~
2 prOCNtinp (8)
~ ~
~r M ~f
~ cst
3 Parell~l ST :4~!_1 ~
pfOC!!f{I1Q r ~l .
sT ~q_;--
ST A eommsnd inaructinp th~
first STAGE to ~x~cut~ to surt
~x~eution
Fig. 7. Processing of 3 Kinds of STAGE Flow Fig. 8. Basic Chart of STAGE
S-1. Basic Chart of a Stage
Fig. 8 shows a basic chart of a stage.
(1) Indicates STAGE, the sta~e No. is written in The
command is expressed, STAGE' rt.
(2) Indicates output, and I~0 No. is entered in There
are no limits to the number of outputs. Command: OUT'*�.
(3) Is for resettin~ another STAGE, and the STAGE No to be
reset is entered in There are no limits to the number
of stages for resetting. Command: R. STAGE**�.
(4) Is conditions for advancing from one STAGE to the
next STAGE; and in is entered I/0 No. Conditions are
combinations of AND or OR, or AND.OR. ~ommand: IN*"�
AND OR
A STAGE can be treated as a transfer condition. STAGE ~
No is entered in
Command: IN �STAGE''" AND� STAGE
OR�STAGE*�*
Furthermore, the condition can be changed tn NOT.
- Command: IN�NOT"`* AND�NOT*** OR�NOT�"'
IN~NOT�STAGE*'* AND�NOT�STAGE***
OR � NOT � STAGE *
(5) Indicates the next STAGE to be transferred to when
the condition has been attained. The STAGE N0. for the
next STAGE is entered in'"*'� There are no limits to the
number of STATE's to be transfened to.
Command: JiJMP*�''
For advancing onto the next STAGE when a condition
has not yet been met, N.JUMP�'"'" command is used.
(6) Is the condition for outputting at a time when a STAGE
is in a state of execution, and the same commands as mentioned
in Item 4 apply.
The conditions for (5) and (6) can be further loaded with
conditions for counter functions.
� Command: T
timer 0.1-25.5 seconds
counter 1-1..55 counts
12 �
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[t can be provided with a total of 256 points of input/output
points, with the input/output total being 128 point:, and the
expanded input/output total being 128 points. For command,
OUX is added to the input/output command.
The STAGE No. that is to be executed first (at the time
the sequencer starts executing) needs to be designated. There
are no limits to the number of the STAGE's to be executed
at the start.
For command, START
_ The No. of the STAGE :o be executed
first is entered.
5-2. Three Proasffing Functions of a STAGE
In a condensed form of the basic chart of a STAGE with
some sections cut away, a STATrE has three processing functions
as shown in Fig. 9.
_ 6. Operation Chart and Preparation of Programs
Fig.10 is a diagram of the operations in Figs.4 and 5 as
displayed in the operation chart of the stage type. Fig.ll is
a program prepared from Fig.1C in accordance with the
previous chapter.
7. Write-in of Program
The program prepared in Fig.l l is written into the program
memory of the sequencer using a programming device. As
� P81.S~LS LS6 LSy LS1
000 000 ~o0 001 - 002 T 003
R ~
~ f
No. Nams Chsrt '
SOLq forward SOLq SG008 ~
bsckward '
~ Operation l,Sq LS LS ~
proceasinq ppq - 005 T -5 006 T-3 007 ~1--~--8
~
Conditlon
I 2 ~udpm~nt
proc~uinp SOLg forwerd SOLg forw~rd CL SOLg beekwerd
3 M~mory ~ O10
procef~ing
M
R.SGOOa ~ cycl~ eonti~uously
LS~ LSb
Fig. 9. Three Processing Functions of a STAGE ~e 009 0~
oo~
~4 Fig. 10. Operation Chart
SOLC forwsrd 010
13
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Fig.11. Program
START OC~ STAGE 004 ~N ~7
3TAGE 000 OUT SOLB fo?ward STAC3E 009
~N pg IN L31 R.STARE O10
AND LS1 STAGE 006 IN LS6
AND LSg T 010 AND 1 cyel~
AND LSb OUT SOIg forward .1 000
JUMP 007 OUT CL ~~d ~6
JUMP 004 IN LSS AND continu~d
JUMP 010 STAGE 006 J 001
- STAGE OQ1 OUT C~ ~ ~4
OUT SOI.A forward T O10 J 010
IN LSZ OUT SOLgbeckwerd STARE 010
STAGE 002 AND LSg OUT M
T O10 STAGE 007 .
- OUT SOLq backw~rd IN,STAf3E 003 Althouph input end
AND LS S'YAGE 008 output sn wrttt~n in
~ I~tt~rs, in the actusl
STAGE 003 R.STAOE 003 proq~am thsy ~r~ n-
OUT SOL~ forw~rd Pr~~nt~d by I/O No.
OPE RANO. dltpl~y
� Aft~r th~ STAGE k~y h~c b~~n pr~p~d, It
displ~y~ th~ t~n k~y cont~nt STAGE
PROGRAM swltch numb~r,
� Att~r tha IN, OUT or AUX k~y i~ prNtsd, it
� Msk~ sun it if in the OF F po~~tion wh~n I ditpley~ th~ t~n k~y eont~nt ~t I/O ~umb~r
~ttae~lnp or d~tsehinp s eonn~etor from th~ � Aft~r th~ T k~y 1~ pnswd, It di~pl~Y~ th~ bn
Nqusne~r. k~y eont~nt tim~r tim~.
� Whsn it f~ fn th~ ON positlon, the Nqusne~r � It ~tsrts blfnkin0 Wh~n s numb~r ebov~
stopf opar~tinp. STAGE numb~r 127 it propnmm~d.
� It blin..c wh~n ~ numb~r not fnclud~d In th~
ADDRESS di~pl~y I/O numb~n fi propr~mrrNd.
� It stsrt~ blinkinp wh~n sn ~ddrN~ I~rp~r th~n � It blfnkt wh~n th~ tim~r 1~ ~~t ~bov~ 26.6t.
number 1023 Is propr~mmsd. (th~ s~qu~ne~r prop~r to th~ eonn~etot)
� Upon pra~inp tha AODRESS SET k~y down, I
it d~spl~V~ ths 10-k~y cont~nt ~t ADDRESS ALL CLEAR
No, r Whsn clNrinO th~ ~ntirs eont~nt of th~
w 2 6 0 5 3 Gropr~m msmory in th~ s~qu~ne~r prop~r,
~ prKt th~ WRITE k~y sft~r pretsfnp th~
�_~�x-~-~� CLEAR k~y (ALLCLEAR LED Ifphts).
INSTRUCTION ksy di~plsy ~
� Whsn ths instruction k~y it prnNd, snd if I
th~ comm~nd is accept~d, tha di~pl~Y Ifyhts. ''"J-~
� When th~ READ k~y i~ pnss~d, tns lemp y ADDRESS SET
pivinp e commend to th~ w~r propram m~m- SI ~ � Pnofnp this key ~~tt sn ~ddnn. Th~
ory in ths ~ddr~tt numb~~ liqhts. Wh~n in� . ~tldnu ~hown In tha ditplaY ~t th~ mort~nt
~truction cod~s not in ~xi~tenc~ foliow ona _tJ ~ lt "0000".
stter enoth~r, the ~ntire displ~y blink~. c. � In eddition, it f~ uwd for "~qu~szinp-In"
op~ration~.
TEN KEYS READ
� Ua~d for propr~mminp STAG E, ADDRESS, � DIepI~V~ th~ eontent ot the proprsm rt+~m-
I/O snd timar numb~n. ory addr~n of tha ~~qu~ne~r propa di~pl~y�
~d in th~ add~e~~ di~pl~V unit.
� S~~rehn out at whst ~ddrn~ fn~id~ th~
propr~m m~mory th~ fat Imtruetlon it
CLEAR �nterW.
� Ma~ipul~tion ot tha k~yt nutt op~r~ndt yyp~TE
~nd inftruttiOn~ ~Ir~~dy propr~mmW ~nd yyh~n thit k~y is pr~a~d, th~ imtruetfom
displ~V~d, ~nd th~ I~mpt In th~ di~pl~Y Oo ~nd op~rand~ diipl~y~d ~t th~ ~ddr~~t ditpley
~ out. I~ thit e~s~, th~ ~ddr~u I~mp r~m~int
lipht~d. (wh~n uttin0 ~n ~dtlr~n, it el~~n ~umb~n in tha utsr m~mory ~n written in.
th~ ~ddr~p di~P1~V). tt ft upd 1or writinp in (nwritinp), pNxinp
� Cut~ oft th~ op~r~tion b~l~p ~x~cutW. ~~d inurtion op~r~tfon~.
Fig. 12. Programming Device
shown in Fig.12, the programming device has a command
key, number key, operation key and a command display, and
it can write in a program as it is.
In addition to the write-in function, the programming
device is provided with read-out, squeezing in of additional
instructions, erasion of inemory, and check of programming
error functions.
~14 .
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8. Specifications of KOSTAC-SA
The general features of a stored program type sequencer are:
11) Simplification of manufacture.
( 2) Ease of design changes'and remodeling.
(3) Small size and energysaving.
(4) Greater reliability.
(5) Reduction in total cost.
- Other main features of KOSTAC-SA include:
(1) No need to design sequence circuits.
(2) Monitoring of all STAGE's and all inputs and outputs
is available on an LED display.
(3) Programs can be directly written into the program mema
ry using a programming d~vice.
An explanation has already been given about Items (1) and
(3). An explanation of (2) follows: KOSTAC-SA is an assembly
of units with distinctive funations. The sequencer proper
is provided with 128 points of STAGE, 128 points of I/0,
128 points of expanded input/output and 6 points and 8
displays (LED) for self-diagnosis. The operating state of the
sequencer can be judged from the display function, greatly
contributing to the ease of setting and maintenance. With
the stored program sequencer, there existed a problem that
the state of execution could not be fully monitored from the
outside since, as shown in Fig.2, the execution is carried ont
at a high speed by IC's, but when using KOSTAC-SA, the
state of execution of STAGE's and input/output signals can
be monitored by eye, so it can be handled in the same way
as one would handle a conventional control device.
Table 1. Specifications of KOSTAC-SA
Power souree voltape AC 100V �1096
Surroundinp environmsnt Moisture beiow 90% (no dew formation)
Temperature 0-SO~C
' Numbsr of stapes 728 stspet
Number oi instructions 26 kinds
Progrem memory capecity 1,024 word:
Input/output points 128 point~ (expandabls to 256 points)
Program timeneountsr Timer 0.7-25.5p
Counter 1-255 counts
Scanninp time 12.8ms
Monitoring functions Stepe display - 128 points
Input/output display - 128 points
Ezpanded input/output displsy-728 pofnts
Ssli-diepnocis di~play - 6 pointc
COPYRIGHT; 1981 Fu~i Marketing Research Co., Ltd.
CSO: 4120/288
15 ,
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SCIENCE AND TECHNOLOGY
EXAMPLES OF AUTOMATION BY SEQUENCERS GIVEN
Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 pp 20-23
[Article by Tatsuo Takahisa, Cannon Co., Ltd.
[Text] 1. Name ..~d Definition of Sequencer
Referred to as "programmaule controller" or "programmable
logic sequence controller", sequencers are on the market
undet various product names, such as "Procon" (meaning
program control), "pin�board program" since it incorporates
pin-boards, and "stepping programmer" since its process ad-
vances step by step. Sequencers that advance by means of
- timers are called "program timers", and those whose operations
are coatrolled by limit switches by motor driven cams are
called "program cam timers".
'~'hese products all originate from the idea of how to
simplify the conventional sequencers that rely for control
of sequence circuits on relays. Consequently, minicomputers
incorporating sequence circuits might have to be included
in the category of sequencer, but in this article the definition
extends to include sequencers incorporating minicomputers
that are sold under the product name "programmable con-
troller".
Since there are no regulations in the Japanese Industrial
Standards that pertain to naming of products, each maker
may be permitted to tag his product with a characteristic
brand or product name. What matters. is what contents
sequencers are provided with, so the writer ~11 henceforth
conf'me himself to describing the definition of "sequencer".
In the meaning that a sequencer is a module of sequence
controls that are governed in the JIS, it anay be defined as
follows: "A sequencer is ~ unit of circuits that can freely
devise a control that promotes step�by-step a predetermined
sequence of procedures or a fixed sequence of logical steps".
(see Fig. 1).
16
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17
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2. An Example of Sequencer Design
As anyone comes to know when setting hunself to the taslc
of designing a sequence circuit, all people, including those
who are engaged in the designing of machinery, are naturally
endowed with capabilities of the analog type. But, as is
represented by the Boolean algebra, the designing of a circuit
requires instead a digital way of thinking. The first step in
circumventing this difficulty is to draft a design in an analog
way, that is, in the form of a sequence flow chart and a block
~diagram. They can then provide a guide to drafting a sequence
circuit.
In addition to preparing these two, it is also important
to come up with a list of parts that perform the various
operations, such as solenoid, motor, relays, switches, lamps,
etc. In drafting a design, it is naturally expected that some
special conditions would need to be filled, so such conditions
should be jotted down as special reminders. These could be
included in a list of specifications.
2-i. Procedures for Drafting a Circuit Design
a) A list of design speci~cations (desired features of
- machine and related items)
b) A block diagram
c) A sequence flow chart
d) A sequence circuit diagram and a list of symbols for
- reference
e) A machine pro~ile with circuit parts diagram (with
instructions for installation)
~ A diagram of electrical equipment box (with instruc-
tions for handling)
g) An operating manual (instructions for maintenance,
makers of parts used, and a list of symbols and marks)
When the items listed above have been prepared, the
designing work has been completed. It is quite a challenge
to draft a design, but an even greater challenge is to clearly
explain the machine design to the people who actually make
a sequencer based on the design, or to those who will use
_ or maintain the manufactured product.
From such a comprehensive definition, a sequencer is for
itself being treated as a standard unit, and consequently no
explanation is required of this point. The use of a sequencer
reduces the problem of maintenance by that much, and since
the sequencer has the guarantee of its maker, it is almost the
� same as if the electric equipment box itself has been
guaranteed. In other words, everything goes fine, beginning
with the work of designing.
Next is an example in which one company's relay sequence
circuit, that appeared in a magazine, is designed using a
sequencer.
18
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P~rts
Fwdsr tor tskinp out
(forwsrd snd b~dcw~rd
- mowm~ntl Partt-inM?tinQ
\ dwic~
Push~?-typ~ Work
work hold~r prop~r }
~
Cluuh/brNc�
~
Work cl~mp J Oriw motor for
,P~~�Inwrtinp
Work Ilh~r dwlp
. e
Fig. 2. Profile of Machine
Driv~ motor for ON PB~
parU�ins~rtinp
~ m~chin~ OFF
up ~
Work Ilft~r down PB' ~3
PurAer�type forw~rd ~4
work holder b~ekw~rd ~s
Fs~d~rfor forwsrd 6
takinp out
baekw~rd
P~n~-inwrtinp ON l.S
- dwic~
(elutch/bnk~) pFF ~8
Ins~rtlnp d~vic~ ~1 Conilrm~tion
1 eycle of work dropp~d
SOL1
SOLq
SOL3
SO L4
SOLS
SO Lb
SOL~
SO La
Fig. 3. Flow Chart for Sequencer
19
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PB3 Pusher-type Fseder for
~ Work LSI Wprk holdsr ~S4 W~~k taking out
lifter lifter movos
movea up m�Ves moves down LS3
forward bsckward
(lifts a piece of (including work
work) elamp)
~ Partrinserting
devics starts ~$6
operetinq ~-SS
Iproees~iny)
Confirmation of work droppad
Push~r-type F~~r for takin
work holder . out moves
move~ ~1 forwsrd
beckward
(includinp work cismp)
Fig. 4: Block Diagram
PB~ PBZ OL Motor for driving
M parts-in~er2inq maehirn
~ ~ b
~ M 1~ R? Rq R~Z R~p RIS R6 R!< R13 F~~r for ukinp out
~ R, AutomaNe selsetion p~ ~~q~ ~ mov~f forw~rd
PB
R-
yR~2R 4R~6 R3 Rl
~-IHHH : Autometlc operotion t3
R? R 4 q10 R13 ~
` Rw p~b~r for ukinp out
~b 6 mov~s b~ckw~rd
PB4 R2
R~ Autometie stop q~~
R ~ 6 Th~ Ilmits of forwud mov~
R� m~nt of fNd~r for t~kinp out
LS R~ Confi?minq work hat dropp~d ~S~ � Th~ Ilmib of b~ekwod mov~�
q2 R~ Rq R6 R~Z R~q R6 RZ Fi12 l5 pa pl3 m~nt of fNdv for t~kinp out
Re Work Iifter su~nds F--~ R" St~rt of p~rts-Ins~rein0
- PB11 RI 19 m~chln~
A~
PBS RS R17
R R R A6 `Sd R~~ Oripinal podtion of inprtlon
9 ~1 ~Z R. Work lifter dssc~nds R~S R~ Rq
- R 1 Rr AU%Ill~fy IflN~tlOfl
RIO ~ R1'1
P86 Rn I
i RS R6 SOL~
~ _ _ Work Iift~r ~sc~nds (up)
Rs Upper Ilmitt of work liftsr a~esnt - 5~~~ Wprk Iih~r d~sc~nd~ (down)
~ R~ Low~r limits of work Iift~r de~e~nt R9 R~p SOL;
~
~ Work hold~r sdvene~s
RZ RS R~ Rg R11 R16 RIS R~ puther�tVp~ work hold~r movss SO~y
~~Fq ~ forward - Fi R q SOI. W~rk hold~r ntrsst~
1 13 S FNdK for Ukinp Out
Wv~ne~s
PB~ R9 SOL6 FNd~r for t~kinp out ntn~n
R2 Rl3 R14 Rlb R19 RIS R12 DC24V
R
M~~H , Work hold~r movss bsekward � SQ~~ Ctuteh/bnk�
Rt SOLs
PBS Rt0
LS~- Ths limits of work hold~r
R, forwsrd movsmont
LSS Th~ Nmitt of work hold~r
~ bsckw~rd mov~m~nt
a~ey b Fig. 5. Relay Sequence Circuit
2-2. An Example of Designing
Fig.2 is a profile of the machine. Explanation of its
~ operations is given in the sequence flow chart in Fig.3, and
a rough idea of the machine can be grasped when fhe
flow chart is compared to a rough sketch of the blo~k diagram
in Fig.4.
The sequence circuit for the rather complex machine
movements can be drawn as showr in Fig.S when using con-
20.
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- o
~
a~ �
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M 3101f O~ U1f13~d (l~ f~ 1~ ~ � �
_ c~ uo~i~ow~ jo uo~i~tod ~~u~0~~p ~
� lno Ou~~~l ~o j ~~paay ?o v~ ~ ~ � � � ~
g ~u~w~now p~~M~aoq jo s1~w~~
~i ~~PIo4 ~I~oM ~o luaw ~ ~n u> � � � � �
�anow p~ann~aoq yo ~3~w11 ~41
j ~~PIo4 ~I~oM ~o ~uaw t3 a � � � ~
d �~now p~~~n~o j yo ql WII �41
Z f~JOM j0 3UYWYAOW y M ~ � � ~ ~ � � ~
~ PIYMUMOp j0 ~IIWII JiMO'~ J
~IOM j0 IUYW ~ N N � �
-anow p~oMdn jo p~w~~ ~addn
paddoip ~
~ay ~~oM ayi uop~w~~ juo~ ^ ~
o ~
a~
7
Ao~ad ~ a+ � Q
~
J ~
6~Q~8 y ED CO ~ � � ~ ~ � a
T
~
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yo1n~~ y n n O
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o c3ae~la~ 1no Ou~~ai ~o+ ~~pae~ y~u ~o � 4.
r ~
4 O
~
p taauonpa ino Ou~~ol ~o~ ~apae~ O n ~ ~
N ~
] J ~
F c3Qe~3o~ ~ePlo4 ~I~oM ~O v v�� E
] ~
~ J 01
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~puoxap ~etlll ~O a cr � � � ~ � � ~ ~
LL
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spue~~a ~o3)Il N ~ ~ � �
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7
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n ~ o a : ~ : o
o ~ ~W u w D o o u~�
c c e
o' ~t`� a 'C o L 5 L o~
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U~ a ~ ~ a C r n ~
W o Z~~~~� w D
c
e c
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a' 3 a' a� = a� a' ~ tan
- 21.
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ventional relays. The sequence is still short of providing
perfect interlocks but is sufficient to provide a cer.tain degree
of sequence of operations.
The sequence circuit is so confused that a man who has
been engaged in the designing of machinery would hardly
be able to draw up such a plan. Table 1 is a table of reference
for symbols.
T.et's now draw up a sequence using a sequencer, We here,
however, assume that the part of the sequence corresponding
to starts and emergency stops is the same as that of conven-
tional sequence circuits, and thus omit that part. Therefore,
written in the program chart is a sequencer of the pin-board
type (being of a diode matrix type, input points can be used
repeatedly) from the start of operation to its termination.
Fig.6 shows the result of the work, and the time needed
to make entries in the chart was less than 30 minutes. The
round spots in black show the positions where diode pins
are inserted. The great merit of a sequencer is that even a
person with no knowiedge of electricity can take full advantage
of it. Even for a person well experienced in the designing of
electrical equipment, it would take half a day to design a
sequence c'ucuit using relays. Suppose a foolhardy designer
of a machine has taken on the task: despite 2 or 3 nerve-racking
days and after using many more relays or pushbutton switches
than are actually needed, what he comes up with will be a
_ circuit wired by a labyrinth of wires.
COPYRIGHT: 1981 Fuji Marketing Research Co., Ltd.
CSO: 4120/288
22 .
~
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SCIENCE AND TECHNOLOGY
TREND OF OPTICAL-FIBER COMMUNICATION STUDIED
Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 pp 24-33
[Article by Sadakuni Shimada, member of NTT Yokosuka Electrocommunication]
[Text] 1. Introduction
Low�loss optical fiber was made public 10 years ago. Since
then optical fiber technology and photodevice technology
have made remarkable progress. As for optical fibers, 0.2dB/dm,
which is said to be the ultimate loss value for silica materials,
has been provenl>� ~?d as for semiconductor lasers, average ~
life times of 100,000 hours or more have been established2~
for 0.85Nm-band GaAIAs devices in actual operating conditions
(up to approx. 50�C), and development of InGaAs devices
of the 1.3�m band or the 1.S�m band, which are the loss
valleies of optical fiber, is proceeding3>. Therefore it can be
said that the main technoiogies needed for optical communica-
tion systems have almost been developed.
System experiments in on-the-spot environments started
around 1975. From 1976 throug,h 1979 approximately 100
systems all over the world were tested in various fields, such
as public communication, CATV, computers, and leased
communication for electric-power companies, railroads, plants,
expressways, and military facilities4>. These tests have con-
fumed the predictions about light transmission systems of
being fitted to wide�band transmission of graphics, in which
strong induction resistance is given and a long relay interval
can be achieved. Also, the strength of optical fiber has im-
_ proved and the life-time of optical devices has become longer,
confirming that light systems "can be used".
� In recent years large�scale systems have been put into
actual use or are planned to be used as shown in Table 15~6)
This table includes, however, those systems for which the
plans have not been finalized. Th.e technology trends on the
system side since our 1978 April special issue can be summariz-
ed as follows:
(1) Optical fiber has improved in terms of loss, and develop-
ments of InGaAsP/InP semiconductor lasers have brought
23.
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.
~ ' E
.
~ a " E ia
X ~ ~ C � N
~ e ~ s ~ v
0 0 � o E o n + E ~ o c~
' }t. t ~ ~ Y L T+ w M
c C a Mg~' ~ ~ � "
oo c Ex a M .v o .
~ ~ ~ ~i E ~i ~ c ~ D ~ � � E ~v S
M
t Y E ~ D Y D E ~ ~ ~ O~ E ~ S ~ M 7C ~ O V C"
U ~ ei �888 wY oi��wY :oo �C� n i� ug. o
3 o pQc7 p~ p O CM c p~o i m O 4 M O u ~ 6
Q o ~ F- ri vl r' 1- Cl ; a f~l N~ Q ~ A ~0 w 7
E
d
~j ~ V > U c > p
~ > O
C ~ ~ D~ fV L ~
o g ~ n 4 X � o
.y .M c ry w q ~ ~ ~ : + ~ ~ N
M ~O
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'E ~ ~ ~ g ~ r, ~ ; ~ ~ ; ~ ~ S g
c H ~o in ~ ra, a ~ ao F- v� vS H F- ro
m
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p~ Z LL
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N F ^ ' O e 1! C~ O~ 0~ 01 0~ Oi O~ O~ OI 0~
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- ~24. .
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practical use of the 1.3�m band or the 1.S�m band within
reach.
(2) The reliability of 0.85�m-band GaAIAs/GaAs semi-
conductor lasers has increased to an average of 400,000 hours
at 50�C (one million hours or more at 25�C). The study' of
- the optical fiber reliability improvements has advanced,
prompting the populazization of the 0.85�m-band system.
(3) Practical use of the single-mode fiber system has become
possible by progress in the technologies of manufacturing
single mode fiber, of coupling it with semiconductor lasers,
and of connecting two single-mode ~bers together (connector
and splicing).
(4) Progress in the fabrication fechnique for multi-demulti�
plexers permits wave�length multiplexing technology to be
used in the system?~ �
(5) Progress in mode control technology for the semiconduc-
tor lasers has improved high-speed transmission technologya>
and direct-modulating analog transmission technology9~, which
has promoted study of mode partition noise and modal
noise I o) i i),
(6) Progress in refractive-index distribution control technol-
ogy for graded-index fiber has made it possible easily to obtain
the fiber bandwidth of 8UOMHz/km or higher. Also analyses of
graded-index fiber transmission characteristics have progressed.
(7) Progress in research and practical use of optical splitters,
isolators, circulators, attenuators, and switches have contributed
much to the characteristics improvement and the function~l
integration of light transmission systems. Many kinds of
measurement equipment have been developed for practical
use 12~.
(8) Much attention has been given to integrating the
electronic circuitry and photo-devices, and is primarily aimed
- at miniaturization and the improvements of characteristics
and reliability, such as unification of PIN photodiodes and
FETs13)ia),
(9) As for applications, discussions have already begun on
applications for subscriber systems including the possibility
of new service introductionls>. Also, development of a marine
transmission system and an on�the-spot testing system for
it have already been announced16),
These trends will be explained below. However because
of limited space, the long wave-length band technology
(Chapter 2), which exerts a vital influence on system configura-
tion, and the single-mode fiber technology (Chapter 3) aze
. explained in detail, then the recent achievements are introduced
in Chapter 4 about the photosemiconductor device reliability,
which greatly affects the practical use of optical comFnunica-
tion systems. Also, progress in wave-length multiplex trans-
mission technology, of which applications are expected in
future subscriber systems or large-capacity transmission systems
are covered in Bibliography entries~)~ i~~, and 1B>.
25
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2. Long Wave-Length Band Technology
line loss in silica optical fiber varies with the wave-length
of the light used, as can be seen from the curve in Fig.l (upper
part). Generally speaking, the curve is shaped and Ralley
scattering is dominant to the wall on the short :vave-length
side and the molecular oscillation absorption of silica accounts
for the wall on the long wave-length band. The loss peak for
0.95�m, 1.25�m, and 1.39�m is an absorption loss based on
the OH radical as impurity. Some fibers recently fabricated
by the VAD method suffer little OH-radical absorption loss19),
This is the result of a dehydration process that uses chlorine.
In the MCVD method, the content ratio of OH radical is
limited to several ppb's.
The loss valley lies near 1.2�m, 1.3�m, and 1.5 to 1.6�m, ~
the minimum ultimate loss being 0.2dB/km in 1.5 to 1.6Ecm.
100 R...t~ S T'~- U--~^ V W-'1
50
~ 10
C g
0
.
d ~
i~ 0.6 ,
0.1
0.8 1.0 1.2 1.4 1.8 1.8
C_.4tr ~ ~ L~Oht+mlttinp dwic�
w~wl~npth for tucc~ful
GsAIA~' room-t~mp~ratun cw oseillstion)
InGaA~ _ _
InG~AtP
, I I I I ~ ~ ~
0.8 1.0 1.2 1.4 1.6 1.8
~ Liphtsl~t~etinp d~vie~
>
~ S~ Inf3aAfP d�
" InGaA~
M ~ ~
Il 0.6 ~ ~~1
1 `
1
M I ~
o ~
�
0
0.8 1.0 1.2 1.4 1.6 1.8
W~v~ I~npth (�m1
Fig. 1. Fiber Loss Spectra and Various Types of
Light-Emitting/Light-Detecting Devices
Applied to Eech of Optical-fiber Wave
Length Regions
_ 26.
, ~
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Table 2. Selection of Optical Fiber and Wave-length
Corresponding to System Requirements
BIt rote Grad~d-index fib~r Sinpl~ mode fib~r
Rapsater (Mb/~)
speeinp 0.85�m 1.3�m 1.5�m 0.85�m 1.3�m 1.5�m
O O O O O
~ ~ ~ (with sufiiei~nt (Braded-index typ~ i~
tOkm lou maryin) better)
400 IB~C) (8) (8) (C1 ~ ~
O O
30km 100 (q) ~ 0 (A) (praded-indsx type
i~ b~tter)
x x z x �
~0 lA) (el (B1 fA1 ~ lCl
0 Ea~y to us~ now
p U~abl~ but un be subaftuteQ by oche?
o Herd to w~ b~uuw of inerplnal spacinp
x OiHieult to sehisv~
(A)loa limit
(B) Modal di~p~nlon Iimit
(C1 Mod~ partition ~ois~ Ifmit
If such a loss curve appears at the beginning, use of the .
1.3�m band or the 1.S�m band must be considered. Actually
however, the large OH-radical loss covered the loss valley of
- those wave-lengths and the loss valleies of only the 0.85�m
band and the 1.OS�m band could be seen. Therefore it seems
natural that the 0.85�m band is used first. Such bands as the
1.OS�m, 1.3�m, and 1.S�m bands, longer than the 0.85�m
band, are generally referred to as long wave-length bands. They
may be classified in more detail such as shown below, however,
because their uses or dopant material and photo-semiconductor
material of the optical. ~ber differ depending on their wave-
lengths.
R band 0.7�m band (0.61 ~ 0.80�m)
S band 0.9�m band (0.81 ~ 1.OQum) ,
T band l .l�m band (1.01 ^-1.20�m)
U band 1.3�m band (1.21 ^-1.40�m)
V band 1.S�m band (1.41~1.60�m)
W band 1.7�m band (1.61 ~ 1.SO�m)
How to name the bands should be fully discussed because
of their large influence on the system. R in the above stands
for Red, and the letters following R are sequentially given
as the band names for each 0.2�m. It is populaz for the wave-
length to represent the band, but the merits and demerits
of using the frequency instead should be discussed.
A long repeater spacing is essential to transmission system
_ configuration. Therefore the less line loss there is in the
transmission medium, the better. Of course use of the long
27 .
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wave-length band will become more important as research
on long wave�length band semiconductor device progresses.
The transmission system design requires that the type
of optical fiber and its wave-length be selected to meet the
requirements for repeater spacing and bit rate. Table 2 shows
four examples of setting two repeater spacing, lOkm and
30km, and selecting two bit rates, 100Mb~s and 400MbJs,
for each setting.
The above results are arranged as follows:
_ (a) For lOkm or less and 100Mb/s or less: Graded-index
fiber can be used. The most useful wave�length should be
selected based on economic efficiency, reliability, and ease
of use*. (*In bands of 0.9�m or lower, the costs of semicon-
ductor lasers and optical devices can be reduced by shared
use in the video disc. Visible light can be used for very
short distance and provides easy handling and maintenance.)
(b) For lOkm or less and 400Mb/s Qr more: The graded
type is dif~cult to use because of the band limits. A combina-
tion of single�mode ~ber and longer wave�length region is
better. At the higher bit rate, the 1.3um band is better.
(c) ~ For 30km and 100Mb/s or less: Only the longer
_ wave-length region can be used. It is not necessary to use the
single mode fiber because the grade-index ~ber serves the
same purpose.
(d) For 30km and 400Mb/s or more: Only the longer
wave-length band and the single mode fiber can be used. For
1.S�m, limits are imposed by mode partition noise.
As a:esult, the system requirements can be met by using
graded�index fiber for the lower bit rate and selecting** the
best wave�length for the repeater spacing. (**It is not necessary
to use only 1.3�m or 1.S�m. As the wave-length increases
from 0.85 1.1 1.2�m in this order, the line loss is reduced
to around 1 dB~km. At this wave�length, fiber with a large
OH-radical loss can be used. Also it is not necessary to change
the profile for each wave-length because the narrower is the
wave-length selection area, the smaller wilt be the change of
bandwidth.) The single mode fiber must be used for the
higher bit�rate. If a longer repeater spacing is required in
addition, only the single mode fiber is available and the low�loss
band such as 1.2 to 1.7�m is preferable.
The factors limiting the repeater spacing are explained
below. The loss limit gives the maacimum repeater spacing at
which the prescribed error ratio can be maintained by keeping
the receiver's S/N ratio decreased by line loss in the optical
cable. Even if there is some margin for loss, the band limit
by the optical cable will cause distortion in the waveform,
increasing the error ratio by intersymbol interference. Although
waveform equalization can improve the S~N ratio to some
extent, the narrower the band width, the greater the loss
penalty increases and the finer is the equalizer's adjustment,
28.
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thus creating problems for practical use. Usually the penalty
can be suppressed to 2 to 3dB by inhibiting the spacing to
that length, which is called the band limit for repeater spacing.
Table 3 shows band limit factors. Model dispersion is
predominant in graded�index fiber, while in the single mode
fiber, the mode partition noise10~ of the semiconductor laser
is predominant even though the band limit is determined by
the structure dispersion and the material dispersion. This is
because noise is generated when waves go through a trans-
mission line that provides a different delay time for different
wave-lengths, because the actual semiconductor laser gives
multiple oscillation wave-lengths and each wave is either
generated or not generated at the leading edge of the pulse.
The higher the bit rate, the faster the pulse rises, increasing
the number of oscillation wave-lengths and the spectrum
width w(half-value width). The longitudinal mode is produc-
ed even if the transversal mode control is executed, providing
only one transversal mode. Usually 3 to 4nm (30 to 40A?) is
given as the value of w if the bit rate is 400 to 800Mb/s.
The repeater spacing L(km~ due to the mode partition
noise limit is given by the following equationZ~~.
JoL=3.Sx105 mlW
fo is bit rate (Mb/s), w the above-mentioned spectrum width,
and m the fiber's dispersion (ps/km�nm).
Next, which wave�length to use in order to get the longest
repeater spacing is discussed20>.
The fiber I, shown in Table 4, is a single mode fiber designed
to provide zero dispersion at wave-length of 1.29�m. While
fiber II has a larger refractive index to provide zero disper-
sion at 1.SS�m, its core diameter is half that of fiber I.
The actual minimum loss value after cabling is expected
to be as shown in Table 4. The minimum loss value is 0.3dB/km,
which is obtained when the fiber I is used at a wave-length
of 1.SS�m.
The reasons for the loss are explained in more detail below.
Tha inherent line loss of the optical fiber consists of the losses
caused by Railey scattering, ultraviolet absorption, and infrared
absorption. However, for wavelengths of 1.29 or 1.SS�m,
Railey scattering loss is the majority. Therefore the inherent
loss at a wave�length of 1.29�m is greater than otherwise
because the Railey scattering ]oss is proportional to a'" . For
example, for fiber I, the value is 0.31dB/km for 1.29�m or
0.18dBJkm for 1.SS�m. Also the inherent loss of fiber II is
greater than that of fiber I because, as the amount of dopant
increases, the amount of Railey scattering increases. The
inherent loss in fiber II is 0.50 and 0.28dB~km for wave-length
of 1.29 and 1.SS�m respectively.
Actual manufacturing of the optical fiber results in imperfect
structure, such as residua] bubbles, microfluctuation at core-
clad boundary, and f7uctuation in tl~e outside diameter, all
of wluch increase the loss. This loss is roughly proportional
to tlie difference in refractive index. The OH radical loss at
29
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a wave-length 1.29�m is somewhat larger than at 1.SS�m.
And the larger the refractive index difference, the less is the
microbending loss during cabling. Recent progress in the
technology for optical fiber manufacturing and cabling can
reduce the loss caused by all these factors to 0.1 to 0.2dB/km.
Fig.2 shows how a long repeater spacing can be achieved
- for each bit rate when using these fibers (SI, SII) and graded-
index multimode fiber (GM). The top curve in Fig.2 shows
the maximum spacing when a semiconductor laser is used as
the light source and an APD is used as the detector. The other
5 curves give the calculated values under actual conditions as
follows:
Input power into fiber -SdBm (Average power for mark
ratio of 1/2 and occupancy ratio of 1/2)
Received level -70.4 t 101 ogfo (dBm) (Error ratio:l0'" )
(fo:Bit rate (Mb/s))
Splicing 1 position/2km
Loss of connector, etc., SNR deterioration 4dB
Semiconductor laser spectrum width 3nm
The above results are arranged as follows:
(1) The combination of SI and wave length of 1.3�m is
best for bit rates of IOOMb/s or more.
(2) For any lenthening of the repeater spacing, the combina-
tion of SI and a wave length of 1.SS�m is recommended. How-
ever the existing semiconductor laser can provide only up to
approximately 100Mb/s. Further improvement in the bit rate
requires improvements in the oscillation spectrum of the semi-
conductor laser. (The combination of an external modulator
and a DBR laser22> or semiconductor laser is an example.)
(3) The combination of SII and a wave length of 1.SS�m is
not as effective because calbe and connection loss are
larger.
(4) In the case of GM, the bit rate can not be as high even
with a wave length of 1.3�m because of the band limit due to
modal dispersion.
Finally, Table 5 shows the examples of experiments in the
_ 1.3=m and 1.S�m bands. An example of analog transmission
using a semiconductor laser is also shown in the lower part of
the table. Fig.4 shows the relationship between the received
light power and the error rate. You can see that the curve
produced by the mode paztition noise for the combination of
a wave length of l.S�m and 400Mb~s flattens out. At 100Mb/s,
the low�loss chazacteristics in the 1.S~un band can be used.
3. Single Mode Fiber Technology
A single mode fiber is best suited for the best transmission
system for sending more information over a longer repeater
. 30
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500
Mexim~m ~alue (1,55
Nm. 0.1 BdB/kml
100 Limit due to mode
1.55�m
E partition noise
~ 50
1.3�m
c
M 1.55�m
m ~
Q 10 0.85�m ~
m O
~
5 Limit due to model
dispsrcion
\
Coexiel ceble system ~
1
20M 50M 100M 500M 1G 2G
Bit rete (b/a)
Loss (dB/km) Splicinp loss
Line Fiber
1.29�m 1.55�m (dB/km)
Sinple mode I 0.67 0.50 0.15
Single mode II (0.91) 0.63 0.75
Grsded�index type 0 69 2�74 0.1
(1 GHz/km) (0.85�m)
Fig. 2. Relationship Between Bit Rate and Repeater
Spacing (o mark: Experimental Results)
spacing. Higher expectations of it may have caused single mode
fiber to be used in all areas. Generally however, it is more dif-
ficult tp use single mode fiber than to use multimode fiber, but
the difference has been appreciably reduced over the past few
_ years. The technological trend in this area is described below.
Table 6 shows the differences between single mode fiber and
multimode fiber (mainly the graded-index type).
As for line loss, little difference exists between the two,
though the single mode fiber has less loss by as much as the
lesser portion of the Railey scattering loss caused by the smaller
refractive index difference (0.2% or so) between the core and
the clad. As for the bandwidth, the single mode fiber can
be wider. It can be even wider if the light-source spectrum is
made narrower.
The connection (splicing, connector), or coupling technology
of LD�to fiber is more difficult for single mode fiber. Fig.S
shows the connection loss when the displacement (abscissa) and
folding (ordinate) are given.
Splicing loss by the fusion method averages O.1dB for multi-
mode fiber and 0.3dB for single mode fiber. The loss varies
with the fiber's refractive index distribution or dimension ac-
31
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Table 3. Band Limitation
Multi- Sinple
mode mode Rsmerkt
Unrsleted to lipht- Mode
souree spectrum ditpersion O -
Structure. ~ The bandwidth of an L�
R~letsd to lipht- dl~persion lonp fibsr fs d~t~rminW
~oures tp~etrum by sp~ctrum width (w1
Meteriel and velus (m) of both
dispersion ~ ~ ditpersion: es follows:
4.4x105x mx,LlMHz)
Table 4. Single Mode Fiber
Flb~r I Flb~r II
Ratio oi differenee in rsfractive index (%1 0.2 1.0
Cut-otf wevs-Isnpth (�m) 7.1~7.2
Cors diamater (�m) 10 4.5
Weve lanpth ~p (�m? 1.29 I 1.55 1.29 I 7.55
Fibsr lott' (d8/km) 0.47 0.30 0.71 0.43
Fiberditp~nion" (PS Km�nml 4 19 14 4
Splicinp lots (dB) 0.1 0.5
' Loa due to intrin~fc eb~orption in sllica metsriel, fmp~rfect
strueture, OH sbiorption, a~d ceblinp proeess.
Within width oi ~O�ZOnm.
Au
SIOZ
OBR arp S~p~ratlon ley~r
Output quid~
Active ersa Au
SIOZ
~p-Ga1nAsP
~p-I nP
Refroctlve index ~Gaxlnl-xAsyPl.y(A.G.J18Q~1.3�m)
3.2 3.5 ^"~^P
r+--r-- n-Gauln1.uAsvP1 �v(O.G.1~ga" 1.24�m)
8.796 Act(v~ I~Y~r n-InPlSub.)
bI Output�outl~t puid~ Iln�
6.9%
(The Bragg reflection determines the oscillation wave-
length, providing only one osciltation spectrum and 1/4
wave-length cha~ge caused by changes in temperature
as compared with usual LD.)
Fig, 3. 1.3�m DBR Laser
32..
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~ 0�4 ~
~400Mb/s 20km
800Mb/s40km ~ (1�51�m)
(1.30�m) ~`o
~
� ~ a6
~
o` ~
w` 100Mb/~ 58km
10'8 (1.51�m1
~~�10
10'12
-46 -40 -35 -30 -26
Av~ny~ r~cNved pow~r (d8m)
Fig. 4. Experimentai Results of Error Rate Charac�
teristics When Using Single Mode Fiber I
Ta~ble 5. Transmission Experiments at 1.3�m and 1.5� Band
Wov~- Tnmmli- Optlcal D~t~ of
I~~pth BIU rat~ tion dl~qne~ Optful fib~r lot~ announe~-
(I+m) (Mbh) (km) flb~r typ~ (d8/km) m~nt
1.27 32 63.3' OM 0.88 1978.8 (22)
1.296 100 82.8 GM 0.8 1979.3 ~(Z3)
7.296 400 20 dM 0.8 do.
1.31 400 34 S 0.73 1979.8 l~Z4)
1.31 800 30 S 0.73 do. f
1.31 800 40 S 0.8 1980.4
1.61 100 58 S 0.6 do. (25)
7.81 400 ZO S 0.5 do.
1.Z9 ~v = 32 3 0.87 1979.9 (2B)
7.29 ~v = 17 S 0.84 1979.10 (27)
curacy (refractive index differences, profile, fiber's outer dia-
meter, core diameter, core eccentricity, or core ellipticalliza-
tion). Single mode fiber requires more accuracy and research28~
is continuing with such countermeasures as (1) to adjust one
core to another by rotating the fibers when connecting them,
(2) to adjust the cores by a fine control mechanism, (3) to
narrow the discharge beam, thereby prohibiting the fiber outer
circumference coincidence effect due to surface tension from
producing the core-position displacement and (4) to decrease to
- 1 degree or less the error in the rectangular angle between the
fiber face and the fiber axis from 90 degree when cutting the
fiber as part of preconnection preparations. It should be deter-
mined whether it can stand use on the spot.
For the connector, the fiber can be set at the center of the
33
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Table 6. Diffe~ences Between Multimode Fiber and
Tg Single Mode Fiber
It~m Multimod~ S(nyl~ mod~ fib~r
fib~?
Lin~ lofr Sam~ Sam~ (favorabl~ if ~ is
TnnsmN-
fion charae� B~ndwidth ~ 1 G Hz 100G Hz'
tnirtic~ (pK km) (sWctrum width: 10~?)
Conn~etlon (spl0cinp, Easy Diffieult
connsctor)
~D-fib~r eouplinp Easy DlHieult
Mlerob~ndlnp loa ~0.1d8/km Ly~ probl~matical than
(nblinp, J~ek~tinp) mult(mod~ (fitt~d to
m~rln~ pb1~7)
Ram~n festt~rinp. Larp~ tolN~ne~ Smsll tol~nna Povwr
Brlll~n futt~rtnp pow~? (..:t00W) (~3W)
Co~t Strict dlm~nslon
tol~nnen rai~ th~ eostt
An~lop trsnuniulon Probi~m~tiul L~u probl~m~tlpl
(mod~l nolw)
F~ult location E~~y Dlfficult
� Limk~d du~ to mod~ psrtitlon noiN
" WIII b~ probl~m~tiul wh~n usinp hiph-output lat~r
plug by simply inserting the optical fiber into an accurate hole
at the anter of a ceramic mount and fixing it with adhesive29>.
This is called FA (Field Assembly), meaning ttiat it can be
assembl~d in the field. This is the only connector~~ that is
practical for use with single mode fiber at present. It can be
used for a single mode fiber due to its high accuracy, though
it has been originally designed for use in on-the�spot experiments
of short distance transmission systems with graded�index fiber.
Tolerance for the fibre and the hole is an average displacement of
0.7Eun and a folding angle of 0.3 degrees. The relative displace-
ment of the plugs on both sides must be considered when
thinking of the connector. However a random combination will
multiply the above values by ~/2, assuming averages of l�m
and 0.4 degreea rtspectively as the displacement and the folding
angle.
The loss of the actually manufactured connector was, in the
1.3�m band, an average of O.SdB and 1.2dB maximum. If
matching material is used and the gap at the connector part is
filled, the loss is only 0.3dB. 'The Fresnel loss is calculated to be
0.3dB. However the actual connector may have in some cases
very little gap, tending to make the differer~ce due to the pre-
sence or nonpresence of matching material somewhat less than
0.3dB. The characteristics of the connector for use with graded�
index fiber, as a reference, has reached a stable technological
level, with little dispersion: 0.4dB as average loss and 0.6 to
0.7dB for the worst case.
D'uect coupling of an LD with a single mode fiber, as shown
in Table 7, will give 10 to 11dB of coupling loss. However, by
~
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- Sinpl~ mod~ iibsr
2,0 (cors diam~tsr: 10�m, 0~0.23%1
Gredsd-Ind~x ilb~r
(cors diam~tsr: 50�m,0~1%, uniform excitstion)
m 1.b
0
� O.SdB
~
m
q ~.0 ~.4 ~ ` ` ~ ~ ~
P ~
~ 0.3 ~ ~
. ~
~ - _
~
LL O.b 0.2
0. \ ~
\ \
~ \ ~ \
p 1 ~ ~ ~ ~ 1
0 1 2 3 4 5 6
Ditplacemsnt (�m)
Fig. 5. Relationship Between Loss and Imperfectians
at Optical Fiber Connections
mark: Achieved value on average of FA-type
� connectoraccuracy)
Table 7. Coupling Methods for Semiconductor Laser with Gptical Fiber
Allow~bl~ dlrpl~art�nt
In th~ cn~ of stnpl~ mod�
Couplinp lou (dB) flb~r (�m)
Couplin0 m~thod Structur~ Sinpls Multfmods
mods tlb~r tlb~r L~n~ Flbx
Dir~ct eonnection ! ~Q""~~ 6~7 1
i
~
Fine lenc ~ 3^�4 1 0�2 7
1 ~
Top�bsll teper 1 6^~6 1 0.4
(with belt Isns end semlbsll lens) ~
~ ~
Fine Isns + Cellhock 4~ 1 0.2 1
( '
using a Cine cylindrical lens (Fig.6) or by machining the fiber
face, the connection loss can be reduced to 3 to SdB31)
Research on making the module version is proceeding, and has
almost reached the practical level. At present, countermeasures
are being sought against changes in the relative position of the
LD and the fiber, caused by changes in ambient temperature or
LD radiation pattern due to oscillation mode skipping (which is
not a problem for the transverse mode-controlled LD)3a)
A method that blocks the retlection light by inserting an
isolator between the LD and the fiber is also discussed3s>
Technological progress has succeeded in reducing cabling loss
to 0.1 to 0.2dB/km or less for overland cable. The single mode
35 . ~
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Ssmiconductor lassr
, (0.4 x 0.3mmZ)
Heat sink
Cylindrical lens
(20�m in diamater)
Single mode fiber Lead wtre
(125�m in outer diameter)
�
Fig, 6. Coupling for Semiconductor Laser with Optical Fiber
Junction temperature (�C)
300 200 100
10�3
\ 103
\
\
\ �
\
~~~.q InGaAsP
EQ=0.9~-1 eV 7 04,.,
't ~
~y ~ m
- ? ~ E
~ �m
o 5 1059
~ GaAIAs ~
o ~ lEa.0.56eV)
- \ c',
~ U
\
O ~ 0-6 ' O6
\
\
\
\
\
10�~ ~
2 3
7000/TlK�~)
Fig. 7. ~ife Time of Light�emitting Oiode
fiber generatly reduces cabling toss more than multi mode fiber
because the single mode fiber becomes more highly microbend-
ing resistant as its refractive index increases. For submarine
cables, the optical fiber can be inserted36)3~) into copper pipe
_ in order to avoid the influence of sea-pressure and by applying
the pressure to the ~ber (loading the lagging with part of the
water pressure). The former suffers the problem of flooding
- of the copper pipe when it is damaged, so a recommendation
has been made to fill the pipe with jelly material. In the latter
method, since side pressure is applied, the single mode fiber
will be easier to troubleshoot that the other.
. ~
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~
0 96
4 90
; 70
0 50 m,: 1.0
y 30
�0 20
~ 10 ~
~ 5 o Output: 5mW a
� a Ambient temperature 50 C
~
E
~
u
U
Q 104 105 106
Calculated life time (hours)
Fig. 8. Weible Distribution for Calculated Life Time
of GaAIAs Semiconductor Laser in 0.85�m
Band
In nonlinear scattering, the threshold value determines the
fiber's tolerant transmission power. The LD output can be
_ neglected because it is only a few mW. The threshold value
cannot be neglected, however, when lasers with more output
are used for submarine non-repeatered, transmission, optical
fiber break-point detection, or laser machining. If the light
source is near to an ideal single wave, the threshold is less for
Brillian scattering, but, as the spectrum width is narrow, SOMHz
(1.6x10`4nm), the Raman scattering38~ occurs first in a normal
laser.
- The normal method of detecting breaks or faults in optical
fiber is to send an optical pulse to detect the reflection wave
created by the break point and measure the delay time, thereby
determining the distance to the point. However this method can
not locate all faults because light does not always return. It
depends on the fiber face conditions at a damaged point.
Another method is available that uses the Railey scattering,
an inherent property of the optical fiber. The Railey scattering
is caused by the nonuniformity in the glass and scatters the
light in all directions. If backward scattering (i.e. reflected light)
can be collected by a light directivity coupler, the output that
attenuates as it passes through the optical fiber can be obtained.
The curve will show a gap if the light stops at a break because
the reflected light scattered from any points behind a break
are drastically weakened. These phenomena will tell you the
fault location, the fiber's loss by the curve gradient, and by the
losses at the break or splicing point how large the gap is39)ao>
Now, assuming that the light output is IOmW (inside the
fiber), the loss in the optical ~ber (in the multi mode) is
2.SdB/km (wave lengih: 0.85�m), and the Railey scattering _
loss is 2.OdB/km; the detectable distance will be l lkm by the
backward scattering method and 17km49> by the Feesnel re-
_ flection detecting method. The pulse width is 100ns (therefore
distance re solution is 20m) and the receiving side uses a high-
sensitivity system that uses averaging.
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Also if the section is perpendicular to the fiber axis, the
Fresnel reflection level is -14dB and if the section is tilted or its
surface is not smooth, the reflection decreases even more. The
backward scattering level is 0.85�m, 32dB lower.
As the wave-length increases, the Railey scattering decreases
~ in proportion to a'4 , decreasing the backward scattering by
an equal amount. Also, however, the loss becomes less so the
detection distance is elongated, e.g to 20km at a wave length
of 1.3�m by the backward scattering method, with a fiber loss .
of 1 dB/km, a Railey scattering loss of 0.37d~/km, and a Ge-
APD as detector.
For single mode ~ber, most of the light reflected at ~ber
- face is assumed not to return, therefore, it is necessary to rely
on the backward scattering method. However the low dopant
content of the core liecreases the Railey scattering to a low
level and the ratio of the backward fiber carrier level to total
scattering level is also lower. In addition, the loss of the directivi-
ty coupler tends to increase, decreasing the detection distance
as compared with the multimode fiber; the countermeasure to
this is one of the main problems with using single mode fiber in
_ long repeater spacing systems.
4. Light Sources and Detectors
_ GaAIAs/GaAs and InGaP/InP are typical light source ma-
terials for the 0.75 to 0.9�m bands and l to 1.7�m bands re-
spectively. CW oscillation is generated for various wave-lengths
in an attempt to improve reliability.
If the life of the light-emitting diode is defined as the time
over which the light output is reduced to half the initial value,
the life time for the GaAIAs device is, as shown in Fig.7,calculat-
ed to be 10' hours at room temperature (equivalent to 40�C at
the light-emitting part). Wtule for the InGaAsP device, it-is
calculated to be Sx109 hoursal)
Some GaAlAs devices rapidly deteriorate in terms of the
output caused by dislocation development if they undergo
electri~cation testing of 100mA at 20�C. InGaAsP devices do
not suffer from this and are known to have comparatively
stable characteristics even though they were only recently de-
veloped.
_ Factors affecting the deterioration of semiconductor lasers
in the 0.85�m band have been analysed to a considerable extent,
and average life times of 400,000 hours have been achievedz>
for a fixed output of SmW at 50�C (the highest temperature in
practical use) as ambient temperature, as shown in Fig.8, where
the life time is defined as the time required for the drive
current that maintains the above-mentioned output level to
reach 180mA (the drive cunent increases roughly proportional
to the square root of time). The digital transmission system
uses the pulse driving method, and longer life-times are expected;
approximately ihree times that of present experimental ones.
The 1.3�:n-band InGaAsP laser had a problem in which the
oscillation stopped at temperatures higher than 50�C because
38
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p-1nGaAsP p�typ~ ~I~ctrod�
pInP (Clsd isyer)
InGaA~PlActive leyer) "~~P
v-type alectrods p,~P
---e-InP
~p-~P InGaAsP(Actfv~ lay~r)
~p rlnGaAsP
~n-InP (Subttrot~? -!nP(Substrots)
n�typ~ ~I~etrods
n-typ~ alsarode
(c) PCW (Pleno-Conv~z Wavspuide), NEC
(a) BH (BurUd H~t~rostructure) Elsetriul Communiwtion
Laboratory, Hitseht
p-typs el~ctrods
/p-type electrod� p'InG~AaP
in-1nGaAaP ~t^P
~~1nP n-InGaAsP
- 1nGaAsP(Activ~ laysr)
~ \n-InP InG~AsP (Activ~ I~ysr}
y~InP n-InP
Activity ar~a n-1nGtA~P
~n-InP lSubstrats) n-1nP (Subttr~te)
~ n�cype ~learode n-typ~ ~I~ctrode
(b) BC (Buri~d Crese~nt), Mitsubi~hi (d) SAS (Self Alipnsd Stripe), Fujitsu
Fig. 9. Various Transverse Mode Control Technologies
the threshold value rapidly increased with a rise in temperature.
However, nrogress in the transverse mode control technology
(Fig.9) has enabled reduction of the threshold cunent to 100mA
~or less (20mA for the lower-current one), so that correct oscil-
lation, even at 70�C, can be maintained. Presently the life time
test of over several thousar,d hours is continuing. The present
tendency shown by the drive-current increase rate suggests a
life-time of over 100,000 hours at SO~C46~. Even a 1.S�m-band
device is being developed47~'49~, and its life-time test is also
being conducted.
As compared with the GaAIAs device, the InGaGaAsP device
(1) free of initial deterioration caused by the dark line or
dark spot defects and (2) stable even without surface protec-~
tion because of the low rate of oxide growth on the edge
surface of the resonance device. Therefore the main factor of
deterioration is diffusion of the electrode metal.
Si and Ge devices have now reached a practical level as
detectors. Efforts are being made to develop InGaAs or InGaAsP
devices, which generate less noise than Ge devices in the longer
wave�length region. Under the present conditions, however, a
stable device cannot be obtained due to the impurity of the
crystal used as the APD. Combination of a PIN-PD and FET,
has achieved a sensitivity equivalent to that of the Ge-APD13) la)
39
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5. Conclusion
A set of tools .for the design of optical fiber transmission are
now available. The technologies have undergone on-the-spot
tests, and systems have been placed in commercial use. The
reliability, after enduring the early-stage use, is now proceeding
to the next step, and its application in the field of the submarine
transmission, which requires high reliability, is being pushed.
Japan is taking the leading role in such new research fields as
repeater spacings of several tens of kilometers or more in the
longer wave-length re~on, large capacity transmission at bit
rates of 800Mb/s or more by use of single mode fiber, and
variations in system configuration by using wave-length multi-
plexing technology.
From now on, systems must be configured by using such
_ basic technologies, and optical systems applied to various fields.
The economics of optical systems are still a matter of discussion
but are expected to improve year by year.
Referenas:
1) T.Miya, et al.: Ultimate Low-Loss Single mode Fiber at 1.SS�m,
Electronics Letters, l5, 4 (1979)
2) Wakita, et al.: Test of GaAIAs DH Laser Reliability for Optical
Transmission Use, Nationwide Meeting on Light and Electirc Wave
(1980)
3) Shimada: Optic~l Fiber Transmission System by Long Wave-Length
Band, Nikkei E lectronics, 221(1979.10.1) 114
4) R.L. Gallawa, et al.: A Survey of World-Wide Optical Waveguide
Systems, Topical Meeting on Optical Fiber Communication, TuAI
(1979.3.6-8) Washington D.C,
5) J.Cook: Beil's Lightwaves, IFOC, 1, 1(1980) 22
6) (nformation columns of Laser Focus or Fiber Optics and Com-
munications Newsletter
7) H.Ishio: Wavelength-Division�Multiplexing Transmission Technology,
ECOC, 11. l. (1979.9.17-19) Amsterdam
8) S.Shimada: Systems Engineering for Long�Haul Optical Fiber
Transmission, Proc. of IEEE, 68, 19 (1980)
9) Sato, Asaya: Discussion on Analog Graphic Transmission by Semi-
:onductor Laser, Reseazch Meeting on Transmission System CS
19-64 (1979)
10) Okano, et al.: Intluence of Semiconductor Laser's Mode Distri-
bution Noise in High-Speed Optical Fiber Transmission, Shin-
_ gakuron 62-B, 3 (1979) 199
I1) R.E. Epworth: Phenomenon of Model Noise in Fiber Systems,
Topical Meeting on Optical Fiber Communication, Th D1 (1979.
3.6-8) Washington D.C.
12) Kobayashi, et al.: Optical Cable Transmission Meters, 1979
13) D.R.Smith and R.C.Hooper: P�I-N/FET Hybrid Optical Receivets
for Optical Communication Systems, CLEOS, TUGG 1(1980.
2. 26-28) San Diego
40
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l4) T.P.Lee, et al.: [nGaAs P-(�N Photodetector and GaAs FET
Amplil"ues Used at 1.31�m Wavelength in 45-Mbit/sec and 274-
Mbits/sec Expetimental Repeaters, ibid, TUGG2
15) S.Senmoto, et al.: A Fiber Optic Application to Subscribe[ Loops,
ISSLS (1980.9.15-19) Munich
16) Britain and an ITT Subsidiary Begin Tests of Undersea Fiberoptic
Cable, Laser Focus, (1980.5) 66
17) Miki: Optical Fiber Multiplex Transmission by Wave-Length Divi-
sion, Nikkei Elecuonics, 213 (1979.5.28) ! 18
18) Wave-Length Multiplication Technology on Light Communication,
1978 Wave�Length Multiplex Optical Fiber Transmission Tech-
nology, 1980
19) Kawauchi, et al.: Low OH Technology by VAD Method 1980
20) Itoh, Nakagawa: Discussion about Long Wave-Length Band Single
Mode Optical Cable Transmission System, 1979
21) K.Utaka, et al. ~ Room Temperature Operation of GaInAs /InP
Integrated Twin-Guide Lasers with F�st-0rder Distributed Bragg
Reflector, Topical Meeting on [ntegrated and Guided-Wave Optics,
MC 5 (1980.1.23-30)
22) T.Ito, et al.: Non-Repeated SOkm Transmission Experiment Using
Low-Loss Optical Fibers, Electronics Letters, l4, 16 (1978) 520
23) T.Ito, et al.: Transmission Experiments in the 1.2�1.6�m Wave-
length Region Using Graded-lndex Optical Fiber Cables, Topical
Meeting on Optical Fiber Communication, TuBI (1979.3.6-8)
Washington D.C.
24) Nakagawa, et al.: Experiment on 1.3�m-Band 800Mb/s Single
Mode Optical Cable Transmission, 1979
25) Itoh, et al.: Discussion of 1.SS�m/1.3�m-Band Transmission Chu-
acteristics, 1980
26) K.Asatani, et al.: Feasibility Experiments on Analog Video Trans-
mission Using a Semiconductor Laser Diode-Over 30km Trans-
- mission at 1.3�m Wavelength-, ECOC, Post Deadline Paper (1979.
9. 17-19)
27) Asaya, et al.: Optical Fiber Transmission of Wide-Band Graphic
Signal, 1979
28) Ohme, et al.: Discussion of Single Mode Fiber Fusion Connection,
1980
, 29) N.Suzuki, et al.: Ceramic Capillary Connector for 1.3�m Single-
Mode Fibers, Electronics Letters, 15, 25 (1979) 809
30) K.Nawata: Connectors and Singie-Mode Fiber Technology, IEEE
Trans, QE-16, 6 (1980) 618
31) M.Saruwatari, K.Nawata: Semiconductor Laser to Single-Mode,
Fiber Coupla, AppGed Optics, 18, 11 (1979) 1847
32) T.Ito, et al.: 800 Mb/s Optical Transmission Equipment Using
1.3�m LD and Single-Mode Fiber, ICC, 28.3 (1980. 6.8-12) Seattle
33) Yamada, et al.: Characteristics of Connection between Fine Lens-
Provided Single Mode Optical Fiber and Semiconductor Laser, 1980
34) Sugie, Saruwatari: Chazacteristics of Single Mode Optical Fber-Use
Semimnductor Laser Module, 1980
35) K.Kobayashi, et al.: Stabilized 1.3�m Laser Diode-Isolator Module
for a Hybrid Optical lntegrated Circuit, Topical Meeting on
lntegrated and Incline-Wave Optics, !~3 (1980.1.28-30) Incline
Village
36) Submazine Optical Cable Collecting New Technologies, 1980
37) Nakai, et al.: Discussion on Long-Distance, Deep-Sea Optical Cable,
1979
38) R.G.Smith: Optical Power Handling Capacity of Low Loss Optical
Fibers as Determined by Stimulatad Raman and Brillouin Scattering,
Appl. Opt., 11, 21 (1972) 2489
41
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39) Okada, Kobayashi: Backwazd Scattering and Breakdown Point
Detection of Optical Fibec, 1980
40) M.Nakahira, et al.: Evaluation of Optical Transmission Line Using
Optical Pulse Reflectometer and Backscatter Techniques, ICC, 10.5
(1980. 6.8-12) Seattle
- 41) M.Kawashima, T.Misugi: Light Emitting Diode Transmitter Re-
liability, ICC, 10.2 (1980.6.8-12) Seattle
42) M.Nakamura: Semiconductor Injection Lasers for Long Wavelength
Optical Communications, Topical Meeting on Inte~ated and
Guided-Wave Optics, MD 1(1980.1.28-30) Incline Villege
43) H.Nishi, et al.: A New Transverae Mode Stabilized InGaAsP/InP
DH Laser with Self-Aligned Structure, 37th Mnual Devicx Research
Conf., TP~C3 (1979.6) Boulder
44) Ueno, et al.: Long Wave-Length Plane/Convex Guide Line (PCW)
Laser, 1980
45) T.Murotani: inGaAaP/InP Buried Creacent Laser aith Very Low
Ttveshold C~urent (a=1.3�m), The 12th Solid Device Conferencx,
1980
46) Wakita, et al.: Lifo-Time Test for InGaAsP/InP DH Laser for Use in
Optical Trusmiasion, 1980
- 47) H.Nagai, et al.: Room-Temperature CW Operation of InP/InGaAaP/
InP Double-Hetero Structwe Laaers Emitting at 1 SS�m, F.C()C,
16.2 (1979. 9. 17-19) Amsterdam
48) S.Akiba, et al.: t.5�m Rar~ge InGaAsP/InP Room Temperature CW
Lasers, ECOC, 16.1 (1979. 9. 17�19) Amsterdam
49) S.Arai, et al.: Room Temperature CW Operation of 1.5-1.6�m
Wavelength Range GaInAsP/InP Lasera, Topical Meeting on In-
tegrated and Guided-Wave Optica, MDS (1980. 1.28-30) Incline
Village
(Reprinted from the Journal of the Institute of Television Engineers of Japan,
Vol. 35, No. 2, Feb., 1981).
COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd.
CSO: 4120/288
42
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SCIENCE AND TECHNOLOGY
PRODUCTION OF PEPTIDES BY NUCL~IC ACID SYNTHESIS, GENE ENGINEERING
Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 pp 34-43
[Article by Yoshifumi Jigami, Hideaki Tanaka and Tstomu Nishimura, Bioorganic
- Chemistry Division, National Chemical Laboratory for Industry]
[Text] 1. Introduction
Research on vital nucleic acids was initiated when nucleic
acids were discovered by Miescher (1869), and later their
chemical structure was clarified by Baddiley and Toddl>.
Further, based on Chargaffs research, Watson and CrickZ~
proposed the double helix structure of DNA, which triggered
the development of molecular biology. The advance in
molecular biology has lead to rapid progress in researches
on genes and also stimulated progress in chemical synthesis
of nucleic acid. Finally, it can now be shown that synthetic
nucleic acids manifest their function in an organism. Apart
from this, while Berg et a1.3~ have succeeded in connecting
hetero�plasmids and Cohen et a1.4~ have first succeeded in
gene engineering, various kinds of enzymes pertaining to
vital nucleic acids have been isolated one after another, and
instances of cloning by the use of an microorganism are- .
numerous. Since it has thus become possible to control
artificially the genetic information that is the most distinctive
function in an organism, active researches have been made
to control the production of useful end-products or to apply
it in medicine. These researches are called gene engineering
or gene manipulation. While they are of scientific and technical
interest, they are expected to play a major role, as the frontier
technique of molecular biology, in science and technology
for the 21 st century, including not only industrial field such as
the chemical industry but also medical science and biology.
It is now possible to introduce genes of a higher organism
into a microorganism by using these techniques, and to
produce, at a low price and in large quantities, various kinds
of physiologically active materials, formerly extracted only
from higher organism and then expensive. These techniques
are also considered to have a great influence in the near
future on the matter producing systems in the chemical
industry. That is to say, biocatalytic reactions will be utilized
43
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to produce selectively useful materials, under normal tem-
perature and pressure. The techniques of gene engineering,
by introducing genes into a different species, are making
it possible to utilize the function fitting a purpose. It has
recently become possible not only to get a gene from an
organism but aiso to synthesize chemically a DNA with an
arbitrary base sequence, Therefore, the possibility to make
a micro-organism produce matters pertaining to an organism,
like a polypeptide, which so far has never been produced
in vivo by an organism, has now been considered. In this .
report, we shall first give a concise account c~f the gene
structure and the manifestation mechanism of gene informa-
- tion, describe an outline of gene manipulation and synthesis
of nucleic acid, and finally introduce an example of producing
an active peptide in an organism by the use of a synthetic gene.
2. Manifestation of Genetic Information
In eukaryotes, over 90% of the genes are present in the
nucleus and the rest in the cytoplasm. In a bacterium, a
circular gene with a small molecular weight, called piasmid,
eatists in a region other than the nucleus. These genes are
the very deoxyribonucleic acid (DNA). Though molecular
sizes of all DNA are different, they are composed of four
kinds of mononucleotides. These four kinds have different
bases as shown in Figure 1. That is to say, DNA is formed
as a thread-like connection of 2'-deoxyribonucleotide�5' '
- monophosphates, each of which is a connection of four main
bases; adenine(A), guanine(G), thymine(T), and cytosinc(C).
In an organism, DNA is usually composed of two chains
with the complementary double helix structure. The bases
of the respective chains are connected by a hydrogen bond
so that the base pair is necessarily either A-T or G-C. The
double helix structure shown in Figure 1 is called the Watson� �
Crick model.
Protein synthesis is the result of the manifostation of
DNA function in vivo (see Figure 2). First, a protein molecule
unpacking DNA is connected with one strand of the gene
and the double chain is unpacked. Ribonucleic acid (RNA)
- complementary to DNA is synthesized, with one strand of
DNA taken as a template, by the aid of an enzyme called
DNA dependant RNA polymerase. In this case, RNA synthesis
is subsequently completed from 5'~end to 3'-end in the
d'uection opposite to the DNA chain. RNA has four kinds
of bases; adenine(A), guanine(G), cytosine(T), and uracil(U),
and a single chain structure, as shown in Figure 2(b). The
synthesis of RNA is called "transcription". The RNA having
an informational function is called messenger ribonucleic
acid(m�RNA). Amino .acids are transferred by transfer-
ribonucleic acid(t-RNA), and synthetic peptides arise from
the connection of the amino acids, by the aid of m-RNA, in
44
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s..~
OH
HO-P-O-bFl= Q ThYmin~ ~ p~
~ C p 8~
p H H
C C
H H
3 Z~ ~~0
OH H To ch~in N H ~ Ad~nfn~
C
~l 2'-d~oxyribonucl~o~ids u C
5'-monophosphorie acid �:~.-A���T-~;� � C
; �+,_T...q H al
d?..T To chdn
es~e G
I
S~CHy G...~.. Cytoan ~ H ~~lD
H H T...q 11 N
H H C
T 030 0
~3 H A�'1'�:;:;:�., To ch~in N ~ Gu~nine
HO-P~O � 2 t% ~ H
~ Ba~s "C_`''. Q~ ~ C
~-C...G ~ C
:��-~p,..T c c
5~ ~ 0 N 6 0
H H ~d�~~''�� To ch~in
H H � ~ ~8q~
03~ H e) Watqn-Criek modai
t
HO-P~O
I
Q
b) DNA chsin d) Structura oi Hydrbp~n Bond in
Bass Peir
Fig. 1. Structure of DNA
_ _ _
mRNA qibowme
Amino ~cid
Amino ~cid Amino ~cid Amino ~cid - tRNA
6' 3'
~y mFNA P~Ptids (protein)
Codon
DNA chain
(1) Tranteription (2) Tranfl~tion BaN
a) Msnit~~tation of p~nstic information 5'CHy
H H
H H
03~ OH
HO-~=O
~ Bsa
5'CHq O
H H H H
03~ H
~
� HO-Pa0
. I
O
b) Strueture oi RNA
Fig. 2. Manifestation of Genetic Information and Structure of RNA
45
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a cellular organism called ribosome. This is called "translation". `
Each sequence of three bases in m-RNA, conesponds to ~
one amino acid, and the sequence of the three is called ;
"codon". Since one codon is determined by the three amino ~
aads sequence, the number of codons made from four bases ~
is 64, and their respective contents of information has already
been revealed.
Thougti, as described above, it is m-RNA that d'uects the ~
peptides synthesis in vivo, they are bio-synthesized based
on information provided by DNA, because DNA is transcribed ~
into m-RNA as illustrated. j
3. Outline of Gene Engineering ,I
I
Gene engineering is generally operated through the following
steps:
(1) Take out a particular gene ~tting a purpose from a
suitable biological material or synthesize one chomically.
(2) Insort the gene into an extranucleaz gene' 1 capable
of autoreduplication in vitro, and connect them.
(3)~ Have a suitable host cell(mainly, E, coli) infected with
the recombinant gene obtained and, then, multiply the cell. '
(4) Select the cells(called recombinant cell) having the ,
recombinant DNA out of the whole, '
(5) Check for the presence of the end product and determine
structure of the end gene, in the recombinant cells.
In this c~e, how to isolate and purify the end gene or
synthesize it chemically, which has been already stated in
(1), is an important problem. Howevor, this wiil be described
later. Here, we rofer to the general method to produce ~
recombinant DNA and the method to detect recombinant
cell.
3-1. Production of Recombinant DNA
_ 3�1-1. Restdction Enzyme-Ligase Method
Nucleic acids are composed of a branchless chain of
nucleosides connectad, by a phosphodiester bond in the 3'-5'
ends d'uection. Each nucleoside is the connection of four
bases (adenine(A), guanine(G), cytosine(C), and thymine(T)
or uradl(U))'"~, with a dbose or 2-deoxyribose. Particulazly,
DNA, a gene in itself, has the helix structure of two com-
plementary chains antlparallel to each other. The enzyme
that identit3ea a particular oligonucleotide sequence (3-6
basa pair) in this DNA and cleaves within this sequence, is
called a restriction enzyme. More than 100 kinds of restriction
enzymes have been identified and an example of reaction
by a typical enzyme is shown in Figure 3.
First, once the two kinds of DNA are cleaved, as shown in
Figure 4, by using the same restriction enzyme, Bco RI,
they are mixed and made to react with DNA ligase at 5-10�C.
. 46
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EcoR i �3
5' - G~AATTC -3'
3'-CTTAA~G -5'
5'-GpH3~~ + S~pAATTC-3'
3'- CTTAAps~ 3~HOCi-S�
Hind III �4
5'- AiAGCTT -3'
L--'~
3'- TTCGA~A -5'
5'-ApH3�~ , + S'pAOCTT-3'
~ 3'-TTCGAps 3~HpA-B'
Pit I ~6
S'- CTOCAiG - 3'
r--J
3'- G~ACGTC-5'
1
5'-CTGCApH3~ S~pO -3'
3' -Gps~ + 3~ HOACOTC -B'
Fig. 3. Reaction Examples by Typical Restriction
Enzymes
Both DNA form A�T base pair at AATT-adhesive ends, and ,
at the same time the ligase connects the glycohydroxyl group
(-GOH3') of the nucleotide in one DNA with the phosphoric-
acid group (5'pA-) in the other. When this is added to E. coli
treated with calcium chloride, this bacterium can incorporate
the foreign DNA *6
If these cells that have incorpo:ated DNA are multiplied,
recombination DNA is stably kept in the coming daughter
cells, along with DNA from other materials replicated. 'The
cells with the desired property are then selected out of a
large number of the daughter cells.
3-1-2. Tenninal Transferase Method
The restriction enzyme-ligase method is often used owing
to its simpiicity. However, it has some defects. For example,
in the case of a cleavage by a restriction enzyme inside the
selected gene, the gene is divided and the recombination
DNA cannot be produced. And also, in the case of an active
protein produced by inserting an animal or plant gene into
E. coli, it is in general necessary to isolate and purify
47
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Vector (pSC101 pl~~mid)
Rsplication
Point of dip~stion DNA from oths? materials
Tetrocyelins 2nd 3rd
rssist~nes I Dlptttlon by r~ftriction 1st dip~stion point
+ ~nzyms (Eco RI? Dip~stion by nstriction
,l ~nzyms (Eco RI)
T AATT AATT AATT
T 1'RTTIT� � � . mr~
A
A A TTAA TTAA TTAA
T
- T /
To doubls chein
\ AA
TT
y TTA
A
TT
A'�`
AA
TT
I DNA lipsfe
~
Aq
TT
. TT
AA
R~combin~nt DNA
TT
Ap'
?0'A
T
1 Trsnsformation
Chromo~ome
~ Transform~d eell
Plesmid ~
~ Replieetion~
~ ~ ~
A ~ Dauyht~r c~ll ~
Fig. 4. Production of Recombinant DNA by Restriction Enzyme and Ligases~
m�RNA and use a complementary DNA (c-DNA} prepared
from this m-RNA with a reverse transcriptase. Also, this
c-DNA does not have adhesive ends as the one obtained by
using a restriction enzyme. In this case, anothar method
called Terminal deoxyribonucleotide transferase method (TdT
method) is then used. Terminal transferase is an enzyme
obtalned from calf thymus, and capable uf adding homo-
48
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polymers of deoxyribonucleotides to the 3'-aH end of an
arbitrary DNA with deoxyribonucleotide triphosphate taken
as substrate. Accordin~ly, as shown in Figure 5, poly (dC)*~ is
added to 3'-OH end of c-DNA prepared from m-RNA, and
poly (dG) to 3'-OH end where vector pBR322 is cleaved
by restriction enzyme PstI, When both DNA are mixed,
heated at about 60�C, and subsequently cooled gradually
to room temperature, they adhere to each other at the sites
of poly(dC) and poly(dG) by a hydrogen bond In DNA
produced at this time, as illustrated in Figure 5, either of
the chains has gaps, and both DNA are not connected by
a covalent bond. But, if this untouched DNA is given to
_ E. coli treated with calcium chloride, DNA is incorporated
into the bacteria and repaired in vivo, by enzymes (DNA
polymerase, DNA ligase, and so on) to become complete
_ recombinant DNA. The method to prepare c-DNA from
m-RNA is as follows: First, m-RNA is made to react with
reverse transcriptase and c-DNA, in connection with m-RNA,
is produced. After degrad~tion of RNA by alkali treatment,
single chain DNA unchanged is made to react with an enzyme
synthe~zing double chain DNA, (DNA polymerase or reverse
transcriptase) and double chain DNA is thus prodt~ced. Further,
when the hair pin put is excised by S-1 nuclease, it becomes
the end product, double chain c-DNA.
This method is often used when anir.~al's genes are inserted
into a microorganism. In this case, as the Pst I site of the
vector (pBR322) is inside the structural gene of penicillinase
protein, hetero-genes inserted into this site are transcribed,
in E, coli, in those in connection with a part of penicillinase
m-RNA, and further this m-RNA is translated by ribosome.
Therefore, the hetero-protein produced is synthesized in
connection with the penicillinase protein.
3-2. Detection of Recombinant Body
3-2-1. Detection of Strain Having Recombinant DNA
In the nNA produced in vitro by recombination, there
are various kinds of complexes arising from insertion in
the opposite direction or from incomplete connection, in
addition to the recombinant DNA inserted in the conect
direction. Therefore, as this DNA mixture is infected with
E. coli, the transformed bacteria incorporate various kinds
' of DNA. For this reason, it is neces~ary to detect and select
the recombinant DNA containing the end genes. In this
case, if the end-product manifests its character and the
physiological property of the bacteria is changed, detection
is easy. For example, leucine gene*9 of B. cubtilis changes
the mutant * 10 of E. coli from leucine dependant into
non-dependant. That is, the character is transformed so
that the bac.teria are viable even in culture medium without
any leucine added to it. But, if the physiological property
of the bacteria is unchanged by the character manifestation,
49
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Psr I ~~t�
5,-- mRNA ---AAAA3�
Tc~
Ap~ pBR322
revarte
_ ~tronscriptes~ I
~Pst I -------AAAA3
~ TTTTS�
S'G CTGCA3~
ACGTC GS' Treatma~t with
3~ NeOH
terminal
trensteros~
+dGTP
Single chain c�DNA
TTTTs
G CTG CA G G GG revorse
GGGGACGTC G tronscriptase
or DNA polymeroae
AAAA3~
TTTTS,
ann~alinq
nuclee~e SI
CTGCAGGGG Doubls chain e�ONA
5� AAAA3~
G CCCCC
3' TTTTS/
t~rminel
CTGCAGOGG TTTT tranateross
G CCCCCAAAA +dCTP
Trensformstion
AAAACCCCC
CTdCAGGGGd CCCC TTTT
GACGTCCCCC
iPtt~si~ cDNA
GTGCAGGGGGTTTT
p8R~322' GACGTCCCCCAAAA
~Y~
Ptt I fits
Fig. 5. Production of Recombinant DNA by Terminai Transferase Method [Poly
(dG-dC) methodJ 6~
or animal's DNA is introduced into E. coli in connection
with the vector, protein is not produced whereas DNA is
replicated; or the activity of the protein is not detected
whereas the protein is produced. For example, proinsulin
gene, inserted into Pst I site by the aforementioned method
shown in Figure 5, is translated into protein. However, the
activity of tlie protein does not manifest itself as proinsulin
is synthesized in connection with penicillinase~~. For these
cases, tl~e method (colony-hybridization method) allows to
examine for tlie presence of specific DNA by bacteriolyzing
50
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0
II 5'
o-bocHZO B
. k'r'_'~
3 OH
(1) d[PBOH)
Me Me
CH
M \ ~ Q C~ ~,-~S�CHZ�CHqOH(TPTE)
, /CH~S-(TPS) ~ or p q~Zp
Me ~ ~g _CHZCHqOH (TPSE)
Ma Me ~ ~ O
TPTE-O-P-OCHyp B 'O-~P-OCH2p B
_0 _0
OH OA~
(2) difTPTE1PBOH1 (31 dIP6(Ae)1
TPS
Solvent extraction, Silica gel
O
TPTE-O-P-0CH p B
'O
O
0=P-OCH1~ B
. _p I/
I 1
OAc
(4) d[(TPTE)pBpB(Ael)
i) N-chlorotuecinimide
~12N NeOH, 0 C ZN NaOH, O~C for
for five minutes five minutes
d((TPTE1p8pBp~.{) d(pBpBOH~
(5) (6)
O O
B~ ~--Ci--NH ~�~N ~~N
N ~ N ~.{3C ~
L~~ H ~C-C-H~N N
~ 3C H O
Bz A ib G
O
CH 3 ~'-C-N H
HN O (CH3) N~
� i � i
T
(U) an C
Fig, 6. Examples of Condensation by Diester Method
51
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a colony of bacteria, left as it is, and containing recombinant
DNA, on the flat culture medium8~. The method is as
follows: a colony of transformed strain is formed on a
nitrocellulose ~lter spread over the flat culture medium,
bacterioloyzed with alkali, and neutralized. After DNA�splitting
enzyme are digested by protein-splitting enzyme, DNA leaked
from the colony is fixed on tlie filter. Apart from this, DNA
to be detected (c-DNA made from m-RNA in vivo, chemically
synthetic DNA, and etc.) is prepared and radio-labelled with
32 P and etc. * 11. Next, when the filter, wlvch has adsorbed
DNA, is mixed with the probe, only the colony, with DNA
wl~ose base sequence is homologous to the probe, is trapped
into it by hydrogen-bonding between bases. Therefore, only
the colony with DNA homologous to the probe is detected
by auto-radiography of the filter.
3�2�2. Detection of Stock Producing Foreign Proteins
Detection of foreign proteins produced by inserting animal's
genes into E. coli is generally conducted by the radioimmu-
noassay method. For example, when a prepolyinsulin gene
is inserted into the Pst [ site of pBR322 by the method in
Figure 5, proinsulin in connection witlt Q-lactamase protein
, of pBR322 is synthesised~~. In this case, the detection is
conducted by the following method (solid phase radioimmu-
noassay method)9~ the colony producing proinsulin is
is bacteriolyzed on the agar-agar with bacteriolytic enzyme
(lysozyme), and made to react witlt anti-insulin antibody
labelled with 1251, etc. Of course, if biologically active
and free proteins are produced, detection and determination
by the bioassay metliod is possible.
4. Chemical Synthesis of the Gene
Chemical synthesis of the gene is to synthesize 10-IS DNA
fragments (DNA oligomers) of nucleotide, and get long DNA
by connecting oligomers tlirougli enzyme reaction. It is
fundamental for t11e chemical synthesis to make phospho-
diester bonds between two nucleosides in the presence of
a condensing agent. All amino groups and unnecessary
l~ydroxyl groups must be covered witl~ protecting group so
as to make tliis linkage only between 5'-l~ydroxyl group
of one nucleoside and 3'�liydroxyl group of the other.
Matters listed in Figure 6 are generalty used in protecting
amino groups 12. liowever, there are two ways to make
phosphodiester bonds between nucleotides10~. The first is
called the diester method, which was developed b~ Khorana
et al., and its outline is illustrated in Figure 611 12~. The
second is called the triester method, which was adopted by
A.M. Michelson and A.R. Todd13~. It is by using of the
improved triester method that S.A. Narang and K. Itakura,
have recently synthesized DNA of somatostatin14~ insu-
linls"~7~, human growth hormone, etc., successively18~i9~
52
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d, OMTr-OCHq ~ 8
~ 'O_ ,8 DMTr-OCH2 8
HO-CHZ ~ ~ I I
/
1\L~/ ~
OH DMTrCI ~
(1) Sfllca p~l 3'~ O N p=~ OCE
chromato ~
CI-P-OCHZCHZCN N
I
DMT CI d((CMT) Bon) ~ CH3
M~O -CI
t
(2)
o CI
M�
(g) !4) d(DMTr)8p1
~
O H+
OH- Et3N ~S-OH
~ P is vi~st~rpho~phoric ec(d
O ~
Silica p~l ehrom~to
OMTr-OCH~0 B
~ pI I ' HOCHZ O B
I O
O~P-O' O~P-OCE
I
O
(
CI
CI
d [ (DMTr)Bpo-J d ( HO-Bp)
~
(5) (el
~
TPST~ p N~
~ g~ ~
Slllu p~l ehrom~to p ~/N '
OMTr-OCHy ~ 8 .
0= ~-~-OCH2 ~ e
I
O ~I I
\ O
i
C~ O~P-OCE
\ I
CI
d~(OMTr)Bp Bp]
~ ~
l7I
Fig. 7. Condensation by Triester Method
53
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41. Diester Method
It was by the diester method that Khorana et al. synthesized
E. coli tyrosine t-RNA. The original material in this method
' is a 5'-mononucleotide(1). 5'-phosphate group protected by
TPTE, (2) is made to react with (3), 3'-hydroxyl group
protected by Ac group, at room temperature in the presence
of the condensing agent TPS, and a dimer (4) is then obtained
through solvent extraction or purification by , using a silica
gel column. Taking 3'-Ac group off (4) by alkali treatment
results in (5). And, after TPTE in (4} is oxydized into TPSE
by N�chlorosuccinimide treatment, the removal of TPSE
� together with Ac group by alkali treatment produces a
nucleotide (6) in the same form as (1). In the presence of
(3) and 3'-Ac-compound of (6) made to react with (5) a
trimer and a tetramer are produced respectively. The diester
method starts from the 5'-end and extends step by step as
described above. A yield at one condensation reaction is
estimated at 30-50%. In this method, all linkages between
the nucleosides to be produced are by active phosphodiester
bonds.
4�2. Triester Method
In the case of tlie triester method, all linkages between
nucleosides are by inactive phosphotriester bonds. They are
fat-soluble and can be eluted, on silica gel, with organic
solvent, as their phosphate groups are covered with chloro-
phenyl groups. While the triester metl~od has been improved
by ltakura and Hirose et al., a synthetic method almost
unifying their results has recently been published19~. The
method is illustrated in Figure 7. The starting material
in this case is a nucleoside. The way to protect the amino
group of the base is the same as in the diester method. DMTrCI
is a reagent that protects only 5'-hydroxyl group and its
deprotection is possible by the use of benzenesulfonic acid.
And, since DMTr group shows an orange coler on the reaction
with 10% perchloric acid solution, the reaction of changing
into DMTr is useful for detection following TLC (silica
gel and reversed phase). After the nucleoside (2) changed
into DMTr is purified by the use of silica gel chromatography,
a monomer (4) with all functional groups protected is
obtained by phosphorylation of 3'-l~ydroxyl group by phos-
phorylation reagent (3), p�chloropl~enyl-p-cyanoethylphospho-
cliloridate. The monomer (4j is purified and isolated by
silica gel chromatography (85% yield). The reaction of (4)
with CHC13-MeoH (7:3) containing 2% benzenesulfonic acid,
for a few minutes, results in tlie elimination of DMTr and
tlie production of (6). Tliis is purified and isolated by silica
gel chromatography (90% yield). And, reaction of (4) with
trietliylamine and pyridine results in the release of cyanoethy]
group from (4) and the production of (5). Acrylonitrile
produced by the elimination reaction of cyanoethyl group
and triethylamine in excess are completely removed under
low pressure. About 70% of (6) equivalent to (5) is dissolved
54
~ ~
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DMTrO-TpCpo- HO-TpC.,,
1 1 1
X 1) TPSTs I X
2) N+
3) Silica pel
DMTrO-ApGpTpo- HO-TpCpTpC..
1~~ 1~~
XII 11 TPSTe XI
2) H+
3) Stlice pel
DMTrO-Tp Cpo-+H O-TpApCpocc
~ ~ ~ ~ ~ DMTrO,ApGpTpo-+HO-ApGpTpTpCpTpC.~
XVI TPSTe XV ~ ~ ~ ~
H+ XII 1) TPSTe x~
Silies p~l 2) Siliea pel
3) Et3N
DM7r0-GpTpTpApCpo"
~ ~ ~ ~ ~ Ho-ApGpTpApGpTpTpCpTpC.~
X VII +1? TPSTs ' ~ ~ ~ ~ ~ ~ ~ ~
2) Silica p~l XN
3) NHqOH
N~ 4) AeOH
TPSTe~ O S0~1 I
~=N Ho-GpTpTpApCpApGpTpApGpTpTpCpTpCo~(A11)
I 1 I I I I I I I 1 I I 1 I
0 0 0 0 0 0 0 0 0 0 0 0 0 0
CE~ 0-Cyano~thyl X Vm
DMTr~ dfmsthoxytrityl
P~-P- O CI
1 ~ A& C-Proucad by bmzoyl group
G~Prot~cted by iwbutyleproup
An~-C~ ( ) }-OMe
0 ~J
Fig. 8. Synthetic Route of Pentadecamer GTTACAGTAGTTCTC (A~~) by Triester
Methodt9)
~ in dried pyridine, and added, together with excess of TPSTe,
to (5). After TLC (about two hours), the condensation
reaction is finally stopped by adding a small quantity of
water and a dimer (7) is then obtained with 80% yield.
Elimination of DMTr group and cyanoethyl group in (7),
just as in the case of (4), uy benzenesulfonic acid and triethyla-
mine treatments produces (6) and (5) types of compounds,
respectivel~~. Successive extension of the cliain thus becomes
possible. The yield of trimer from monomer is 30-60%.
ln the case of condens:ition in the triester method, 3'-active
phosphate group in excess by 1.5 equivalents to 5'-hydroxyl
group is used. And, when the number of nucleotides exceeds
6, cyanoethyl group, which is a protecting group of 3'-phos-
phate, is difficult to be eliminated quantitatively. So, the
extension from 5'~nd in the 3'-direction cannot be so long.
But, in the triester method, since 3'-hydroxyl group, only
in nucleotide at one end, can be protected by anisole grpup,
and 5'-DMTr protecting group can be eliminated by triethy-
lamine, extension from the 3'-end in the 5'-d'uection is possible.
Figure 8 shows a synthetic route of pentadecamer
GTTACAGTAGTTCTC used in the case of human insulin.
In ttie final condensation of pentamer and decamer, 20�mo1
55
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~ ~ o
~ _ m
U m
o ~ v
Z H Q
o Q ~
M ~ M m Q ~
~1
a~ a
aQ m -
n d V~(~ in o
q ~ m
N~ ~ V V a Q
Q f' O ev
t0 >
~ aD Q F " U' U Q
~cf N F' I- Q O
E Q a L ~ Q " Q~ yI .
am V N~ 1 U a m ~ ~ H Q 1
o w a C1
N Q F- N~ ~ N a Q F_
Q ~IQ = ~ ~U 1 0> ~Q
~ a F ~ (7 U N U C7 U
� ~I U N C9
^ i. I~- Q N a m V C7 ~ Q~
V~ F~-I Q � N a Q H ~ 1- Q Q
v c ? Q~ ao ~ V C7
~ N U~ Q N~'J H Q m a Q 1-
~ ~ V ~
U C9 0 ~Q ~ (~7 U ~(7 N Q F-
f' Qc~I ~ ~ � ~ f~ V Q C7 U 1
~ a 1 I- ~ ~ N T 1~- Q ~ ?F- Q T
O L H C ~ q m ~ U ~ C Q hU- I
q > c~ ~ ~
M ~ U ~ � ~ I~- ~ _ c ~ U C~7 Q
pl j~j F � a ~ j 1 V V, m ~ a ~ F. Q1- I-
~ N c ~ 4 F- ~ ~ 1- I
n U O � e> q ~ 1
�0 ~ I ~ ~ o ~ 1 ~ cQQi; _ ~ Q c~i c3 ? .
i. r 1 H ~ m ~ j m 1- aj Q a~ ~
p, ~_i w F- rQ v~ 1-
� LL ~ a ~ ~ I C~ V
~ a ~ Q ~ ~ Q I Q~ V ~ c~ Q a
W N H O ~ j(~ = 0 m f' Q a .
} Q
~ na ~Q ~ ~ ~a
v j m F- ~ I ~'1 V ~ N tV- ~Q
~ T V O ~ J I V V, } fD F a Q F
V H Q �u Q w V~ I w V C9
N~ U � l V~ n V 1 H Q i
l7 ~ U W ~ e 1 ~ n f� Q I
S m ~ t7 x M �
~Q~~~-N N1~~ ~QQ
Q ~ V 1 ~ C7 U(9 I
~ � ~ a
~Q~~ n~=~~~ ~QQ~,
~
a~
Q ~
$ Q M V~ ~o M j C7 U
W ip ~ Q 1- S U(7
= U C7 ~y � ~ Q ~
~ G (7 U Q i' Q
a ~ U C7 ~ (7 U
~
q Q I Q Fa- � (7 U
a ~ ~ ~ Q Fa-
~ > CJ Cal F~ ~
' a U (Q7 = a Q
a FF- Q Q Q
~1a~l W~
U /
~
S F
~ Q
Q
s ~
W
Fig. 9. Sequence of Amino Acids of Somatostatin and Human Insulin, and Their
Synthetic Genes
56
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of 5'-liydroxyl group (decamer) and 180�mo1 of TPSe are
used for 35�mo1 of 3'active pliosphate (pentamer), and the
yield is about 40%. After the pentariecamer synthesized in
_ this way is purified, with protecting groups kept intact, by
the use of a silica gel column, treatment with concentrated
- aqueous ammonia and 80% acetic acid results in the elimination
of all protecting groups (those of DMTr, chlorophenyl group,
3'-anisole group, base , amino group). After separation from
the aqueous solution by liquid chromatography (column:
Permaphase AAX, moving phase: KH=P04 aqueous gradient),
and dialysis, freeze�drying is conducted. DNA oligomers with
hydroxyl groups at both ends can be synthesized in this
manner. In the case of somatostatin genes, eight kinds of
oligomers (A)-(H) have been synthesized, which are shown
in Figure 9 including adhesive ends of restriction enzymes
Eco RI and Bam HI. In the case of human insulin the genes
corresponding to A and B chains are synthesized as shown
~ in Figure 9. But, as the Gln-Ala conesponding codon of the
B chain contains th~ recognition codon of the restriction
enzyme Hir:d III, it is not necessary to synthesize a long
B chain of genes at once. In fact, a long B chain has been
produced as follows: the parts on the left and right sides of
Hind I[I site are respectively synthesized and then separately
amplified by cloning. Finally, after cleavage by Eco RI and
Hind lll, the long B chain is produced:
4�3. loining 7ligomers by Ligase21~
As the synthetic DNA oligomer has hydroxyl groups at
both ends, its connection by ligase requires the phosphoryla-
tion of the 5'�terminal. It is labelled with 32 P to deterrr+ine
the purity of DNA sequence.
Oligomer (200pmol) with 60mM Tris-HCl (pH 7.8), 6.7mM
MgClz , 15mM dithioslator, and 66�141 ['Y32P] ATP with four
units of T4 polynucleotidekinase are incubated at 37 C for
40 minutes. The reaction is stopped by addition of EDTA,
and the product is purified by Sephadex column. Next, the
oligomer with 5'-(32P)�terminal is partially hydrolyzed by
using snake venom. An aliquot for each hydrolysis period
of 5, ] 0, 20, 60, 90, 120, and 180 minutes is taken, and the
reaction is stopped by EDTA. Mixture of all reactants is
put in tlie electrophoresis, on cellulose acetate, at pH 3.5
and 2,SOOV. Tl~e oligomer is transferred from cellulose-acetate
into DEAE�cellulose and chromatography by two-dimensional
electroplioresis is performed. Removal of the 5'�mo~onucleo-
tide, from tl~e 3'�hydroxyl group with snake venom, makes
the pattern of electrophoresis-chromatography~ as shown in
Figure 1022~.
Since each DNA oligomer, syntliesi~ed as described above,
has 5'-phosphate and 3'-hydroxyl groups, the oligomers can
then be elongated by using DNA ligase21~� at this time, as
sl~own in Figure ] 0, syntl~etic oligomers are arranged com-
plementarily by liydrogen-bonding. This is ~ecause they can
be connected in the desired sequence by the use of ligase
and coenzyme AMP (adenosine monophosphate).
57
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d
/ 32pT
O 3~ pT-C
\
O 32pT�C-G
~ \
t
a
p O 32pT�C-G�T
V I
o ~ 32p-T-GG-T-C
L \
u
0
= O 32p7-GG-T�PG
Electrophoresfs pH3.5
Fig. 10. Determ'ination of Sequence of DNA
Oligomers by Homochromatography
COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd.
CSO: 4120/288
58
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SCIENCE AND TECHNOLOGY
SINTERED ZINC OXIDE SYNTHESIS EXAMINED
Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 pp 44-46
[Text] Zinc oxide, known as an N-type semi-conductor oxide, finds
use over a wide field of applications. The National Institute for
Research in Inorganic Materials has, as a world's first, succeeded
in synthesizing a transparent sintered system of zinc oxide,
synthesis of which until now has been considered to be very
difficult. The synthesis consists of producing large transparent
crystals, 2cm in diameter and lmm thick by sintering urider
pressures at low-temperature. The products are expected to find
new applications in luminous display windows and sensors. Also,
valuable data obtained from observation of the fine structure of
- the sintered material, using an electron microscope, suggests
that it will find many uses including improved quality and per-
formance of electronic materials such as zinc oxide varistor.
The following is a report on the study of the synthesis. �
The basic key points in conventional manufacture of trans-
parent sintered materials, such as MgO, Yz 03 , Alz 03 and
BeO, were control of external factors - producing high-density
sintered materials (with nearly ideal density) by reducing
residual pores and minimizing precipitation of impurities, and
segregation at grain boundaries that are likely to scatter light.
From this point of view, a desire to synthesize transparent
sintered Zn0 may point out the following attempts: 1) to
prepare samples easy to sinter, 2) to raise sintering temperature
as much as possible in order to increase diffusion, 3) to sinter
the materials under reduced pressure or in a specific atmosphere
in order to obtain pore-free products, and 4) to induce lattice
defects, which are likely to increase diffusion of ions or control
excessive grain growth, by adding a trace of impurities. These
possibilities were reviewed thoroughly to find that the synthesis
of transparent sintered Zn0 requires several processes different
from conventional methods.
As an original material, Zn0 (grain diameter around 3�) made
by dissolving highly pure zinc carbonate or basic zinc carbonate,
at a temperature below S00�C and under reduced pr assure is
favorable. Sintering temperature must be below 1000 C, pre-
ferably around 800�C. A temperature over 1000�C will have a
detrimental effect on transparency because it promotes the
reaction Zn0 Zn2+(i)�2e+1/ZOz and this inter-lattice zinc
(ZnZ+(i)2e) interferes with the absorption of light in the visible
59
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range. As impurities, alkaline metals are very effective. Alkaline
earth metals proved almost harmless. P-block elements and
transition elemsnts with a higher valency thar~ zinc, even in
small quantities, have an ill effect on transparency. It is in-
teresting to note that lower temperatures ar, preferable in manu-
facturing transparent sintered ZnO, which agrees with the fact
that transparent single crystals of ZnU by hydrothermal syn-
thesis or a flux method are synthesized at very low temperatures.
This also suggests that the conventional recognition that high
temperatures are favorable in manufacturing high-density trans�
parent sintered substances is not necessarily applicable to zinc.
In order to increase firmness at low temperatures, sintering
under pressure is favorable. For pressurized sintering, molds
made of multicrystal alumina were used because this material
~ can withstand higher pressure than graphite, and BN powder is
used as a mold release agent, but, here, let us omit the practical
details of pressurized sintering.
As an example of pressurized sintering, Fig.2 shows data
on sintering at 800 C for 2.5 hours under different pressures.
_ The speed of grain growth starts accelerating at SOOkg/cm~ ,
reaches a peak at 1200kgJcm1, and then declines under higher
pressures. Light penetrability is satisfactorily high with grain
diameter over 10�, and this corresponds to a sintering pressur~:
of over 700kg/cm1 in Fig.2. In particular, light penetrability is
highest at around 1200kg~cm' under which grain diameter
reaches its peak. In general, it is usual to carry out conventional
pressurized sintering of transparent ceramics at high tem-
Bo
ao
0 0 .
E
x 30
o �
0
E
.
9 20
c
'e
~
10
0
0 200 400 600 800 7,000 1,200 1,400
Stn~~ (kp/cm1
Fig. 1. Relation between Grain Diameter of Zn0
Sintered at 800�C for 2.5 Hours and Sintering
Pressure
60
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peratures and at low pressures (over 1000�C and below 600kg/
cm1) because pressure available is limited by the mechanical
properties of graphite cnolds. So, ZnO, for which low tem-
perature and high pressure (below 1000�C and over 700kg~cm' )
are favorable, is exceptional in the scope of conventional
pressurized sintering. 'The knowledge of these features may be
helpful in turning transparent not only ZnO, but also semi-
conductor oxides and transition metal oxides for which the
control of true properties is important.
Observation of the microstructure of sintered substances
under an electron microscope directly shows how internal
defects unique to pressurized sintering are formed and how im-
purities are precipitated.
Fig.3 shows photos o aken by an electron microscope of
samples sintered at 800 C under different pressures for 2.5 to
16 hours. Under pressures around SOOkg~cm1, defects in lami-
nation are characteristic internal defects. These defects in
lamination have a phase vector of (1 /2) C+p (wheTe C=
and P=(1/3) ), and are consider~d to appear when
grains grow in excess of precipitated and segregated impurities,
or when grain boundaries move (ZPhys, Chemie in printing).
Therefore, defects in lamination appear irrespective of the level
of pressure.
In a pressure range from 790kg/cm1 to 1200kg/cm1, riot
only lamination defects, but also dislocation are observed: For
samples sintered for 16 hours, in particular, part of the dis-
location turns polygonal, forming what is called small-inclinatior?
grain boundaries. Because almost no dislocation is detected
under pressures below 700kg/cm~ , it is presumed that dis-
location is caused by stresses. Analysis of photos taken under
various conditions of diffraction show~. that such dislocation has
Burgers vector vertical to axis C.
In the ranges of pressure over 1200kglcm~ , impurities
precipitate along dislocation and grain boundaries. Eig.2 shows
that grain growth slows down under pressures over 1200kg/cm1.
This may be because the movement of grain growth is retarded
by impurities precipitated along grain boundaries.
The quantitative relations between these microstructures
and light penetrability have not yet been clarified. A com-
parison of the microstructure of transparent single cyrstals
made by the flux method with that of the samples in the present
study shows that such factors as a trace of impurities precipitat-
ed in bulk, lamination defects, and dislocation have little
effect on light penetrability. It still seems to be an important
aspect remaining to be studied to explain the relationship be-
- tween the properties of grain boundaries and light penetrability.
COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd.
CSO: 4120/288
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SCIENCE AND TECHNOLOGY
PRESENT CONDITION OF LARGE-SCALE MINICOMPUTER EXAMINED
Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 pp 52-54
[Text] 1. LazgeScale Minicomputer
To clearly define a"large-scale minicomputer" may be
difficult because the definition of a minicomputer itself is
unclear. However the following respects might serve as the
standards of the "large-scaleminicomputer": (1) One mega-byte
or more of the main storage capacity which is capable of
direct address specification; and hence (2) (in relation to
Item (1) above) the 32-bit machine (or the machine with
the large internal word length). The thus-defined large-scale
minicomputer may be regarded a general�purpose computer
to differ from in the following respects:
(1) The large�scale minicomputer can adopt the newest
technologies of hardware architecture because it is provided
with little or no accurrulation of previous softwue. .For
example, the latest large-scale minicomputer is provided with
such remarkable functions as paging, segmentation, call stack,
and WCS, whereas the general-purpose computer requires
massive expenses in the development of its operating system
(OS), which raises the overall cost of the system. On top of
that, adherence to it and the later addition of the various func-
tions make tlie system configuration inflexible and complicated;
(2) the large-scale minicomputer, as compared with the
general�purpose one, is provided with a user~convenient hard�
ware I/0 control bus or memory access (DMA) bus;
(3) the large-scale minicomputer's software is of convenient
size, allowing significantly easier creation of user-specific
modules such as the I/O control driver, as compared with the
general�purpose one. In the case of the general-purpose
computer, the addition of the OS's nuclear pazts or of the
I~0 driver is almost impossible without the assistance o~
factory engineers because publicatior. of the internal specifica�
tions or of the source programs is limited and at the same
time the spec~cations are difficult to understand;
(4) the general�purpose computer is good at input~output
or accumulation of a great deal of standard�form data,
processing by use of the many general�purpose terminals,
usage of the large-scale general-purpose pregramming language,
and its information-center wise usage; but the large-scale
minicomputer is superior in terms of the expense-to-perform�
ance ratio in the case of exclusively processing the jobs of
62
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g � ~ '
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OW..~ a eo Of_ O�LL~U
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n
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63
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ncm-standard forms hy using the 'system which is optimized
for the specific purpose.
2. Computer Technology
The development from the minicomputer to the large-scale
minicomputer has been supported by advances in integrated-
circuit technology, magnetic storage techn~logy, and other
electronics-related technologies. One of the factors that
exercised vital influence on the architecture and packaging
of the computer is integrated-circuit technology, in particular
the rapid improvement in tr~e integration density.
The capacity of the IC memory has approximately quad-
rupled every three years, and its cost has been halved every
two or three years. And now the capacity of 64K bit/chip
is viable and also that of 256K bit/chip is anticipated within
several years. The logical circuit has also improved year by
year, though at a slower rate than the memory, in terms of
integration density. One-chip CPU's of 16-bit word length
are presently available, and 32-bit word length will be realized
in the near future. The present-day IC technology employs
photolithography, with a precision of about 3 micrometers.
However, as production methods using electron-beam litho-
graphy equipment have been established, the processing pre-
cision has also improved from one micron to submicron,
_ allowing realization of the verylarge scale integrated circuits
(VLSI). And in near future the one-megabit storage device or
the 64-yit CPU chip will be available.
As for the operation speed, that of the TTL gate in the
first generation was 10 nanoseconds, that of the Schottky
TTL in the second generation was three nanoseconds, and
that of the advanced Schottky TTL in the third generation
is one nanoseco?~d, approaching that of the ECL gate.
As for reliability, ~.he hazard rate of the P.i6800 processor
for example, was 0.006%/ 1000 hours according to the data
of 1979, which means !he very small value of 10'9 per gate.
Reliability can be improved also in the same circuit as well
as by configuring the redundant circuit by using a portion
of the improved integrations.
The surface density of the magnetic storage has doubled
every two years for the past 20 years, due to proper selection
of the magnetic material on the basis of detailed study of the
various materials, and to the raised record density resulting
from the gradually-decreased head gap and the gap between
head and medium.
The progress in magnetic storage tectinology has greatly
contributed to the trend toward larger capacity and lower
price of the secondary storage unit of the computer system.
In fact, the large�scale minicomputer can economically employ
the mass storage disk of SO to 3U0 megabytes per pack, a
' significant improvement over the 10 megabytes at most as a
total value of the magnetic disk capacities of a conventional
64
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minicomputer. It has enabled the even larger capacity and
enlargement of the application subjects.
Also the flexible (floppy) disk is substituted for the con-
ventional paper-tape base equipment as a convenient external
storage for the small computer.
Significant among the peripheral technologies is the progress
of the dot matrix-type printer and the like. For example, the
~ non-impact type printer has facilitated the con~guration of
the small�scale computer system by its low noise level, low
price, and long service life due to a decreased number of
mechanical parts. Various cheap and high-performance CRT
displays are also available due to progress in IC circuit
technology.
All these things will help meet the requirements necessary
to configure more easily the information�processing system,
including processing of images and Chinese characters.
3. Architecture of Large-Scale Minicomputer
The most characteristic aspect of large�scale minicomputer
architecture is preferred adoption of such functions as to
be desired to be employed in the computer as early as possible.
Some of them, though desired, could not previously bo
employed in the general-purpose computer because of software
incompatibility, including such functions as paging, segmenta-
tion, ring protection mechanism, cash memory, call stack,
service-queue management, dispatch function, data communica-
tion instructions and the WCS.
The progress in the LSI technologies will all the more
promote the trend toward miniaturization, larger capacity,
and higher performance of the hardware. In fact, the main
storage of one megabyte or more is already common, and
the higher�level CPU functions or the firmware version of
the OS nuclear parts will be realized earlier than for the
general�purpose computer. In addition such functions as the
matrix/vector-operating function or the image processing
function and the database processing function, which have
not been employed in the conventional CPU, can be expected
to be incorporated in the easier-to-use form.
Thus, as new functions are being adopted one by one,
standardization at the hardware level can hardly be expected
except at the [/0 unit interface or the memory interface.
4. Software uf Large-Scale Minicomputer
The operating system oF the large-scale minicomputer,
unlike the 16-bit CPU which comprises only the loading
monitor and tlie [OCS at the best, is almost the same as that
of the general-purpose computer in that it enjoys in many
65
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cases the TSS function or the multi�task function which
comprises swapping, paging, and or segmentation, a:id is
provided with the filing function.
The system generation can be executed by selecting the
option according to the appGcation. The comparatively easy
system generation enables quick-wheeling grading up or altera-
tion of the system. The operating system is offered in many
cases as the source program as well as in the object form,
enabling changing most suitable to the appGcation. Particularly
the I/0 driver module, which has a wide range of possible
alterations and additions, provides easy operation which cannot
be obtained with the general-purpose computer system. As
a language processor, BASIC or FORTRAN is generally
provided, and in some cases COBOL, PASCAL, or PL/I can
be used.
The assembler is provided with the macro function, enabling
the user to effectively create the system module by calling
the macro library of the system. The interactive editor or
~ various utilities are virtually problem-free, so inconveniences
_ can hardly be found in such fields.
The status quo of the software scale in the case of the
large-scale minicomputer may be said to be already more than
that of the middle-sized general-purpose computer. As for the
soffware productivity, there is� not much difference between ,
the large-scale minicomputer and the general-purpose computer.
However, as for the software resources, there is no guarantee
that the large�scale minicomputer will not repeat the same
failure as the general-purpose one.
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SCIENCE AND TECHNOLOGY
FUNDS PROVIDED FOR POPULARIZING SOLAR SYSTEMS
Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 57
[Text] Almost 3/4 of Japan's primary energy depends on imported oil, and
around 70% of all electric power that occupies nearly 1/4 of secondary energy
is produced by oil-burning thermal plants. The self-sufficiency of Japan is
only a mere 10%.
The use of more solar power is urgently needed as an alternative energy source
as the price of oil continues to climb, specially for industrial applications
(cf. Fig. 1 and 2).
In response to this need, the Government started in FY 1980 to provide an over-
all budget for the development and use of solar systems. The following three
items were emphasized:
(1) Increasing the nation's knowledge of solar systems by publicity campaigns.
(2) Expanding the use of solar systems through low-interest loans, Government
subsidies, or tax breaks, since the systems have a high initial cost despite
their low running cost.
(3) Establishing performance evaluation criteria for solar systems.
As for (1) solar system PR, the subsidies provided from fiscal 1981, are to
- be used for a standing exhibition.
Low-interest financing stated in (2) will be available at an annual interest
rate of S.5% for private individuals and 6.5% for businesses. Government sub-
sidies can also be used by local public corporations, and will cover half the
cost of system installation. Additionally, the preferential tax measures allow
a 30% tax write off, or 7% tax exemption when installing business solar systems,
and exemption of 3/4 of real estate tax for 3 years, all effective from 1981
F.Y.
To formulate performance evaluation standards for solar systems (3), the Minis-
try of International Trade and Industry is to assign eligible facilitt.es and
an organ to commission that task, but, so far, no decision has been made.
67
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'd q y Q O
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~ ~ o~ o o c� ~~ ~ t w! ~ ' 3
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-10 0 10 70 DO /0 6Y !0 ~ 1.0 0.0 ~.0
- t~nMw~~u~~l'CI -10 0 1Q~ 70 ]0 ~0 M W DMM~1%WWM~~/) ~
- "^~�`W' ~~01 Fi~. 7. Etfen of Glcium Carbo� Fi~. 8. Elfeet ot Gicium Phor
Fig. 2. Viscoci~y VS Temper~turc H~ Subility of Fi~,3 in Di~pertion Nte Scak Inhibft~tion plute SnM InhibiLtion
COPYRIGHT: 1981 Fuji Marketing Research Co., Ltd.
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HOR OFNICIAI. USE ONLY
SCIENCE AND TECHNOLOGY
DEVELOPMENT OF NEW MATERIALS IN 'THE NEXT-GENERATION PROJECT'
Tokyo TECHNOCRAT in English Vol 14, No 5, May �'1 p 79
[TeXt] The Agency oj Induatric! Sclenct and Tech� mateNals are polymer membranes jo~ uae (n
nology has declded ro srart in the J7sccl year saft�to fiesh wottr dtstilladon or tn gas reparo�
1981 o project oJ ' jundamenraf technlques in tton. It !s tr~ttnded that ,wperconductive rr~a�
rhe next�generadon indusrry", The object oj tesla(a with lnfintte eiectrte conducttvity at
this "next�generat~on project" is to esta6itah normo! temperotures, and pJastic as strong as
_ new lndustrlal techntques, to supporr the meta( etc. shouid 6e developed. Severol
next age, wlth prtoriry g(ven to the dt- enterprlses, such as Asah! Kasel, etc., pian to
velopment ojnew ?nareNaJs, new blatechnology pc?t!clpate !n this projtct.
ond new juncNona! devtces, wfth a rcsearch Specking of the themes "High�perjonnance
budger oj 120 b(llton yen jor the next ten crysta! connoi eiloy" nnd "Composttt ma�
years. teNei , thty declare thelr obJecttves arr to
The greatest tmportanct !s attached to dt� devtlop new, matniy metnllic meterlala. Severaf ,
veiopment oj new meteNals among tht nexr� compantes, lnciudtng Mltsublahf Heavy In�
generadon pr%cts. A hafj oj the budget, 2.7 dusny, hope ~o partlclpate tn thts pro/ect.
bt!(ton yen; jor the JJrat jiseal yea~ ts ro be
spent on thls reseurch. Form~r ew~mks �
MatedaJ rechnlques are ~ndisptnaablt not G~D b~tw�n ery~l ynim
only jor u(tra~hear-reslsttng materla(a ustd Jn
nuclear juston but jor every other kind oj
, rndusny such as mochlne, chemlcol, etc.. For ,
rhts reason, our counny lntends fo develop
new moterlals tndependenr(y ojotNercountr(es
and put them to practieal usr. crnui o~ e�nn,ie ,
Tht jollow(ng stx ltems art determined as
lndlvldua/ themes:
(1) Ftne cemmtcs, (2) Htgh�ejnctency d!� C~r~mlet Mw~lop~d
paradng membrone marertaJ, (3J Conductive
polyrner materfal, (4J Hlgh�crysm!linG polYmer I I
mateNal, (SJ Htgh�perjormanct erystal conno!
alloy, cnd (6J Compoalte mate~(al,
" It ts the development oj Jtne ceramJcs that e.vn.i o~ on�mie
ottr+QCts the mosr attenNon among them, Thr
nemts oj severol companies, such as Asaht
Class, etc., can be mentloned as enterprtaes
pe~ticlpating !n rhts p?o/ecr. Fig. 1. Comparison of Ceramics to Be
High�efflciency sepcrating membrant, con� Developed with Former Ceratnics �
duetlve polyme~, and hlgh�crystalilnt polyme~
COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd. . .
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MOR O~FIC'IAI. US~ ONLY
SCIENCE AND TECHNO'LOGY
PRODUCTION OF MALIC ACID DESCRIBED
Tokyo TECHIdOCRAT in English Vol 14, No 5, May 81 p 83
[Text]
Kyowu Hakko K.K. hos succeeded in de� FrN:~dry y~~st 10p
veloping e unlque proceu for production oj Ae~tfe aeid 16p Kitown (196)
malic acid by tmmobilfized ~en:yme. BYtY~~e c~llulos~
Difp~rwr 3p Physfolopieal ~5m1
The organlsms ustid jor thrs purpon have wl~ solution
joflowing advantages: Isobutyl~c~t~t~ 135p
Good growth rutt of the orgonisms (~s wlv~nt)
Less p?oductlon oj by producrs, such as
succfnlc acld und other organic acids Mixinp und~? viporou~ stirrinp
(3~ Stabfe activlty oj jumarax Add poly~thyl~M O~Yeol (196)
The frna! exchange rotio (yteld ojmalic acld)
is approxlmately 60~80~'o agalnst jumaNc acid. Mixinp
Add n-H~x~ne
F iltr~tion
V~cuum dryfn0
Immobiliz~d orp~nifms
Fig. 1. Fixing Method of Orp,anisms
Table 1. Properties of Organisms and Immobilized !'roducts
Aetivity Optimum Optimum M~thod of Actfvity Activity Hslf-lif~
V~srt unit/q.cell pH t~mp.l�C) immobflfzinp unit/p.e~ll
Duolit~ A�7 11.0 10.6 -
Piehis 329 6.5 35
CAB mieroesp 30.2 38.0 ~30 dsys
� membransfsciem
Duolice A�7 9.0 9.3 -
Candide 399 8.5 40
CAB mierocsp 40.5 40.0 160 d~Ys
Iypolytic~
COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd.
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, , 101 ~
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- SCIENCE AND TECIiNOLOGY .
PROSPECT OF PRACTICAL WAVE FORCE ELECTRICITY GENERATION
Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 88
[TeXt] � Hitachi Shipbuilding 8c Engineering Co. has force as well as the impact of flying tocks that
decided to launch into the field of wave force come with breaidng waves.
etectricity generation, which is attracting atten- Reportedly, about 159b of the energy from
tion as a potentiat source of petroleum-sub- the force of breaking waves can be used as
stituting energy. The company has designed a electricity. Also, the generating capacity of the
� wave force electricity generating plant on a new system averages 20kW with a maximum of
practical scale. 28kW.
Wave force electricity generation consists of At present, electricity, generating cost by
converting the energy of waves washing the wave force is about ~1 million per kW, com-
seashore, etc. into electricity generating energy pared with about ~200,000 per kW for thermal
or heat energy. The company, which wants to generation using heavy oil as the fuel. But the
become less dependent on shipbuilding than cost can be cut if the practical use of wave
ever as its principal business and progressively force for electricity generation progresses.
move into energyrelated areas, has long been Because of its output and the geographical
aware of these areas, and for two years has nature of its coastal location, electriaty generat-
carried out the necessary research in coopera- ed by this system is suitable for use as the
tion with professors from the Muroran lnstitute light of a lighthouse~ snow mel2ing on em-
of Technology. bankments and the warming of water for the
In the present design, the wave force electri- cutture of young fish and young shellfish.
city generating system has a pendulum board, Wave force electricity generation is now '
3m wide and 4m long, installed in front of a being tested by the Agency of Science and
breakwater. To this is attached an oil hydraulic Technology as well as by private groups, which
cylinder an oil hydraulic motor -?an electri� ~unched into related research, but the
city generating turbine so that, when the p~ospect of its ptactical appGcation is not yet
pendulum board is shaken by wave force, the ~ sight.
clectticity generating turbine turns asthe shake
works on the oil hydraulic system. The electtic _
Oil hydrsulic c
generator and others are positioned in the O~I hydraulie o
cytind~? oP~ratinp shaft
hoUowedout interior of the caisson used for ~ ` ~x
the breakwater. � E
The company has made a detailed analysis v'~ ~
of wave force data gained at a certain town o ;
on the Sea of Japan side of Hokkaido, said to ~ ;
be one of the big rough-wave areas in the ~ _Oil hydraulie ~o
~v fluid
world, as well as from repeated water-!ank W Oil hydraulic cylinder
tests. 6ased on the resuits of this analysia and
tests, they have incorporated into the design Stopp~r=
an idea that enables energy to be steadily re- p~~duium board
- covered, even in summer when the local wave
force is small. Further, the pendulum board and Fig. 1. Setup of a Wave Force Power Generating
the shaft supporting it are designed ao as to be
structuslly suong enough to withstand wave P~ant
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SCIENCE AND TECHN~LOGY
RECOVERY OF SEA WATER URANIUM BY MICROORGANISMS
Tokyo 'PECHNOCRAT in English Vol 14, No 5, May 81 p 88
[ Text ] + prof. T. Sakaguchi et al of Miyazaki Medical 0.196 sodium carboi~afe solation when 41ie
College have developed a system to efficiendy microotganisms are soaked in the solutiori. ~
recover uranium from sea watar and mini!~g Ttie problem ia thaY the abaorbing capaaty
waste water by means of an absorbent con- of tlie microorgani4ms decreaees; or the devic~
sisting of microorganisms wrapped in a is blocked, if the absorption aad desorption of
plastic. It involves the technique of causing uranium is repeated many times. So, the re-
microorganisms to absorb uranium dissolved search team fixod microorganisms by wrapping
in water, and existing in very small quantities, them in polyacrylic amide so that their cells
by teking advaniage of the proceu of biological cannot break and. melY in the solution. This
magnification, which used to be a problem in enables the absorptioe and desorption of
connection with Minamata disesse, ate. This uranium to be repeated by letting sea water
process is attracting the attention of many t7ow continuously.
circles as the first instance of the application In their tests using solutions with a uranium
of biotechnology to the area of atomic energy. concentration of lOppm (ppm equals 1/
They had t`irst noted the fact that there an 1,000,000). Chlorells and 4ctinomycetes ab-
microorganisms that especiaUy absorb and ac- sorbed 0.159g per' gtam and 0.312g per Bam,
cumulate in ~heir bodies uranium alone of all respectively, of uranium. The~ activity of the
water~issolved metals, and started tests on fixed microotganisrtis scarcely changes after
two types: Chlorella regulus of the Chlorella absorption and desorption is repeated five
~oup and sueptomyces beionging to the group times continuously. Thus, Uu prospect is that
of Actinomycetes. these microorganisms can be used for a long
It is still unknown how these two types of period.
micruorganisms absorb uranium but two meth- According to Prof. Sakaguchi, this method
ods aze considered possible. One it physical is not yet at the stage of being able to di~cuss
absorption onto the surface of their cells and its economic feasibility. and what must be done
the othei is the chemical method of accumulat- in the future is to discover organiams - in-
ing in their interior via the cell' membrane. citding soil Qrganiams living resi u"ratiium
Enriched uranium leaves the cells and melts in lodes - that absorb uranium more efficiently.
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SCIENCE AND TECHNOLOGY
DEVELOPMENT OF AUTOMATIC ANALYZING SYSTF~I FOR SUSMARINE STRATA
Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 89
[T@Xt] Obayashi Cumi hcs developed jor prociical
use a"Marine Prorie System" thai can outo� taking advontage oj the facr that each stratum
has its own acoustic characteristtcs (acousiic
matically anafyze submc?ine srrata. impedance, attenuadon jactor, scattering co� '
In rhe pcsr, submartne geologica/ prorles ejficient, erc.) and that these have constants
have been made by acoustic detection whereby within generaliy known ?anges accordtng to the
o smal! number oj sktiled rechn(cians draw facies /siudge, cfay, slit, snnd, grave( ond rockJ
strotal 6oundaries and injer jacies. The newly
devtloped system draws strarci boundaries in oj the stratum.
accordance wtth the jorms of 3.8�Hz ult~asonic Ma~n Capacttles:
waves transmirted ro the sea bottom and re� Mloter depth : 2~-1 SOm
ceived ejter having been bounced back jrom Depth : Approx. 40m (case oj
there end investigares the comQonents of sub- sofratratumJ
martne straia. Since ir handier fntegreted com� ~cision .-0.2+0.3
purer processed deta rhat have been gained, it Processingspeed : IO~ISkm/day
enobies inexperienced technicicns to rapidly APA~lcadons:
o6rain highiy reliable geological profles. The (1/ Selection ojsites for construcsing porrs,
outline oj the system ts os;
oilows: sea berths, marlne airports, pfer joundations
Ir combines a magneric recorder with a .for sea-crosstng bridges, and other marine
conventtonaJ magneto�strictive sound locaror. strucrures; assessment of svbmarl�e ground
Thrs recorder records on electric dtscherge re- 8eology and basemenr topography; and svrveys
cording paper and, et the same rime, .sonic ~o conflmf disMbutton and thickness oj soji
- waves reJlected are stored on mogntHc rape. s~�~M.
Magnettc memory rhus obtained is input into, (2/ Selecdon oj sttes sufrabk jor providfng
the co~nputer, which is cenira! to this system, ltttora/ areas, such as bulkheods and rcclaimed
and rhe results oj compurer proc~ss(ng are /ands; seJection of borrow pits and spo(1 bonks;
drawn by the XY plotter as o jlna! geoJogical r.alculatiors oj soii volumes: srudy ojdrfjr sand;
� profile. The compurer processtng has the joUow- and siudy oj bulkheed circuJar rupiure.
ing two major juncdons: (3J Conjirmatton oj dlstHbution and th(ck-
(1 J Decision ojStrara/ Boundary ness oj sludge; :hLs rs necessary jor environ-
fn thc previous mogneto-strictrve sound ment tmproving works, �ruch as siudge dredgtng;
_ focatur, hardl~~ arty errors caused by tlre extent divlslon 6etween jloatlr4g mud atd sunken n~ud;
oj sonic woves were co�recred as it was assumed ond eonJirrnadon of dredged oroas.
thnt j~K~ snnic waves go sideways. The new (4J Survtys necessary for Jishery planning
sysrem incorporares a newly deve(oped progmm and design, such as planning and designing oj
to raptdfy correct rhese eno~s. Thus, !t con fish farms and iayour of man�nlode ,~ah
eccurarefy assess the shape oj a htgh(y tr� habttats.
regular basemenr. (SJ Surveys necessary to devtlop maitne
(2) Determtnatfon of Snota mineral resources (tncludtng dNft�sand mtnewl
The sysrem determines the facies cj strara deposltsJ or to develop submadne petroleum .
through comparison of rhe obaerved wnve jorm (excavatlon, aelecHon oj position of prodacirtg
and the wave jorm panern simulodng it, plat)'orm, etc.l
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SCIENCE AND TECHNOI,OGY
pRODUCTION, SALES OF INDUSTRIAL ROBOTS DISCUSSED
Shinmeiwa Industry
Tokyo NIKKEI SANGYO SHIMBUN in Ja~anese 4 Jun S]. p 6 �
�LR'ext7 Shinmeiwa Industry Co Ltd has now established a system to produce 30 industrial
robots per month. The production capacity of 15 units this spring has been doubled
in one sweep in order to accommodate the dramatic increase in demand for industrial
robots in line with the tide toward labor-saving and automation of groduction indi-
cated i.n the industrial world. For the time being, the main model is the robot for
arc welding, but the company intends to expand production widely to encompass various
moc3els, such as shearing robots that cut steel p~:ates and conveyer robots for press
work.
Shinmeiwa Industry has recently begun to sell "Robel ~phoneti~ J�' welding:robots
with multiple joints. This is the latest machine which has adopted a 16-bit parallel
. processing microcomputer in the brain to control the body of the ~obot, and it is
characterized by the high speed and precision of various types of welding w?ork that
can be done. Shipment will start in the summer of this year, but the company has
- already receivec3 orders for nearly 30 units.
The company is a"shop of long standing" in welding robots and has sold large
machines focusing on rectangular coordinate type products.. Up to the end of last
year, it maintained production on:a scale of about 10 units a month, then r.aised it
- to Y5 units a month due to the increase in orders.from automobile makers and
electrical machinery makers this spring. Now, monthly production capacity has been
upgraded to 30 units, reflecting the popular acceptance of the latest small "Robel
~honetic7 J." In the Takarazuka plant, Hyogo Prefecture,. where the robots are made,
full operation has continued while the production eq.uipment has been reinforced. At
present, orders for robots are coming in at a very fast pace, and it is very likely
that the necessity to expand the production equipment will be felt by the end of
this year.
Arc welding robots will be singled out as the main machine_ model for the time being,:
and the company plans to stick to the policy of not advancing into the fields of spot
welding and painting robots for the automobile industry. Iiowever, it is thinking of
getting into a wide variety of models, such as a shearing robot and a press conveyer
robot by utilizing the technology for arc welding, a fusing robot by using gas and
plasma, and a sand-blast robot which will specialize in sanding.
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The dem~nd for Japanese industrial robots has been climbing steadily since the
"Initial Year for Ro~ots" last year, and it is expected to grow c.ontinuously for a
while at an annual rate of 40 to 50 percent. Although Shinmeiwa Industry is affiliated
with Hitachi Ltd, the future "father and son conflict" is likely to become the ~avorite
gossip of the business world since the parent Hitachi has started to be serious about
selling arc welding robots. '
COPYRIGHT: Nihon Keizai Shimbunsha 1981 ,
Iiitachi Ltd
Tokyo NIHON KOGYO SHIMBUN ~n Japanese 5 Jun 81 p 7
L'I'ext7 Hitachi Ltd (presid~nt, Hirokichi Yoshikawa) has consolidated a policy of
setting up engineering centers in the United States and ~;urope and using them as
strategic bases in order to prepare for the expansion and sales of industrial robots,
said to be the strategic model for the eighties. The centers will not only be in
charge of the engineering and maintenance indispensable for the sale of robots, but
will also be given a comprehensive function for robot sales in the United States and
Europe. Hitachi is ready for sales and production tie-ups in advanced countries,
and the centers will serve as a main body to promote these activities overseas.
The company has been producing industrial robots on a commercial basis using tech-
nology of its own since 1970; it offered a high-class robot for arc welding, "Mr
Allos ~honetic7" to begin with, and a multipurpose work rohot, "Hitachi Process
Robot." Process robots are maintained steadily in full production and are used
primarily for welding in smaller businesses. Also, the assembly robot, regarded as
the "winner" among industrial robots, is being developed by the organization of a
companywide project team, a special case in this company, indicating its desire to
- earn the status of an all-out robot maker.
Generally speaking, the fever for robot introduction in the industrial world is
higher than expected, and Hitachi is also k~~ot busy coping with the domestic demand.
However, the interest in Japanese-made robots expressed overseas is just as explicit
- as it is here. According tv the company, not only is it facing a rush of orders but
also it receives many visitors from industries wishing to sign up for sal~s or pro-
duction tie-ups. ~
With this in mind, Hitachi has finally been driven to begin full-scale promotion of
industrial robot business overseas, and it tentatively plans to use combinations of
three systems to meet the actual conditions of the market in each country, stressing
primarily the markets in America and advanced European nations: 1) sales by Hitachi
itself, 2) a sales tie-up with local capital, and 3) a similar production tie-up.
Already, Hitachi has a tie-up with Automatics of America, but the company is now in
the stage of selecting second and third tie-up partners on the pattern of that
established with Automatics on the basis of engineering ability, sales network, future
possibilities and service network.
On the other hand, the company views the systematization of peripheral technology
regarding robots as the selling point for robots, and attaches great importance to
engineering for the introduction of robots, which led to the conviction to set up
engineering centers in America and Europe. It is planning to promote robot sales
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.tft~�~ t h~� ~�n,t i ~i~~rt in.l .~~~�1 ~:r? t.�r ::~�~:l r?n:: :u r. r::t yt~i i:;ha.1. '1'hat :,~~r.al,:, c,~? i l.,r. l C
i~i .~r:~~ciUiny tlitarhi's c~~markat~le spirit. in robot sales. According to its concepti~n,
cenLers will be set up a.t Hitachi America in New York and Hitachi Europe in Dusseldorf,
West Germany. These centers reportedly will handle not only robots but also Hitaahi's
other strategic products such as microcomputers, although the majority of the business
will be related to robots.
COPYRIGHT: Nihon Kogyo Shimbunsha Tokyo Honsha 1981
Kubota Ltd '
Tokyo NIKKAN KOGYO SHIMBUN in Japanese 6 Jun 81 p 1
LText/ Kubota Ltd (president, Keitaro Hiro) has confirmed its policy to advance into
the industrial robot sector. It is entertaining the idea first of developinq by
itself robots for welding and painting as a device to rationalize the production of
its major products--agricultural, construction and industrial machines and equipment--
and then of promoting them as manufactured products in a few years.
' Many machine makers have entered the robo~ market in one way or another, but it is
rare that an agricultural machine maker has made such an entry. Development of the
robots will be tackled mainly by the head office, research institutes belonging to
each business department, and the Electronization Promotion Office established
earlier. "We hope to utilize electronics in every way we can," is the message
~ (executive director Takatsugu Shimamoto).
Kubota Ltd introduced about 20 industrial robots (purchased) in the past, which led
to the rationalization of production and labor-saving in the Makikata Manufacturing
Plant of the construction machine and equipment sector and in the Sakai Manufacturing
Plant of the agricultural machine and equipment sector. Among these, several robots
are "improved robots" based upon the technical know-how and specifications of the
company, evidence of one step made toward the development or rol~ots by itself.
These robots are used for arc welding the perimeter of the boom of its mini-backhoe
in the construction machine and equipment sector, and for painting bodies of culti-
- vators in the agricultural machine and equipment sector. They are concentrated in
workshops with monotonous work or an unfavorable work environment.
Already in the research stage, the company has achieved the aim of developing some
robots for painting, but it has decided to rechallenge the research anc3 development
of the robots based upon the company's judgment that "a new level robot is required
suitable for the electronization era" (executive director Shimamoto).
Kubota Ltd, a reputable major agricultural machine and equipment tr~aker, has a sophis-
ticated automation technology in the fields of tractors and combines. In particular,
it is said that the company is on the threshold of a stage where "complete unmanned
driving is possible in the field of combines which are used in farming. Last year
it developed its "Sunshine Automatic" (with an automatic cultivation depth control
attached) as the first of the electronized machines. Subsequently, in the field of
tractors, it completed a Monroematic that automatically controls the horizontal level
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as a result of systematized electronic technology and oil pressure techi~ology.
Additionally, the c;ompany is getting into the manufacture of related equipment and
devices such as sensors and actuators.
Upon advancing into the field of industrial robots, it is mobilizing its total capa-
city, not to mention electronic technologies, as a maker of machine.s, pipes and con-
struction materials.
COPYRIGHT: Nikkan Kogyo Shimbunsha 1981
Osaka Transformer
Tokyo NIKKEI SANGYO SHIMBUN in Japanese 8 Jun 81 p 6
LR'ext7 Osaka Transformer Co has launched an attack in the field of ar~ welding robots
which is showing rapid growth. In August, a plant specializing in robots will be
completed, which will raise the monthly production capacity threefold, to a level of
50 units. Also, not only has the company set up an internal task force exclusively
in charge of the sale of robots, but also a sales network of approximately 30 agents
has been organized nationwide to engage in operations to expand the company's share
of the market. Then, in the near future, it plans to begin exporting to Europe and
America. With this aqgressive domestic and foreign business posture, the company
intends to go after Vasukawa Electric Manufacturing,which is now at the top in this
field of the business world.
Osaka Transformer recently commenced the construction of a factory to specialize in
robots at the Settsu plant, Settsu-shi, Osaka Prefecture. The floorspace of the
factory is 3,500 square meters, and it will go into full-scale operation upon com-
pletion, which is scheduled for the end cf August. In the past, robot production
equi~ment was scattered throughout the Settsu plant. After the completion of the new
factory, everything will be consolidated here. This will increase the monthly pro-
duction capacity from the current 15 to 50 robots. The Settsu plant has further mar-
ginal space for additions, and there are plans to build additional factories if the
demand for arc welding robots rises further.
Likewise, from the aspect of sales, approximately 35 project teams have been organized.
and put in the forefront of the arc welding robots business. Also, at around the
same time, an exclusive national robot sales network was set up. Thirty agents were
selected, mainly from among the sales agents (approximately 450) for welders manu-
factured by this company, and a technical education for the sale of these robots is
being given to these agents. Meanwhile, facilities for demonstration and display,
which are indispensable to the sale of robots, have been installed in metropolitan
Tokyo, Osaka and Nagoya, and another one is to be openec7 soon in the city of Hiroshima,
in order to offer attentive service.
Osaka Transformer is a major welder maker. The company started selling a rectangular
coordinates type robot for arc welding, the "Soar T", 2 years ago, and subsequently
offered for sale a multi-joint type, "Soar K", this spring. In the last fiscal year,
m~re than 100 arc welding robots were sold. There is a plan to raise the sales of
the robot sector at a pace of close to 200 percent a year to "foster this sector as
one of the three pillars of the business along with electrical equipment and devices,
and welding machines" (company president Keijiro Kobayashi).
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The demand for Japanese industrial robots rose dramatically starting last year, dubbed
the "Initial Year for Robots." It is expected that the marke t scale will expand at
an annual rate cf 40-50 percent ~or a while. Shipments of arc welding robots in Japan
total 4.5 billion y~n. This is expected to grow eventually to a 40-billion-yen mar-
ket in 1990. At present, it appears that Yasukawa Electric Manufacturing is running
far ahead,of the others. Recently, however, Hitachi Ltd and Kawasaki Heaw Industries
have been following at a fast pace. It appears i;hat the competition for a share of
the market will be further heated up with Osaka Transformer edging into the scene.
COPYRIGHT: Nihon Keizai Shimbunsha 1981
Kawasaki Heavy Industries
Tokyo NIKKEI SANGYO SHIMBUN in Japanese 8 Jun @1 p 6
~ext7 Kawasaki Heavy Industries (president, Zenji Umeda) has developed "Kawasaki
Unimate Model 9753-EP," a robot for painting with joints and microcomputers, and has
_ begun selling it on a commercial basis. This robot, suitable for painting second
and final coats on a car body, has a seven-axial structure with a travelling shaft
and can paint continuously conveyed car bodies regardless of the hollow areas such
as engine room, trunk interiors and the door openings. The invention of this robot
completes the series of painting robots covering virtually all of the auto body
painting process, combined with the previously developed robot (M~odel 3653) for
painting the underside of the car, generically called robot for undercoating, and a
robot (Model 8653) for the roof. Kawasaki plans to strive to expand sales primarily
to automobile makers. ~ ~ ~
"Model 9735-EP" is characterized by a configuration of shafts ~or movements, con-
sisting of six shafts for right and left revolutions, to and fro turns,up and down
turns, wrist bends, wrist revolutions and wrist twists, and i~n addition one more
shaft for travelling right and left within a range of 3 meters. Because of the design,
it is most suitable for, painting second and final coats on a car body. Also, with
a general six-axial structure, it is said to be useful for painting ttiings other than
automobiles, such as refrigerators and washing machines, categorized as "white home
appliances."
The carryable weight and the precision of the mechanical parts are 5 kg and + lmm
(PTP) or + 2mm (CP) respectively. An electric-oil pressure digital servo system is
adopted for the controls.
Not only can the orthogonal operatYon of the robot itself be taught through a remote
operation, but also the orthogonal operation and turning operation of the gun can be
taught, which makes it easier to take any position and posture. Also, if an optional
joy stick (control stick) is used, direct teaching is possible by applying physical
force under 500 grams.
Servo DPF compensation and differential compensation are adopted. This simplifies
the matching of each shaft. Furthermore, the editinq function is characterized by
the variety of abilities, such as step input, cancellation and transfer, correction
of outside command values, and actual line data conversion from off-line teaching
data etc.
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The price of this machine, incluc3ing accessory equipment such as a travelling
function, is 18 million yen. It is expected that 20-30 units will be sold per year,
mainly to automobile makers.
COPYRIGHT: Nikkan Koyyo Shimbunsha 1981
Fujitsu Fanuc
Tokyo NIKKEI SANGYO SHIMBUN in Japanese 16 Jun 81 p 6
- LText7 On the 15th Fujitsu Fanuc disclosed that its policy is to become aggressive
- in the field of robots. Specifically, it announced the intention: 1) to offer for
sale a specialized internal type handling robot "Mac3e1 00" for an NC (numerical
control) lathe, and to mass-produce it on a commercial basis after it is introduced
for the first time at the Fujitsu Fanuc "Processing Robot Exhibition" ta be held at
the head office in Hino-shi, Tokyob in August; 2) to start selling an a~sembly robot
"Model 00," which has been under development for some time, in the European market
through its sales tie-up partner, Siemens of West Germany, taking advantage of the
European machine tot~l fair, the "FMO show," to be held in Hanover, West Gertnany,
this coming fall.
Fujitsu Fanuc in the past has merchandised three models of robots: first, an inde-
pendent handling robot "Model 3" (sale price, 12 million yen) for NC machine tools
. such as the MC (machining center) that puts on or takes off a maximum 50 kg workpiece
(object to be worked), a"Model 1" (sale pric~, 6 million yenl that can carry a
maximum 20 kg workpiece, and a"Model 0" (sale price, 3.5 million yen) that can
carry a maximum 10 kg workpiece. This time, it has developed a"Model 00" which can
handie a maximum of 10 kg and is in~egrated in the NC lathe, the lowest level of tl~e
model.
Since the demand for labor saving and manless operation of the cutting and shaping
process is,rising among smaller users, the company has merchandised an internal
robot that can easily be fitted in the NC lathe and can load the work precisely on
the NC lathe. The price has not been decided yet, but the company confides that "an
unbelievably low price will be set" (president Seiuemon Inaba). The OEM (production
in the plants of the counterparts) system will be adopted, according to the plan, as
a sal~s method that sells products through the machine tool makers. The company . ~
estimates a minimum monthly production of 40-50 units.
Ikegai Iron Wurks already sells an integrated type NC lathe robot that can carry a
maximum 5 kg workpiece, and Okuma Machinery Works has merch~ndised an independent
robot, developed together with Kamiko Kenki, that can handle work up to 10 kg. Others
in the act are Yamatake-Honeywell which is striving to increase the production of .
an independent robot "Robo Ace." Yamazaki Tekkojo (head office, Okuchi, Aichi-ken;
president, Teruyuki Yamazaki; capital, 1 billion yen) has also decided on a plan to
enter the field this coming fall with its internal robot. In addition, Fujitsu
F'anuc, which entered this business ahead of others, will join them in the field of
machine tool robots. All in all, it appears that the struggle for a share of the NC
lathe robot market will be Purther intensified in the days to come.
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ln aci~i i t i~n, !'u j i tsu I'ariur intencis co ~re~are a sales system gradually for an +
assembly robot. This assembly robot "Model 00" does not come with a sensor (detector),
but it is an intelligent robot that can accurately assemi~le servo motors. It will
~itst be sold in Europe. Specifically, Siemens of West Germar:y, the partner in the
sales tie-up, will start to sell it on full scale after the robot is presented for the
first timP at the "FMO show."
Also, in Japan, it plans to "introduce 10 robots to the servo motor assembly process
in the head office plant in Hino-~hi, Tokyo, to be used for pra3uction activities
of its own, and later to sell them to outside customers" (president Inaba), and to
make the outside sales system ready by the end of the year if everything goes well.
For the time h~ing, the company has a set-up to produce a total of 90 units a month
combining three models, "Model 3," "Model 1" and "Model 0." It is certain that the
monthly production scale will surpass 100 units if the NC lathe robot "Mod~e1 00" and
assembly robot "Model 00" are added to the total.
COPYRIGHT: Nihon Keizai Shimbunsha 1981 .
Daihatsu Kogyo
Tokyo NIKKEI SANGYO SHIMBUN in Japanese 16 Jun 81 p 6
~'iext7 The PNC (programmable numerical control) lathe sector of the Daihatsu Kogyo is
being strengthened at a rapid pace--a tie-up with Ikegai Iron Works and the starting
of a manufacturing company through joint cagital investment with Mitsui & Co. The
NC lathe market has continued to expand rapidly with the increasing tide of rationa-
lization and labor-saving in industry. The activities of Daihatsu Kogyo, which is
striving to get a piece of the pie using the technical capacity accumulated as an
automobile maker, is drawing wide attention in the machine tool industry. Makers
specializing in robots cannot underestimate Daihatsu Kogyo, which devised the
original PNC system that stresses manipulability. It appears that Daihatsu may become
- a new "eye of the typhoon" in the NC lathe market. Therefore, we have interviewed
Masajiro Sugitani, executive director for the special machine sector of Daihatsu, to
ask him about the future strategy for the PNC lathe of Daihatsu.
Question: What is the purpose of the tie-up with Ikegai Iron Works?
Answer: Daihatsu is a slow starter in the field of machine tools. To gain enough
strength, it is sometimes necessary to join hands with a major machine tool maker.
Also, it seems that Ikegai Iron Works has been interested in the PNC lathe of Daihatsu.
Our intention was mutual.
Question: What are the details of the tie-up?
Answer: Our objective is to develop a new PNC lathe product by joining the technology
of the two companies, and to form a cooperative production system. For the develop-
ment of new products, the specific content will be decided between the two com-
panies. However, it is likely that Daihatsu will be in charge of the control device
and Ikegai will be in charge of the lathe body.
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Question: Does that mean you found an answer to the current issue of strengthening
the production system through the tie-up with Ikegai Iron Works?
Answer: That's right. For the time being, we can account for a monthly productior~
of 10 units from the Tada plant (Kawanishi, Hyogo Prefecture), a mont:~ly proc3uction
of 20-30 units from a company which cooperates with us in Aichi Prefecture and a
monthly production of 30 units from Yamagata Koki (head office, Takabatake,
Higashiokitama-gun, Yamagata Prefecture) established in April this year by joint
capital investment with Mitsui & Co. In addition, Ikegami Iron Works will join us
to achieve our current goal of having a structure ready to produce 100 uni~s a
month.
Question: What about your plans for export?
Answer: The PNC lathe does not even exist overseas. We believe it is a promising
item Por export. To prepare for this, we have already been granted patents in
major t;uropean c.ountries and in America. To give you an example of an actual,export
result, we have just completed an agreement to export five samples to South Africa.
Inquiries from overseas have risen to 250 companies at present. We are getting
- good bites.
Question: What about the centative export goal?
Answer: Thinking of the export ratio in the NC lathe market, which rose to 50 percent,
Daihatsu also wishes to make it a goal to achieve an export ratio of 50 percent for -
the PNC lathe. 4r'e will be on the right track to produce 100 units a month starting
next year, and we would like to allocate 50 of them for export.
- Question: How about future production expansion?
Answer: We view the Tada plant as the key point �or development of new products, and
its production scale will not be expanded beyond the present level. In the future, ,
we will mainly rely on the production increase at the Yamagata Koki and the expansion
of production contracted out to Ikegai Iron Works. In particular, we are interested
in putting our efforts in to expanding the production bases in the eastern areas of
Japan, since 60-65 percent of the total demand for the PNC is from Kantor region.
Question: Sales competition in the machine tool industry is intensifying. Doesn't
Daihatsu feel a need to fortify its company structurz?
Answer: Lxactly. So far we have received some 100 orders for the PNC lathe. The
market iu rather broad. Strengthening the business operation is the key to success.
On 1;1uly, Daihat~u Kogyo and Kaihatsu Motors will merge. In the rearrangement of
personnel in conjunction with the merger, more manpower will be distributed to the
machine tool sector.
Question: Please be more specific.
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ARSWEC: Although we use the sales route of trading companies specializing in
machinery for sales of the PNC lathe, we will not leave everything to them. We
would like to have an ample supply of service engineers to stress the importance of
dealing wi*_h technical needs. Ncw that we have ~chieved our goal of setting up a
structure that produces 100 ~nits a month, it appears that we can expect annual
- sales of more than 10 billion yen in the PNC lathe field.
~ COPYRIGHT: Nihon Keizai Shimbunsha 1981
Yasukawa Electric Manufacturing
Tokyo NIKKEI SANGYO SHIMBUN in Japanese 18 Jun 81 p 6
LText7 Yasukawa Electric Manufacturing is endeavoring to produce industria]. robots.
With sales of the new product starting in April, it is trying to consolidate its
position as the top maker of arc welding robots. Because of this background, some
questions were asked of Masayasu Nishizawa, an executive di~ector, concerning the
robot strategy. (Interviewer: reporter Matsumoto of the Kitakyushu branch office)
Question: How is the sale of the arc welding robot "Mortman" daing?
Answer: We started to sell the "Mortman" in FY 77. The sales have grown yearly since
then, from an initial 10 units in 1977 from both domestic sales and exports, to 40
units in FY 78, 150 in 1979 and 360 in 1980. We started selling a new product,
"Mortman L3" in April of this year, and we are expecting to sell 600 units, a 66.6
percent increase compared to the previous year, which is partially attributable to
the increase in the variety of the product. Since the beginning of this fiscal year,
already a total of 100 "Mortman's" were sold in 2 months, April and May, which gives
a clear sign that we can reach our sales goal without fail.
Question: How about the export of the "Mortman?"
Answer: We sold 560 units of the "Mortman" in 4 years, from FY 77 through FY 80.
Of these, 480 were for domestic use while 80 were exported. In the past our country
arranged tie-ups with Tors Teknik of Sweden, Messer Griesheim of West Germany, GKN
Lincoln of England and Hobart Brothers of America. Because of well laid out overseas
sales networks such as these, exports are steadily increasing. In FY 81, we are
hoping to export 60 units a year, and our export effort will be concentrated in the
United States. Because of this plan, in selling the "Mortman L3" in the United
States, for the first time more pressure will be exerted throuqh Yasukawa Manufacturing
_ America, a subsidiary of our company, separate from the sales through Hobart. We
are thinking of raising the export ratio to 50 percent from the present 10 percent
in FY 85.
Question: Where do industrial robots rank in the importance of your business at
Yasukawa Electric Manufacturing?
Answer: We consider industrial robots to be a growing sector parallel with NC
J (numerical control) devices, sequence controllers and servo motors, and we are putting
our effort into the growth of industrial robots in the future as we did in the past.
we anticipate that industrial robots will show remarkable growth, and we hope to
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expand the sales in this sector eightfold in 5 years, from 3.6 billion yen in FY 80
to about 30 billion yen. We estimate that our company's total sales will be somewhere
between 150 billion yen and 200 billion yen in 5 years, which means that the sales
oEth~ robot sector will reach 15-20 percent of the total. In FY 60, the sales of
the robot sector were apgroximately 5 percent of the total sales. Therefore, this
is one of the large grow'ing sectors in the operations of Yasukawa Electric Manufacturing.
Question: Yasukawa Electric Manufacturing is known to be the largest maker of arc
welding robots. Do you have any plans in the future to handle other robots besides
arc welding robots?
Answer: No. We will go all the way with arc welding robots. However, the present
"Mortman" is usable onlyfor welding mass-produced items. Our future task is to
develop a welding robot which can be used at workshops where a small number of
various items are produced. Currently, we are trying to develop a model with
judging functions such as vision, hearing and touch by integrating a sensor (detector)
in the robot. We may even start to sell this new model at the beginning of the
f.all.
Question: Recently, Matsus'~ita Electric Industrial Co~rpany, Mits~~bishi Electric
Corporation, Osaka Transformer and other new Eaces have entered one after another
into the arc welding robot field. How do you intend to challenge these newcomers?
Answer: We are the forerunner in the field of the arc welding robot, and we are
conEident about our technology. The "Mortman" was built by joining a servo motor and
- an NC device. We manufacture both components in our company, which is a.lso our
strength. We are especially hopeful that the "Mortman L3" can help us do well in
competing against other contending companies. This new robot weighs only one-fourth
oF the conventional products of our company, and also costs 25 percent less. For
the present we will work hard to sell this new product, and then we will be ready
with a robot equipped with a sensor to be initially introduced to the market in the ~
fall.
COPYRIGHT: Nihon Keizai Shimbunsha 1981
Ishikawajima-Harima Heavy Industries
Tokyo P~IHON KEI'LAI SHIMBUN in Japanese 23 Jun 81 p 8
LText~ Ishikawajima-Harima Heavy Industries is making a reentry into the industrial
robots field. In the past the'company had to be at a retreat because the ind~+strial
robot market was not ripe, but it has decided to challenge this field once again in
c.onsideration of the fact that the industrial robot has entered a new era of expansion
and thc demand has, grown rapidly starting last year, dubbed the "Initial Year for
Robots" in Japan. Soon the company will complete the development of a welding robot,
which it will first introduce in its own plants and then will merchandise as early
as next spring. Recently, the company has become eager to exploit tk~e mechatronics
(electronization oE machines) market as a pillar of the non-shipbui3.ding plant sector.
In order to foster the welding robot as a major commodity of this sector, it plans
- to launch an aggressive sales campaign aimed at the shipbuilding construction
machinery and industrial machinery makers.
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The industrial robot "GMMC" (grouped manipulator module system), to be completely
developed soon by Ishikawajima-Harima, has multiple joints in its arms and has the
latest 16-bit parallel processing microcomputer in the control section, which is
_ equivalent to the human brain. Tentatively, it will be used only as a welding robot.
Next October, the first model will be introduced to the Yokohama plant of the related
- company, Ishikawajima Kenki (head office, Tokyo; president, Yoichi Doko; capital,
2.4 billion yen). After it is fully brokQn in here, it will be commercialized_and
sold extensively as early as next spring if all goes well.
The welding robot weighs only 80 kg, and is characte~ized by small size and light
weight. It is designed so that it can be used even in a small and crowc3ed plant by
suspending it from overhead or mounting it on a wall. Also, the company has adopted
a group control system whereby one microcomputer collectively controls multiple .
robots. The price has not been determined, but the target price is somewhere around
10 million yen per set of two robots. This model is highly likely to surpass greatly
the current welding robots in cost performance (ratio of performance to cost).
Ishikawajima-Harima developed a cylindrical coordinates type industrial robot in
1968 to advance into this field. However, the scarcity of demand fxom industry led
the company to retreat from this field 10 years ago.
This time, the company has decided to reenter the market because of the rapid increase
in demand for robots from the industrial world encouraged by: 1) areas of use for
industrial robots have been clarified; 2) thF~ tide of automation and labor-saving in
enterprises is rapidly taking over due to soaring wages and shortage of manpower; and
3) an inexpensive high-class robot can finally be realized due to the daily progress
of microcomputers.
The FY 80 production of industrial robots compiled by the Japan Industrial Robot
Association (chairman, Yoshio Ando) was 74.4 billion yen, an 84-percent increase com-
pared to the previous year. For the time being, the demand will grow at a pace of
over 50 percent a year, and this industry is expected to become a 100-billion-yen
industry by the beginning of the 1990's. The main use will be inthe fields of
welding, press, machine tool and plastic processing. However, Ishikawajima-Harima
at present plans to single out the welding robot, which is the field in which there
_ is most demand, and exploit this market. .
Last fall, the company organized a project team specializing in robots to expend
all its efforts on development. The reentry of this comprehensive heavy industries
maker will be likelyto become a considerable threat to the existing robot makers.
� COPYRIGHT: Nihon Y.eizai Shimbunsha 1981
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SCIENCE AND TECHNOLOGY
SALES TACTICS OF 64 K RAM MANUFACTURERS DESCRIBED
Oki Electric
Tokyo NIKKEI SANGYO SHIMBUN in Japanese 5 Jun 81 p 5
[Text] In August, Oki Electric Industry Company will begin mass production of
_ what is reported to be its next strategic product, the 64-kilo-bit RAM (random
access memory), at a monthly rate of 300,000 units. In preparation for this, it
has actively begun attempts to open up sales routes in the United States, which
company president Masao Miyake has designated as its "main targeted market." It
will market its devices to personal computer manufacturers through a local sales
subsidiary, OSI (Oki Semiconductor, headquarters in Santa Clara, California) while
expanding publicity concentrating on the company's IC products in order to in-
crease local awareness of Oki Electric.
ThP 64 K RAM is used as part of the computer's main memories and is viewed as
the foremost form of VLSY (very large scale integration) and the latest in tech-
nological products. Oki Electric's policy is to begin full-scale operation under
a wholly owned subsidiary, Miyazaki Oki Electric (located in Kiyotake-machi,
Miyazaki Prefecture), and start the largest mass production in the industry,
300,000 units per month.
However, the gresent uses of the 64 K RAM inctude only Nippon Telegraph and Tele-
phone's digital communications processing computer, the "DIPS11 series" and parts
of the digitalized electronic switching apparatus, and Fujitsu's first personal
comp~iter, the "FM-8" which is equipped with internally produced 64K RAM's. The
demand from mainframe manufacturers, which are expected to be the chief usera,
has ~�et to materialize in either Japan or the United States.
Therefore, Oki is conceatrating its marketing approach on U.S. manufacturers of
personal computers and electronics parts such as Apple and Commodore, which are
expected to purchase large amounts of the 64 K RAM very soon. Samples are already
being shipped th rough OSI, and if possible, ~ki would like to work out long-term
supply contracts before the year is out. �
Also, in con~unction with sales to these specialized manufacturers, President
Miyake has determined that "it is urgent to increase the local awareness of Oki
Electric as an IC manufacturer," and publicity concentrating on IC's is being
_ carried out vigorously. Results have appeared quickly. According to Pr~sident
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Miyake, U.S. profesgional trade journals and magazines "always mention the name
of Oki Electric when~tfiey run a special section on~VLSI.
A3tachi
Tokyo NIKKEI SANGYOi SIiIMBU1~T in Japanese~ 10 Jun 81 p 5~
[Text] Hitachi, Ltd is the leading manufacturer of VLSZ's (very Targe scale
integrated circuits). In order to establisti a mass-prod'uction capability for
64 K RAM's, it will begin production next year at a Rofu branch pla*it (located
in Ryuocho, Kyoma-gun, Yamanashi ErefQCture). At present,.it is pr~xlucing Z00,000
units a month at the Musashi plant (located.in Odaira city, Tokyo)`, a"new glant"
of the Kofu works. According to Eicecutive Managing. Director Hirosh3. Asano,.. the
policy is to "begin fu11-scale mass production in the latter half of this fi.scal
~ year.. It has been decided that tlie monthly production of the>Musashi plant wi11
- be increased to 600,000 or 700,000 units in tae last half of this fisca'~ year.
This will be further expanded when production starts at the Kofu branch plant,
so Hitachi is expected to ~merge as the industry leader in 64 K RAM's.
The 64 K RAM, used in the computer's main memories, is am advanced technological
product which is viewad as the "next-generation strategic product." The industry
leader, NEC, along with Hitaclii, Fujitsu, and Toshiba is naa carrying out trial
mass production at the rate of 100,000 to 200,000 units a month.
Oki Electri~c Industry and Mitsubishi Electric are attempting to increase their
share of the 64 K RAM market at one blow by building advanced.manufacturing plants:
the Miyasaki Oki Electric plant (in Kiyotake-machi, M3~yazaki Frefecture) and the
Kumamoto No 2 plant (in Nishiai-machi, Kumamoto Prefecture)~. Until recently, it
seemed that they would take a leading position in the industzy when they com-
pleted these plants and put them into operation this summer. However, at this
point,. the large manufacturers t~at had already begua~making these devices began
Co assert their leadership with the 64 K RAM.
A good example is the number two company in the industry, Hitachi. According to
Executive Managing Director Asano: "Actual demand for the 64 K RAM has already
begun.to appear and the period of real demand will start next spring." Therefore,
a dec~.sion was made to increase production at the Musashi plant in the last half
of this fiscal year to 600,000 or 700,000 units a month. This is eertaia to be
the largest amount of mass production in the industry. Bur Hitachi will also
install a mass-production line at the Kofu branch plant for 64 K RAM's.
Details such as the exact volume of mass production and production startup Cime
will be worked out later. However, when the product;on line at the Ko�u branch
plant goes into operation, Hitachi's 64 K RAM production is expected ~o exceed
1 million units per month next year.
If this happens, Hitachi will be the largest supplier in this field among the
IC manufacturers of both the United States and Japan.
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Mitsubishi Electric
Tokyo NIKKEI SANGYO SHIMBUN in Japanese 17 Jun 81 p 5
[Text] Mitsubishi Electric has decided to begin a second construction pro~ect
(an addition) in Building C of the .~umamoto No 2 plant (located in Nishiai-machi,
Kumamoto Prefecture) in order to establish a better mass-production capability
for the "next-generation strategic product," the 64 K RAM. When this plant goes
into operation next month, it will produce 100,000 64 R RAM's a month, and this
' will be expanded to 200,000 by the end of the y2ar. The second construction pro-
~ect, which is scheduled for completion in June of next year, will increase pro-
duction to 400,000 units per month.
- Mitsubishi Electric`s "brain plant," the Kita Itami works (in Itami City, Syogo
Prefecture), produces 30,000 to 50,000 64 K RAM's per month. The recently com'+
pleted Building C of the Kumamoto No 2 plant was built as a mass production plant
for these devices and when it goes into operation in July it will produce 100,000
64 K RAM's per month.
The company's policy, according to Seud.conductor Division General Manager Hixoo
Sato, is to "raise monthly production to 200,000 64 K RAM's when mass production
gets into high gear around December." The second coastruction pro~e ct was de-
cided on in order to increase the monthly production to 400,000 units.
This project will place a new 64 K RAM mass-production line in Building C(a three-
story reinforced concrete structure) which has already been constructed. Opera-
tion of the line is scheduled to begin in June of next year.
The reason Mitsubishi decided to begin the second construction pro~ ect before
production even got underway in Building C is that the demand for the 64 R RAM,
"the first generation of VLSI," is expected to expand rapidly next year. Applica-
tion of this part to Mitsubishi's office computer, the MELCOM series, and main-
frame computer, the COSMO series, has already begun. After next year, "all Mi.t-
subishi computer memories will be converted to 64 K RAM's."
In addition to this internal demand, Mitsubishi is shipping samples to personal
computer manufacturers on the west coast of the United States and believes that
they will begin using the devices soon. That is why the company is expanding its
production capability for the 64 K RAM..
When the No 2 plant is fiuished, the production equipment in Building C of
Kumamoto No 2 plant will be capable of combined production of "64 K clasa IG's"
such as the 16 K static RAM and the 64 K EPROM (erasable and programmable read-
only memory) as weli as the 54 K RAM.
COPYRIGHT: Nihon Keizai Shimbuasha 1981
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SCIENCE AND TECHNOLOGY
AUTO MAKERS ADOPTING FRONT-WHEEL DRIVE SYSTEM
Tokyo NIKKEI SANGYO SHII~UN in Japanese 19 Jun 81 p 8
[Article by group of reporters investigating the auto industry~]
[Text] The world's largest auto malcers are actively engaged
in an "FF competition". Heretofore, most automob iles have
had the engine in front coanected with a rear-wheel drive
system. This is knoem as the FR system. Now the leading
role is about to be taken over by the FF system which has a
front-wheel drive system combined with forward engine place-
ment. Japanese manufacturers are naw completing, one after
the other, the first facilities connected with inves.tments
in the FF system. And it appears that iu the late 198Q's,
the FF car will be viewed as aa ordinary sutomobile. ~
Specialized Factories Built One After Another
Between January and this month, Mitsubishi Motor Industries, the Nissaa Motor
Company, and the Honda Motor Company all complet,ed construction and began ogera-
tion of FF parts plants. Mitsubishi previously purchased synchroaized ~oiats,
which are essential to the FIf car, from outside suppliers. In order to produce
a portion of the synchronize.d joints internally to meet the expandiag dems~d,
in January Mitsubishi completed construction of a plant capable of producing
synchronized joints for 7,000 vehicles per month (14,000 uaits) at its Mizushima
works.
Last month Honda finished constructing an addition to its syachro~ized joint plant
at its Maoka works which was started last year aad cost 5 billion qen. The pre-
vious 40,000-vehicle capacity was increased to 50,000 and fu11 operation began
immediately. This month Nissan finished const~ction of the Kamahara plaat, a
specialized plant for production of trans-axles (part combining the transmission
and axle). This plant has a site area of 7,300 square meters and a building floor
area of 4,900 square meters. Construction began the year before last and coat
17.2 billion yen. Tiie assembly line has a monthlq capacity of parts for 50,000
vehicles. A second construction pro~ect requiring approximately the same scale
of investment is scheduled to begin in March.
The Japanese manufacturers were motivated to take up the FF concept by the world's
top auto maker, GM. In connection with coming programs, the U.S. suto industry
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was surveyed and it was found that the U.S. manufacturers are going ahead with
a program of dawn-sizing and GM is carrying out a dramatic conversion to the FF
system.
Up to 1979, GM had no FF cars except for a few ].uxury models. However, after the
unveiling of the X car, one new model after another was designed with the FF
system. By 1985, 95 percent of all of the models wi11 be FF. It is planned that
the only FR cars remaining will be sports cars such as the Camaro. Although not
as extreme as GM, Ford also has a clear policy of producing more FF cars.
75 Percent of Japanese Cars by 1985
According to a U.S. think-tank survey, 35 percent of all 1981 model Japanese
passenger cars sold beginning last fall have been FF cars�. It is estimated that
_ this will grow to 50 percent by 1985, which is held to be the critical year in
world automobile industry competition. Ttee report suggests that the U.S. side
can triumph over the Japanese and make a recovery by using the FF system, which
is particularly advantageous with compact cars.
Will the FF competition proceed as the U.S. auto industry expects? Making a
bold guess, we would have to answer "no". That is because there is a good possi-
bility that by 1985, 75 percent of the Japa~ese models will have been converted
to FF. The large auto companies have a strong desire to use front-t~heel drive
and the smaller manufacturers are already moving ahead rapidly to produce FF
vehicles.
The FF programs of the Japanese automobile manufacturers include more than Nissan's
second construction pro3ect at the Kamahara plant. Last November the Tcryota
Motor Company began construction of a third plant at its Rinuura works to specialize
in FF-oriented parts such as synchronized j oints and trans-a~les. Completion is
scheduled for this October. The production capacity is not yet known, but the
plant and equipment investment has amounted to 70 billion yen in 2 years. This
is roughly twice the amount spent by Nissan for both the first and second Kamahara
pro~ects, so the capacity is estimated to be on a corresponding level.
Toyo Kogyo is expected to make its Hofu plant, now under construction, into an
_ FF vehicle plant. Although the company has not made clear what sort of vehicle
is to be produced when the Hofu plant goes into operation, most observers believe
it will be a new FF model. The new "Familia," which has been Toqo Kogyo's biggest
hit product, is an FF car. Sources connected with the company are saying: "The
next model will probably be a Capella-class passenger car which will utilize the
results obtained with the Familia." This also indicates that the iiofu plant will
produce FF cars.
Boom Period for FF Technology
"If we consider the two factors of GM's influence and th~ fashionability of pas-
senger cars, we must conclude that Che FF car wi11 become the main product of the
future world auto market. Japanese auto makers will also have to build them,"
says Nissan president, Takashi Ishihara. Neither Nissan nor Toyota has made clear
statements about their future plans for the FF car, but both companies have tacitly
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affirmed the intention of making two-thirds of their production FF cars by 1985.
Members of the management of both companies predict: "The time is coming when�~-~�
_ at least all the cars under 2,000 cc will be FF."
As can be seen from the FF trend in domestic automobiles, the FF coutest is mainly
an issue for the large manufacturera, with the exceptioa of Isuzu Motors. ~ Companies
- like Daihatsu Kogyo which concentrate on automobi].es with small ambunts of exhaust
emissions already have a product line consisting mostly of FF cars. Fu~i Seavq
Industries has been making FF cars for 15 years. .
Executive Managing Director Nagashima says: "We believed that some specialty
was necessary to compete with the big companies, so we developed the FF car.
~ Now t'he FF technology is enjoying a boom period." Today, smaller manufacttl~ers
accept the need to begin selling new FF models as a matter of course.
The advantage of the FF car, even more thaa making a larger interior possilile,
is a smooth ride. The big manufacturers must make huge investments in order to
convert from FR to FF because of their large-scale facilities. 7.'here has been
some resistance, such as the Toyota statement that "FR has its good points too."
Hawever, a rapid rate of changeover to the FF car is expected.
(70PYRIGHT: Nihon Kpizai Shimbunsha 1981
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SCIENCE AND TECHNOLOGY
BRIEFS
FACTORY ENERGY SAVING SYSTII~I--Toshiba Corp has developed an energy saving system
for large-scale plants that have independent electric generating units. Such
factories control the output of private generators or purchase electricity, as
plant operations fluctuate. The new system minimizes energy costs by linking
the following functions hierarchically: (1) long-term maximum use calculation;
(2) short-range maximum use calculation; and (3) momentary efriciency. The
company has delivered the first system to the Tomakomai plant of the O~i Paper
Co., Ltd. It uses hydroelectric/thermal power generation and can purchase elec-
tricity from other sources. It should be operable by this spring. Thereafter,
Toshiba will begin selling the system to the iron & steel, chemical, and paper
pulp indus~tries. The system installed in the Tomakomai plant controls around
twenty new and old thermal and hydroelectric power generating units and also a
frequency converter, to minimize energy costs. This includes steam control by
, optimized distribution of electricity. [Text] [Tokyo TECHNOCRAT in English
Vol 14, No 5, May 81 p 56] [COPYRIGH~: 1981~Fu~i Marketing Research Co., Ltd.]
ESTABLISHING COM-DEALING COMPANY--Seven enterprises, including the Tokyo Elec-
tric Power Co., Tohoku Electric Pawer Co., and Electric Power Development Co.,
have established a new corporation to produce and handles coal oil mixtures (COM).
This became effective April 1, and the new firm is called "Japan COM." It is
capitalized at ~�18 billion with an invested capital of ~�7 billion. Fifty-one
percent of the invested capital came from Tokyo Electric Power Co., 19% from
Electric Power Development Co., 10% from Tohoku Electric Power Co., 7% from
Mitsubishi Corp., 5% from Fuji Kosan Co., 4% from Mitsubishi Chemical Industries
Co., and 4% from Nippon Kasei Chemical Co. The plan of operation calls for the
startup of a plant in FYY984. The plant will require an investment of ~�90 bil-
lion and will be built in Fukushima Prefecture. Annual COM production will be
_ 5 million tons, and this will be used to replace fuels presently being uaed in
thermal power plants of both the Tokyo and Tohoku Electric Power Companies. COM
is a new fuel consisting of pulverized coal mixed with heavy oil, and its prac-
ticality was proven by the Electric Power Development Co. [Text] [Tokyo TECHNO-
CRAT in English Vol 14, No 5, May 81 p 56] [COPYRIGHT: 1981 Fu~i Marketing
_ Research Co., Ltd.]
_ _ . . - - -
COAL GASIFICATION POWER PLANT--The electric power industry will ~ointly develop
a coal gasification electric power plant that uses ~et floor method and is to
make a formal decision at a president's meeting by this summer. The plan will
first call for drawing up the plans for a pilot plant with a throughput of 200
tons of coal/day (equivalent to 20,OOOkWe). This plant will be operable within
2 years. The estimated cost of this plant development is about ~�22 billion,
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but it is very probable that the project will be expanded to a 100,000kW-
range large-scale demonstration plant, since this method of generating elec-.
tricity is recognized as one of the effective, new post-oil technolagiea.
'I'he Coal Mining Research Center, Japan, commissioned by the Ministry of:"In= ~
ternational Trade and Induetry, began studying a pressurized9 fluidized'floor
gasification method in fiscal 1974. Followed by the test sta~tup of 40 plants,
the Electric Power Development Co. is working on the conceptual desiga for a
1000 ton demonstration plant. In contrast, the jet floor method injec~s pul-
verized coal into a furnace where it is instantly gasified at a temperg~ure of
1200-1700�C. Molten ash is removed from the bottom of the furnace. The char-
acteristics are: (1) a wide range of coal can be used; (2) easy ahutdown and
load-follow operation. [Text] [Tokyo TECANQCRAT in Engliah Vo1 14, No 5,
May 81 p 56] ICOPYRIGHT: 1981 Fuji Marketing Research Co., Ltd.]
HEAT PIPES TO COAL UNDERGROUND CABLES--The Furukawa Electric Co. has recently
developed a system that removes heat from underground transmission lines with
heat pipes instead of cooling tubes. As demand for electricity increases in
urban areas, large-capacity electric power cables are crisscrossing the earth,
creating high temperature heat. The company has successfully manufactured the
world's first long-span heat pipe which previously was considered too difficult
to manufacture in lengths longer than lOm. The newly developed heat pipe is
about 200m long and can be laid alongaide the cables. This reduces co~struction
costs by half that of conventional cooling methods using water cooling pipea,
and also eliminates circulating p~ps and refrigeratioa unite, thus eaviag a
~ large amount of energy. Uaderground cables can generate temperatures upto around
60�C. ~Sith the heat pipes thia should drop to 45�C or less. Features of the
long heat pipe are: (1) uniform cooling of the cable; (2)~ energy saving because
circulation pumps and other hardware are not needed; (3) eased installation;
(4) good maintainability; (5) construction coste are one half that of water
cooling systems. [Text] [Tokyo TECHIdOCRAT in English Vol 14, No 5,
May 81 p 56] [COPYRIGHT: 1981 Fuji Marketing Research Co., Ltd.]
HIGH PURITY PLASMA ATTAINED--A research team of the Japan Atomic Energy Research
Institute (JAERI), working under a Japan-U.S. joint study on nuclear fusioa, has
achieved the world's highest purity plasma needed for efficient fusion power
generation. The experiment was conducted using the "Doublet III," nuclear fusion
test facility of the General Atomic Co. (GA) in San Diego, California. When
metallic impurities, such as iron and stainlesa steel, from the internal wall
of a fusion reactor enter the core plasma, the temperature dropa suddenly there-
by preventing the fusion process. This problem caused researchers in many
nations to seek ways to eliminate impurities. JAERI succeeded in reducing the
contamination of plasma by 4/5 by uaing the force of a magnetic field. Doublet
III is the world's largest TOKAMAK type experimental device. It was built in
1978 based on a deaign by Doctor Chihiro Okawa of GA. The Japanese and U.S.
governments began the ~oint research using Doublet III in Septetnber 1979 under
the "Energy Research Development Cooperation Agreement" signed in May 1979.
- This tie-up study will contfnue through fiscal year 1983, followed by more
experiments to attain the "critical plasma conditions," required for sustained
thern~onuclear reactions at the JAERI's test facility, "JT-60." [Text] [Tokyo
TECHIdOCRAT in English Vol 14, No 5, May 81 p 58] [COPYRIGHT: 1981 Fu~i Market-
ing Research Co., Ltd.]
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LASER OSCILLATION BY HYDROGEN PLASMA--The Institute of Physical and Chemical
Research has succeeded in oscillating a"plasma dynamic laser" that could be
used to measure temperatures in nuclear fusion reactors and in space. In the
tests, a hydrogen plasma ~et was used to cause an infrared laser to oscillate
for abouttwo-thousandths of a second. E::ieting lasers are usually oscillated
in solid, liquid, and gaseous states; the fear in plasma, called "the faurth
stage of substance," will add another feature to lasera. The infrared laser
has a wavelength of 1.88u and is expected to be applicable to instrumentation.
One probable use is the measurement of hydrogen fuel for fusion reactors. ~
[TextJ [Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 58] [COPYRIGHT:
1981 Fu~i Marketing Research Co., Ltd.J
REACTOR VESSEL COVER IMPROVEMENT--Three electric power firms and Mitaubishi
Heavy Industries have 3ointly developed an improvement technique for covers of
reactor vessels, and the three power companies have decided to use it hereafter
in commercial reactors. Nuclear power plants must undergo annual inspeetions;
this technical development was intended to shorten the inspection period and to
reduce the radiation exposure of plant workers. The four firms have cooperated
in developing the integrated structure of the vessel cover and the cooling duct
of the control rod drive mechanism near the cover. In a full-scale model plant
used for operationability tests, the uncovering procedure required only 6-7
days, compared with the current 10 days. [Text] [Tokyo TECHNOCRAT in English
Vol 14, No 5, May 81 p 58]~ [COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd.)
GIANT EY.ECTRON LINEAC--The National Laboratory for Hi~h Energy Physics of the
Ministry of Education is building one of the world's largest 'light factories,"
a radiation light experimental facility�capable of producing a variety of light
waves ranging frmn visible light to X-rays. Operation i~ scheduled to begin
next spring, ancl the building to house the :~uge 400m long electron lineac has
already been built, allowing the installation of some equipment. Performance
te.;ts for the f.a~i3it; :Jill start in late "~ovember. This "light f^ctory" will.
permit molecules and atoms to be observed in wa3�s that to date have been hard
to do. This will also allow further interpretation of materials structure and
application in industrial technologiea, such as VLSI production. The construc-
tion of the much awaited radiation light experimental facility began in 1978 at
a cost of about ~�18 billion. The facility includes the 400m-long electron
lineac, the world's secand largest, coupled with an elliptical electron storage
ring (ma~or axis: 68m; minor axis: SOm) and a variety of ineasuring instrwnents.
[TextJ [Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 58] [COPYRIGHT:
1981 Fu~i Marketing Research Co., Ltd.]
RADIATION-RESISTANT 7~IA--The Japan Atomic Energy Research Institute in collabora-~
tion with JEOL, Ltd., has developed and recently begun full-scale operation of a
shielded X-ray microanalyzer (74~fA) that can analyze elements or observe highl,y
radioactive core materials. The apparatus can handle nuclear fuels of up to
10 curies irradiated in reactors whereby containing much fission products. It
is the first attempt in the world to build an XMA with unique shielding that
can fully protect the operator and the detector of the device from radioactive
specimens. To remove possible contamination from the specimens, components such
as the shield, electro-optical system, X-ray spectroscope, sample chamber, and
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sample stage are completely independent to facilitate dismantling and assembling
of blocks required for decontamination. Moreover, samples are treated with ultra-
sonic cleaning and are coated to minimize contamination. The device ie expected
to provide excellent data previously unavailable in the field of reactor core
research. [Text] [Tokyo TECHI~IOCRAT in English Vol 14, No 5, May 81 p 5~]
[COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd.] .
HEAVY GAS OIL HOT TRANSFER SYSTFM--Taisei Corp. has recently developed a hot trans-
fer syetem for heavy gas oil using triple piping. The system conaists..o~ ap,inner
pipe for circulating heated oil, a middle pipe for heavy gas oil and an outer pipe
for n?aintenance and thermal insulation. Normally, the entire piping syatem is .
filled with Middle East crude oil which has a high solidification point. When
starting transfer, the inner pipe is filled with heated oil (around 75�C) to heat
the entire piping and then heavy gas oil is delivered from the heated tanker to
heavy-oil ahore tanks. Because heating causes the inner and the middle gipes to
expand and protrude by about 60cm at each of both ends of the pipeline, the system
is so designed as to allow the middle and inner pipes to slide freely in the outer
pipe with the aid of special ahoes (slipping pads) provided between the outer and
the middle pipes. The system has been developed particularly for heavy crude
oil (Taching crude oil solidifiea at around 35�C) which is expected to be imported
into Japan in increasingly larger quantities. [Text] [Tokyo TECHI~IOCRAT in English
Vol 14, No 5, May 81 p 68] [COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd.]
ROBOTS ON BICYCLE PRODUCTION LINES--Yamaha Motor Co. has introduced robote of
their own development into their bicycle production linee at their'Head Office
plant, achieving good results in production rationalization. A bicycle assembly
line not only produces different models in succession but also deals with diffi-
cult to handle small products. Thus, it has been considPr~d difficult to auto-
mate. Under these circumstances, Yamaha has developed "CAI~ (computer sided
manufacturing equipment) No. 1", a multiarticulated assembling robot, and adopted
it completely on its bicycle assembly line. This is the fire.t�attempt by the
bicycle manufacturing industry in Japan. CAI~ No. 1 can work'with higher accu-
racy and higher speed than human arms and hands, and 50 units of the robot are
equal to 30 assembly wo�rkers. Also, it has another feature by being sufficiently
universal to aerve assembly lines for all of Yamaha products by simply changing
programs for work procedures. [Text] [Tokyo TECI~IOCRAT in English Vol 14,
No 5, May 81 p 68] [COPYRIGHT: 1981 Fuji Marketing Research Co., Ltd.]
LIQUID-HYDROGEN PiJI~--Prof. Shoichi Kohama of Musashi Institute of Technology
has developed a hydrogen engine system with an output 26~ higher than that of
gasoline cars. This has been achieved by establishing technology for manufac-
turing an in~ection pump with high environmental resistance, which in~ecta liquid
hydrogen as cold as -253�C into an engine. Liquid hydrogen is extremely cold and
has low viscosity. To manufacture a pump for in~ecting liquid hydrogen into an
engine, therefore, involves such problems as follow: (1) it does not allow the
use of any lubricant; (2) it ie likely to leak; and (3) it can hardly draw up
liquid hydrogen because the boiling point of liquid hydrogen is dependent on
variations in pump pressure, causing the liquid hydrogen to boil in the pump.
The in~ection pump newly developed has solved theae difficulties by using a
material camposed of a teflon reain and a copper alloy. It discharges liquid
hydrogen with lOkg per cm2 and withstands 1,200 cycles per minute operation.
' 125
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~ ~ Running tests with this pump installed in a 1,100cc engine have proved that no
backfire, nor do preignition and knocking occur, and that the maximum output is
26% higher than that of and equivalent gasoline engine. The development of this
liquid-hydrogen pump indicates that 'las far as engines are concerned, hydrogetl
cars have been completed." [Text] [Tokyo TECHNOCRAT in English Vol 14, No 5,
May 81 p 68] [COPYRIGHT: 1981 Fu~i Marketing Reaearch Co., Ltd.]
CODEC LSI--NTT has developed a small-scale and high perforaAance CODEC LSI.
CMOS technology is used to mount all the necessary circuits on one chip of size
4.35x7.Omm and to include it in a normal 16 pin DIP case. The new circuit con-
figuration method hae been developed to reduce the number of devices and circuits
because of incorporation in a single chip. Special consideratio~n to design has
been made to prevent problems auch as interference between the analog and digital
portions and noise, etc. For achievement of high performance, new circuits have
been developed by uaing the analog CMOS technology on the amplifier to achieve a
reduction of power requirements ~nd to redu~~ the number of pieces from 20 to 15.
The powerdown circuit is added to reduce power requirements if no input aignal
exists. This reaults in 35mW, which is about one half of the conventional power
requirement. (Text] [Tokyo TECHIJOCRAT in English Vol 14, No 5, May 81 p 71]
[COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd.]
COMPUTER NETWORK--The Agency of Industrial Science and Technology of MITI has
started a study for a computer network program in which the Information Center
of Tsukuba Science City and seven local research institutions of the Agency are
linked via a co~nunication satellite. A network using optical fibers hae already
been established between nine ma~or research insCitutions of Science City.
Furthermore, a new work for a wider area'covering local institutions will use a
connnunication satellite as well. The Agency also expecta that the progress of
this program will clarify technical problems underlying a computer network
formation using a satellite, and find other areas of application for the same
kind of technology. ~Text] [Tokyo TECHI~IOCRAT in,English Vol 14, No 5, May 81
p 72] [COPY.RIGHT: 1981 Fu~i Marketing Research Co., Ltd.]
PRACTICAL USE OPTICAL FIBER--NTT will uee on a practical basis an optical fiber
method for inter-office transmiesion lines with a total length of 110km in
respect of 12 sections of Tokyo, Osaka and other areas. It will use 32Mb/s and
100Mb/s medium capacity methods, in which new aspects of technology, such as
long wave length elements of about 1.3um, as well as optical fiber manu�actured
by the VAD method, will be employed. NTT is expected to start construction in
March, 1981 and complete it at the end of the year for serviae commencement.
[Text] (Tokyo TECHNOCRAT in Engliah Vol 14, No 5, May 81 p 72] [COPYRIGHT:
1981 Fu~i Marketing Research Co., Ltd.]
ARTIFICIAL 'EYE' DEVELOPMENT--Nakano, assistant Prof. at the General Laboratory
of the Faculty of Engineering of the University of Tokyo has atarted to develop
an artificial "eye" which can catch a moving ob~ect and see what shape it is.
He has already developed an eye which.can catch a moving ob~ect and answer,
through learning, what it is. This eye mainly coneista of, 1) 121 photo-tran-
sistors instead of the retina which nor~aally catches ob~ects, 2) elements which
can perceive 9 kinds of movement instead of nerves and simple cells, 3) a cir-
cuit coneisting of about 6000 elements instead af compllcated and ultra-compli-
cated cells which catch meandering and clockwise movement and, 4) a learning
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machine (percention). On the basis of these achievements, Nakano has plans to
develop an eye, similar in function to the human eye, which dietinguishes shapes
of objecte, di~plays answera as to how they move and learns cor~ected errora.
[Text] [Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 74] [COPYRIGIi~:
1981 Fuji Marketing Research Co., Ltd.] ~ ,
INFOItMATION RETRIEVAL--The Data System Laboratory of the Engineering Department
of Hiroshima Univeraity has developed and put into operation a pilot syatem fs~r
a relational data base model which is capable o� more advanced information
retrieval. The principle of the syetem consist of coding in advance of the re-
lations between data items in the unit of attributes. Two dimeagional signs
nearly located are aeaigned to closely related iteme. The system is desicgnad
to make allowances in terma of "approximately" �or individual requirements and
to show all iteme which meet a number of requirements evenly, to enab~e~pzeferred
items to be selected from among them. For inquiry, the system usea QSE, a kind
of table syetem, for ease of use. For ambiguous iteme, the syetem is deeigned
to learn the level of ambi.guity the uaer feele sensitively via vieual expreseions.
Becauae in the deaign the laboratory incorporated a special camputer system for
the proceasing of the ambiguous expresaions, a apecial-purpose computer (data
base machine) for the data baee is required in order to obtain proper process-
ing capacity. Thus, the laboratory intends to develop a general-purpose data� i
base management system (DBMS) which can be uaed ia conventional general-purpose
:omputers, while at the eame time developing a special-purpose data base machine.
[Text] [Tokyo TECHI~TOCRAT in English Vol 14,~No 5, May 81 p 74] [COPYRIGAT:
1981 Fu~i Marketing Research Co., Ltd.] ~
R&D PROCESSOA--Fujitau has recently developed "PACOM 4940L Laboratory System,"
a proceasor designed specifically for research and development. The processor
not only has FORTRAN77 prepared as a development language and can debug in a
conventional manner but also uses a multiple imaginery memorization system.
This enabl~a the user to use it without being conscious of the program size and
easily perform technical canputations. Also, the proceasor can be used for
inatrumental control and can collect analog signals into 4940L magnetic disks
continuously for 100 sec. at 100kIiz, max. Thus, it can record at high speeds
varioua types of test data, such as noise and vibration, and is capable of
analysie using FORTRAN progrems. With the processor now available, the company
is prepared to make a full-scale launch into the laboratory and design automa-
tion markets. [Text~ [Tokyo TECI~IOCRAT in English Vol 14, No 5, May 81 p 74]
[COPYRIGKT: 1981 Fuji Marketing Research Co., Ltd.]
VERY LARGE COMPUTEIt SALES--If the 1980's is the age of electronics, the eesence
of the electronics induatry at the highest level ie very large computers.
Hitachi's "M-280H Proceseor" is one, IBM's "3081 procesaor" ie another and
Nippon Denki's "ACOS 1000," still another. Very large computers are equipged
with technically etrikingly improved VLSI elemente as the central parts and are
the producte of several yeara of etrenuous research and development efforte by
~ the "brain groups" of crnaputer companies. NEC hae already obtained an agreement
to deliver product No 1 of ita "ACOS 1000" to Tohoku Univeraity. Japan IBM hae
already received orders for more than 100 units of the "3081 processor" and in-~
tends to recommend a lottery to determine the actual purchaser of product No 1.
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In this connection, Hitachi has lately received an order for product No 1 of
its "M-280 H processor" from Tokyo University, an establishment ranking top in
academic circles. In addition, Fu~itsu is developing, at full speed, "S," a
prototype. Now, with the activities of this company involving its internationgl
selling power for very large computers, a sales war has almoet begun. [Text]'
(Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 74] [COPYRIGHT: 1981 Fu~i
Marketing Research Co., Ltd.] ~
FUJITSU M SERIES WITH 64K--Fu~itsu has recently announced that the capacity of
the main mesaories of the smaller "FACOM V850" and all models of the general-
purpose computer "FACOM M seriea" have all been replaced with a 64K bit LSI.
This is to meet recent rapidly increasing de~nanda from users for the enlarge-
ment of inemory capacity as well as because of decreasing costs of 64K memories,
due to the company's starting masa production at the level of over 150,000
units. Computer makera in general are gradually replacing 16k with 64k memories,
� while hesitating to attempt complete replacement because of the atill coatly 64k
memories. Under these circumstances, Fujiteu's decision is a daring one worthy
of note. [Text] [Tokyo TECHIdOCRAT in English Vol 14, No 5, May $1 p 74]
[COPYRIGHT: 1981 Fu,ji Marketing Research Co., Ltd.]
SCHEMA DESIGNING-DRAFTING SYSTEM--Mitsui Engineering & Shipbuilding has recently
developed "SCHEMA" Designing and Drafting System," a conversational type soft-
ware package. The SCHEMA is a low-coet conversational type system which utilizes
an ARS80 graphic terminal (see Photo [not reproduced]) previously developed by
th~ company as a graphic dieplay. The system has introduced the concept of
"deaign model" in order to correctly describe deaigning information mainly con-
sisting of f igures and has a data base establiehed which can be utilized not only
for the drafting of design drawings but also widely for estimation, arrangement
and production. Again, different from conventional CAD syeteme, it ie a port-
able software unit which does not put one computer model ahead of others. Also,
it has the potentiality of expansion as it enables the user to set in a specific
system, because a model handler, which permita eaey access to the data base, has
been installed. [Text] [Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 74]
[COPYRIGHT: 1981 Fuji Marketing Research Co., Ltd.]
HIGHLY EFFICIENT ELECTRON MICROSCOPE--Science and Technology Agency will start
development of a highly efficient electron microacope with a resolution power
which will enable direct observation of amall atome such ae oxygen, nitrogen,
- and carbon. The resolution power of the currently most powerful electron micro-
scope ia 2~,, and it can thus clearly resolve only he~vy metal atoms euch as iron
and tungsten. Therefore, it ie neceaeary to improve the resolution power to
more than double the current power in order to observe small atoms auch ae ox~gen
and nitrogen. For enhancement of the reeolution power, it is required to signif-
icantly increase the acceleration voltage of the electron beam and to develop a
lens with smaller aberration and an electron beam source with higher luminosity
and interference. The Science and Technology Agency will invest ~f67M over two
years starting this year to conduct a feasibility study of a high perforn?ance
electron microscope centering around a auper-conductive lens electron microecope
as a pre-survey, together with an electron beam layer, lene system, material
stage, image recording, and element study of the analyais system. [Text] [Tokyo
TECHNOCRAT in Engliah Vol 14, No 5, May 81 p 76] [COPYRIGHT: 1981 Fuji Market-
ing Research Co., Ltd.]
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DISTORTION MEASUR'XMENT INVERSION GAUGE--The National Aeroa.pace Laborato~}i of:~,
Science and Technt~logy Agency has developed a new type of dietortion gauge
"Inversion Gauge" that can make almost any measurement within an error of t40u
if t~mperature is below 300�C. Since the conventional gauge is used assuming
that 1.0 pieces per set are the eame, an error occure due to unequality,of ~hose
pieces. It ie common that the error range is tlu at 1�C. In a high tempera-
ture environment, an erro~ of 200U was observed. The i~tveraion gauge developed
by National Aerospace Laboratory can be reused to me~sure an oti~ect after
the gauge is brought into a furnace and removed. The gauge can be pasted with
adhesive, but once the surface is pasted, it canriot be reused. Tlzue, it is re-
versed for further use, but the general distor~ion gauge cannot be turned over
for use because the upper and lotaer parts are not sy~mmetrical. The 1abo~'s~tory
has begun to practically uae the gauge for the flap test of a short-dista~ice
take off and landing plane. The results are.good and the gguge can be�expe'cted
to be used widely in various fields such as cars and compound mgterial. [Text]
[Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 76] [COPYRIGHT: ~981 Fu~i
Marketing Research Co., Ltd.]
INFRARED INTERFEROMETER--The NaCional Research Laboratory of M2t~ology has
succeeded in trial production of an infrared in~erference leitgth-meaeuring unit
by the matching method that uses helium-xenon laser, simulta~teously oscillatirig
with two wavelengths, 3.51 and 3.37u� Conventional interference length-measure-
ment devlces use a cadmium or nfercury lamp, and only 20 to 30 centimeters in
length can be measured. 5 to 10 minutes are required for each measurement. The
interferometer developed by th~ laboratory aimultaneously oacillates the two-
wavelength infrared beam of helium xenon laser, and acane with the PZT device
the phase of the interferometer drawn on a measured object by the bemn with a
different wavelength for reading. The 3-meter long block cage can be meaeured
in 20 seconda, to a preciaion of 1/100u. The infrared laser can measure iri a
wide range of environmenta, and can therefore be expected to be applied in the
induatrial sector. [Text] [Tokyo TECHNOCRAT in Engliah Vol 14, No 5, May 81
p 76) [COPYRIGHT: 1981 Fu~i Marketing Reaearch Co., Ltd.]
MICROWAVE RADIATION METER--Prof. Tsutomu Suzuki of the Applied Electronic Engi-
neering Department at the Univeraity of Electro-Comu~unication has developed a
new type of microwave radiation meter. All materials in nature have a tempera-
ture, and emit to outside energy meeting the temperature. The microwave radia-
tion meter is a sensor that detects the coinponents of the microwave ares in thia
radiation energy. The newly developed unit is called the "2 Calibrator-1 Refer-
ence Method," and is a Dicke type. A Dicke type of microwave radiation meter
generally accompanies a gain variation which becomea a meas~rement error. How-
ever, the new unit is designed for better temperature resolution, stability, and
accuracy witha.ut being affected by incorporating two noise sources for calibra-
tion if a gain varies. Concretely, noise sources for calibration of both high
and low temperaturea ar~a used. The microwavea radiated from these noise.sourcea
are first detected, and immediately after that, the microwave from an ob~ect
- under observation is detected via the antenria. If it is made within the tempera-
ture range of both of the noise sources, the measured value for lun~3.nosity and
temperature of these sourcea becomea atill, and luminosity and temperature of
an object under observation are thus obtained. [Text] [Tokyo TECHI~TOCRA~ in
English Vol 14, No 5, May 81 p 76] [COPYRIGHT: 1981 Fu~i Marketing Research
Co., Ltd.]
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PRACTICAL VOLTAGE STANDARD UNIT--Yokogawa Electric Works has developed a voltage
standard unit by using the Joaephson effect element. In general, factory volt-
age standards are based on standa-rd batteries retained at each factory, calibsated
by the Josephson voltage standard unit (a national standard). The principle of
the new unit is the same as that of a national standard, and its precisfon is
limited to 1/100M for small aize, easy operation, and simple maintenance. [Text]
[Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 77] [COPYRIGH~: 1981 Fu~i
Marketing Research Co., Ltd.]
INTELLIGENT SPECTRUM ANALYZER--Takeda Riken Industry Co. has developed ~he first
"Intelligent SPEANA TR4172" in the world that incorporates functions of both
spectrum and network analyzers. This analyzer combines in one unit the functions
of the network analyzer such as phase measurement and group delay measurement,
as well as the conventional functions such as spectrum analyzer, digital frequency
measuretnent, and measurement of transmission characteristics. As SPEANA, a fre-
quency measuring range of 5Q to 1800Hz, and a mechanical dynamic range of 90dB,
are realized. In addition, 95dB is recognized in the dynamic range of a logarith-
mic amplifier, and the frequency response is �0.7dB af ter correction. [Text]
[Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 77] [COPYRIGHT: 1981 Fu~i
Marketing Research Co., Ltd.]
VACWM RESIDUE CRACKING PFODUCTION--The long-run (35-day) test of an atmoapheric
residue has been campletec~ by using a pilot plant for heavy oil cracking having
been propelled as one of the ma~or pro3ects of the Ministry of Induatrial Trade
and Industry. A test using vacuum residue as a raw material will be started.
The plant can treat 120 tons of raw material a day, and the teat for producing ~
olefin was started last spring. The product distribution obtained from atmos-
pheric residue closely corresponded to that from naphtha cracking. However, tlie
yields of ethylene, propylene, B-B.fraction and gasoline become low and cracked
light oil and pitch are produced in large amounta when vacuum residue is used.
Therefore, there are many problems in the operation, and the test results of~
vacuum residue cracking are anticipated. [Text] [Tokyo TECHNOCRAT in English
Vol 14, No 5, May 81 p 79] [COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd.]
COMPOUNDING CARBON FIBER--Toshiba Chemicals has recently established a technique
for compounding carbon fiber with epoxy resin, polyester resin, and polyimide
resin, and has begun to eatablish a market. This activity answers a wide variety
of needa of users. The company has devoted its efforts to the development of �
new techniques and new materials, and the demand is expected to build up rapidly.
This technique has already been adopted partly for medical equipment; and also
is expected to be w~dely used from now as a replacement of steel, diecast items,
and asbestos, because carbon-fiber-reinforced-plastic material is light, and
tiough, and has superior moldability. As recent examples, one is a hotel bath
unit which is a safe waterproof double structure, the design is unique and the
maintenance is easy, another ia a bath unit for ahips, which satisfies Japan
Ship Society Standards, and also for use as aircraft containers replacing the
use of aluminum. [Text] [Tokyo TECHNOCRAT in Engliah Vol 14, No 5, May 81 p 80]
[COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd.] �
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VINYL CHLORIDE PROCESS HELP--Kanegafuchi Chemical Industries has recently devel-
oped and started marketing a pro~.ess helping agent for acryl based vinyl chloride.
When added in small quantities to various types from hard to semi-hard and soft-
vinyl chlorides in forming processes, the agent is able to improve primary aad
secondary processing qualities and appearance of products, largely without affect-
ing the chemical and physical properties of the vinyl chloride. In detail, the
agent accelerates gelation, achieving the following effects: 1) it eliminates
unevenness of paste, enabling products to provide their full properties; 2) it
enables fillers to be included in larger quantities; 3) it permits complicated
patterns and helps edging in profile extrusion. It also has the advantage of
permitting long running and stable production, and is considered to be helpful
in preventing surging, ~etting, flow marks and silver streaks. [Text] [Tokyo
TECHNOCRAT in English Vol 14, No 5, May 81 p 80] [COPYRIGHT: 1981 Fu~i Market-
ing Research Co., Ltd.]
SEMICONDUCTOR PACKAGE MATERIALS--As demands increase for semiconductors such as
IC's, conductive polymers are attracting attention as packaging materials. Such
substances as ethylene vinyl acetate copolymer (EVA), polystyrene (PS), polypro-
pyrene (PP) and polyurethane foam (PU) which are made antistatic by an inclusion
of carbon black or interfacial active agents are used for such packaging mater-
ials. Integrated circuits including LSI's have low operational voltage--occa-
sionally less than IV--and suffer from effPcts of static electricity which can
be caused during their transportation. Static electricity, at the lowest level,
thus generated may cause erroneous operations and damage to circuits. Among
IC's, MOS-IC's (metal oxide semiconductor IC's often used in desk computers) in
particular are apt to be affected by static electricity. This is because sta-
tic electricity accumulates in the insulation between the se~miconductor sub-
strates and the metal layers. If high-voltage static electricity is generated,
it damages the insulation, damaging the products. Semiconductor packaging
materials are generally made by including carbon black in resins. They are
annually recording a nearly 20% growth thanks to the prosperity of the elec-
tronic age. [Text] [Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 80]
[COPYRIGHT: 1981 Fu~i Marketing Research Co., Ltd.]
LARGE-SCALE INTERFERON PRODUCTION--Hayashibara Biochemical Laboratories, Inc.
developed a unique process for large-scale production of interferon. The pro-
cess uses hamsters to obtain viable live cells. The company has succeeded in
developing interferon at low cost, after five years of research and development.
The system is based on the findings that large quantities of viable human lympho-
blast cells are obtainable by transplanting human cancer cells into animals such
as hamsters. More specifically, new born hamsters, less than 24 hours old,
specifically bred and adapted for this purpose, are transplanted subcutaneously
with human lymphoblast cells, while re~ection by the animals is suppressed by
in~ections of an immunosuppressant, anti-lymphocyte serum, and raised for three
to four weeks under sterilized conditions until the transplanted cells grow to
tumors, of 25-30 grams, approximating the animal in weight. An average yield
of 50 million IU (international units) of interferon is obtainable from one
hamster. [Text] [Tokyo TECHNOCRAT in English Vol 14, No 5, May 81 p 83]
[COPYRIGHT.: 1981 Fu,ji Marketing Research Co., Ltd.]
CSO: 4120/288
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